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A numerical method for predicting intermetallic layer thickness developed during the formation of solder joints
Publication with shared reference
10.1007/bf02666735
Home
Publications
A numerical method for predicting intermetallic layer thickness developed during the formation of solder joints
Publication with shared reference
10.1007/bf02666735
Publications with shared reference:
A numerical method for predicting intermetallic layer thickness developed during the formation of solder joints
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