A cyclic viscoplastic and creep damage model for lead free solder alloys

This publication has 15 references indexed in Scilit:

• Experimental and numerical investigation on the reliability of leadfree solders
  Engineering Fracture Mechanics, 2008
• Numerical integration and FEM-implementation of a viscoplastic Chaboche-model with static recovery
  Computational Mechanics, 2005
• Microstructure and creep behaviour of eutectic SnAg and SnAgCu solders
  Microelectronics Reliability, 2004
• Some mechanical properties of Sn–3.5 Ag eutectic alloy at different temperatures
  Journal of Materials Science: Materials in Electronics, 2004
• Low Cycle Fatigue Testing of Ball Grid Array Solder Joints under Mixed-Mode Loading Conditions
  Journal of Electronic Packaging, 2004
• Viscoplastic Deformation of Lead-Free Solder Alloy - Experiments and Simulations
  Key Engineering Materials, 2003
• A Damage Coupling Framework of Unified Viscoplasticity for the Fatigue of Solder Alloys
  Journal of Electronic Packaging, 1999
• Inelastic deformation of porous materials
  Journal of the Mechanics and Physics of Solids, 1989
• Void Nucleation Effects in Biaxially Stretched Sheets
  Journal of Engineering Materials and Technology, 1980
• An improved pegasus method for root finding
  BIT Numerical Mathematics, 1973