Thermal Shock Cycles Optimization of Sn-3.0 Ag-0.5 Cu/OSP SolderJoint with Bonding Strength Variation for Electronic Components
Authors:
- 식홍 원식원식홍 원
- 성김 휘성휘성김 휘
- 석송 병석병석송 병
- 배김 광배광배김 광
- 1 March 2007
- journal article
- Published by The Materials Research Society of Korea in Korean Journal of Materials Research
- Vol. 17 (3) , 152~159
Abstract
No abstract availableKeywords
This publication has 9 references indexed in Scilit:
- Evaluation of displacement rate effect in shear test of Sn–3Ag–0.5Cu solder bump for flip chip applicationMicroelectronics Reliability, 2006
- Evaluation of solder joint reliability in flip-chip packages during accelerated testingJournal of Electronic Materials, 2005
- Interfacial reactions between Sn–0.4Cu solder and Cu substrate with or without ENIG plating layer during reflow reactionJournal of Alloys and Compounds, 2005
- Solid state interfacial reaction and joint strength of Sn–37Pb solder with Ni–P under bump metallization in flip chip applicationJournal of Alloys and Compounds, 2005
- IMC morphology, interfacial reaction and joint reliability of Pb-free Sn–Ag–Cu solder on electrolytic Ni BGA substrateJournal of Alloys and Compounds, 2005
- Interfacial reaction and mechanical properties of eutectic Sn–0.7Cu/Ni BGA solder joints during isothermal long-term agingJournal of Alloys and Compounds, 2005
- The reactions between electroless Ni-Cu-P Deposit and 63Sn-37Pb flip chip solder bumps during reflowJournal of Electronic Materials, 2000
- Effect of current crowding on vacancy diffusion and void formation in electromigrationApplied Physics Letters, 2000
- Reactive isothermal solidification in the Ni–Sn systemActa Materialia, 1998