Residual stress evolution regularity in thermal barrier coatings under thermal shock loading
Authors:
- Ximin ChenXCXimin Chen
- Zhanwei LiuZLZhanwei Liu
- Yang YangYYYang Yang
Open Access
- 1 January 2014
- journal article
- Published by Elsevier in Theoretical and Applied Mechanics Letters
- Vol. 4 (2) , 021009
Abstract
Residual stress evolution regularity in thermal barrier ceramic coatings (TBCs) under different cycles of thermal shock loading of 1100°C was investigated by the microscopic digital image correlation (DIC) and micro-Raman spectroscopy, respectively. The obtained results showed that, as the cycle number of the thermal shock loading increases, the evolution of the residual stress undergoes three distinct stages: a sharp increase, a gradual change, and a reduction. The extension stress near the TBC surface is fast transformed to compressive one through just one thermal cycle. After different thermal shock cycles with peak temperature of 1100°C, phase transformation in TBC does not happen, whereas the generation, development, evolution of the thermally grown oxide (TGO) layer and micro-cracks are the main reasons causing the evolution regularity of the residual stressKeywords
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