The investigation of thermal properties and melting behaviour of Sn78Bi22 solder alloy
Open Access
- 1 January 2026
- conference paper
- Published by Centre for Evaluation in Education and Science (CEON/CEES)
- No. Chemistry,,p. 185-188
Abstract
In the present study, the Sn78Bi22 alloy was investigated as a potential solder material. The study focused on the evaluation of thermal diffusivity and thermal conductivity over a defined temperature range, differential scanning calorimetry (DSC) analysis, and an assessment of soldering behavior through measurements of contact angle, spreading area, spreading ratio, and intermetallic compound (IMC) layer thickness. The investigated alloy exhibited reduced thermal diffusivity and thermal conductivity compared with literature data for pure Sn. DSC analysis indicated a decrease in melting temperature compared with pure Sn reported in the literature, resulting from the addition of Bi. Soldering behavior was evaluated as favorable, characterized by a thin IMC layer, a low contact angle on a Cu substrate, and high spreading ratio and spreading area. Based on these results, the Sn78Bi22 alloy shows potential for lead-free soldering applications.Keywords
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