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Publications
Encapsulant thickness options as a factor to impact thermal performance of Chip-on-Board (COB) light emitting diodes
Publication with shared reference
10.1109/itherm.2016.7517550
Home
Publications
Encapsulant thickness options as a factor to impact thermal performance of Chip-on-Board (COB) light emitting diodes
Publication with shared reference
10.1109/itherm.2016.7517550
Publications with shared reference:
Encapsulant thickness options as a factor to impact thermal performance of Chip-on-Board (COB) light emitting diodes
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