Fracture and Crack Healing in (U,Pu)C
Authors:
- 1 March 1979
- journal article
- Published by Wiley in Journal of the American Ceramic Society
- Vol. 62 (3-4) , 128-133
Abstract
The fracture stress of several types of (U,Pu)C 1+x pellets was measured from 25° to 1200°C at a fixed strain rate. The fracture stress increases with temperature and the fracture is predominantly transgranular up to ≊500°C. At >500°C, the fracture stress decreases as the temperature increases and the fracture becomes increasingly intergranular. The flow stress, σ 0.002 , decreased rapidly between 1000° and 1600°C. An investigation of the stress dependence and kinetics of crack healing at 1300° to 1600°C indicates that strength may recover by a volume‐diffusion‐controlled mechanism.Keywords
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