Adhesive properties study on the interfaces of AlN and metal of Pd, Ag and Cu
Authors:
- 30 December 2010
- journal article
- research article
- Published by Springer Nature in Science China Technological Sciences
- Vol. 54 (1) , 11-14
Abstract
No abstract availableKeywords
This publication has 4 references indexed in Scilit:
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- Reaction kinetics and mechanical properties in the reactive brazing of copper to aluminum nitrideJournal of Materials Science, 2006
- Surface Preparation of Aluminum Nitride for Metallization: Effect of Temperature on Surface ReactivityMaterials and Manufacturing Processes, 2005
- Alternative approach to electroless Cu metallization of AlN by a nonaqueous polyol processApplied Physics Letters, 1997