Methods for Durability Testing and Lifetime Estimation of Thermal Interface Materials in Batteries
Open Access
Abstract
To ensure sufficient thermal performance within electric vehicle (EV) batteries, thermal interface materials (TIMs), such as pastes or adhesives, are widely used to fill thermally insulating voids between cells and cooling components. However, TIMs are composite materials that are subject to degradation over the battery’s lifetime. Using TIMs for battery applications is a new and emerging topic, creating the need to rapidly acquire knowledge about appropriate lifetime testing and evaluation methods, in close collaboration with the battery manufacturers. This paper reviews suitable methods for durability testing as well as basic modeling approaches which allow for the transfer of laboratory results to the longtime behavior of interface materials during a vehicle’s lifetime.Keywords
This publication has 20 references indexed in Scilit:
- Assembly and Reliability Challenges for Next Generation High Thermal TIM Materials2017
- Thermal performance of TIMs during compressive and tensile stress states2017
- Oil bleed from elastomeric thermal silicone conductive padsFrontiers of Chemical Science and Engineering, 2016
- Quantification of cracked area in thermal path of high-power multi-chip modules using transient thermal impedance measurementMicroelectronics Reliability, 2016
- Advanced thermal management for temperature homogenization in high-power lithium-ion battery systems based on prismatic cells2015
- Reliability of thermal interface materials: A reviewApplied Thermal Engineering, 2013
- Drainage-Induced Dry-Out of Thermal GreasesIEEE Transactions on Advanced Packaging, 2008
- Effects of antioxidants and the solid component on the thermal stability of polyol-ester-based thermal pastesJournal of Materials Science, 2007
- Thermal Interface Materials: Historical Perspective, Status, and Future DirectionsProceedings of the IEEE, 2006
- An accelerated reliability test method to predict thermal grease pump-out in flip-chip applications2002