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Constitutive behaviour of lead-free solders vs. lead-containing solders-experiments on bulk specimens and flip-chip joints
Publication with shared reference
10.1109/ectc.2001.927900
Home
Publications
Constitutive behaviour of lead-free solders vs. lead-containing solders-experiments on bulk specimens and flip-chip joints
Publication with shared reference
10.1109/ectc.2001.927900
Publications with shared reference:
Constitutive behaviour of lead-free solders vs. lead-containing solders-experiments on bulk specimens and flip-chip joints
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