Modeling of chemical-mechanical polishing: a review
Authors:
- G. NanzGNG. Nanz
- L.E. CamillettiLCL.E. Camilletti
- 1 January 1995
- journal article
- review article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Semiconductor Manufacturing
- Vol. 8 (4) , 382-389
Abstract
No abstract availableKeywords
This publication has 8 references indexed in Scilit:
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- Chemical‐Mechanical Polishing for Fabricating Patterned W Metal Features as Chip InterconnectsJournal of the Electrochemical Society, 1991
- A Two‐Dimensional Process Model for Chemimechanical Polish PlanarizationJournal of the Electrochemical Society, 1991
- Application of Chemical Mechanical Polishing to the Fabrication of VLSI Circuit InterconnectionsJournal of the Electrochemical Society, 1991
- Chemical processes in glass polishingJournal of Non-Crystalline Solids, 1990
- Flächentragwerke1959