Tadahiro Ohmi
Current Organizations / Institutes
The organizations/institutes from the scholar's latest article
Research Subjects
Research Interests
Tadahiro Ohmi has a total of 94 co-authors. Here are the top co-authors by number of shared publications:
- Akinobu Teramoto
Hiroshima University
25 shared publications Shigetoshi Sugawa
New Industry Creation Hatchery Center, Tohoku University, Sendai 980-8579, Japan
21 shared publicationsMasaki Hirayama
Tohoku University New Industry Creation Hatchery Center Sendai 980-8579, Japan
6 shared publicationsRihito Kuroda
5 shared publications- Takenao Nemoto
Tohoku University, Sendai, Japan
5 shared publications Tomoyuki Suwa
New Industry Creation Hatchery Center, Tohoku University, Aoba-ku, Sendai, Miyagi 980-8579, Japan
5 shared publications
Latest Publications
- Open Access
- 16 June 2015
- Published by The Electrochemical Society in ECS Journal of Solid State Science and Technology
- Vol. 4 (8) , N96-N98
Structural Analyses of Thin SiO2Films Formed by Thermal Oxidation of Atomically Flat Si Surface by Using Synchrotron Radiation X-Ray Characterization
Partially crystalline structures in thin SiO2 films formed by thermal oxidation of atomically flat Si surface were investigated by performing X-ray reflectometry and grazing incidence X-ray diffraction measurements. The densities of the SiO2 films were higher than those of amorphous SiO2 films, especially at the SiO2/Si interface. The structure of thermally grown SiO2 has been expected to be amorphous, but sharp diffraction peaks were observed in GIXRD measurements. The diffraction peaks tended to reflect a cristobalite-like structure with preferential orientations to the Si substrate. In addition, the lattice spacing of the cristobalite-like structure was estimated from the GIXRD measurement and found to be isotropically distorted.
- 16 June 2015
- Published by The Electrochemical Society in ECS Journal of Solid State Science and Technology
- Vol. 4 (8) , N96-N98
Open AccessStructural Analyses of Thin SiO2Films Formed by Thermal Oxidation of Atomically Flat Si Surface by Using Synchrotron Radiation X-Ray Characterization
Partially crystalline structures in thin SiO2 films formed by thermal oxidation of atomically flat Si surface were investigated by performing X-ray reflectometry and grazing incidence X-ray diffraction measurements. The densities of the SiO2 films were higher than those of amorphous SiO2 films, especially at the SiO2/Si interface. The structure of thermally grown SiO2 has been expected to be amorphous, but sharp diffraction peaks were observed in GIXRD measurements. The diffraction peaks tended to reflect a cristobalite-like structure with preferential orientations to the Si substrate. In addition, the lattice spacing of the cristobalite-like structure was estimated from the GIXRD measurement and found to be isotropically distorted.
- 27 June 2013
- Published by Springer Nature in MRS Proceedings
- Vol. 1561
High Integrity SiO2/Al2O3 Gate Stack for Normally-off GaN MOSFET
- 27 June 2013
- Published by Springer Nature in MRS Proceedings
- Vol. 1561
High Integrity SiO2/Al2O3 Gate Stack for Normally-off GaN MOSFET
- 3 May 2013
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Electron Devices
- Vol. 60 (6) , 1916-1922
Low-Interface-Trap-Density and High-Breakdown-Electric-Field SiN Films on GaN Formed by Plasma Pretreatment Using Microwave-Excited Plasma-Enhanced Chemical Vapor Deposition
We investigated the SiN/GaN interface properties formed by the microwave-excited plasma-enhanced chemical vapor deposition (PECVD) with SiH4/N2/H2 gases. The interface and insulating properties of SiN films on GaN, formed by the microwave-excited PECVD, strongly depend on SiH4 flow rate. Although the interface trap density is lower than 1011 cm-2 eV-1 at the relatively high SiH4 flow rate of 1.0 standard cm3/min (sccm), the breakdown electric field is very low (approximately 1 MV/cm). Using the SiH4 plasma pretreatment before the stoichiometric SiN deposition, both low interface trap density and high breakdown voltage greater than 2 MV/cm were obtained. In this case, the clearly ordered Ga bonding near the SiN/GaN interface was estimated by electron energy loss spectroscopy. The formation of SiN film on GaN using the microwave-excited PECVD is a very useful technique for the high-quality interface properties.
- 3 May 2013
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Electron Devices
- Vol. 60 (6) , 1916-1922
Low-Interface-Trap-Density and High-Breakdown-Electric-Field SiN Films on GaN Formed by Plasma Pretreatment Using Microwave-Excited Plasma-Enhanced Chemical Vapor Deposition
We investigated the SiN/GaN interface properties formed by the microwave-excited plasma-enhanced chemical vapor deposition (PECVD) with SiH4/N2/H2 gases. The interface and insulating properties of SiN films on GaN, formed by the microwave-excited PECVD, strongly depend on SiH4 flow rate. Although the interface trap density is lower than 1011 cm-2 eV-1 at the relatively high SiH4 flow rate of 1.0 standard cm3/min (sccm), the breakdown electric field is very low (approximately 1 MV/cm). Using the SiH4 plasma pretreatment before the stoichiometric SiN deposition, both low interface trap density and high breakdown voltage greater than 2 MV/cm were obtained. In this case, the clearly ordered Ga bonding near the SiN/GaN interface was estimated by electron energy loss spectroscopy. The formation of SiN film on GaN using the microwave-excited PECVD is a very useful technique for the high-quality interface properties.
- 1 April 2012
- Published by IOP Publishing in Japanese Journal of Applied Physics
- Vol. 51 (4S) , 04DF03
High Integrity SiO2Gate Insulator Formed by Microwave-Excited Plasma Enhanced Chemical Vapor Deposition for AlGaN/GaN Hybrid Metal–Oxide–Semiconductor Heterojunction Field-Effect Transistor on Si Substrate
- 1 April 2012
- Published by IOP Publishing in Japanese Journal of Applied Physics
- Vol. 51 (4S) , 04DF03
High Integrity SiO2Gate Insulator Formed by Microwave-Excited Plasma Enhanced Chemical Vapor Deposition for AlGaN/GaN Hybrid Metal–Oxide–Semiconductor Heterojunction Field-Effect Transistor on Si Substrate
- 1 April 2012
- Published by IOP Publishing in Japanese Journal of Applied Physics
- Vol. 51 (4) , 04DC07
Hole Mobility in Accumulation Mode Metal–Oxide–Semiconductor Field-Effect Transistors
- 1 April 2012
- Published by IOP Publishing in Japanese Journal of Applied Physics
- Vol. 51 (4) , 04DC07
Hole Mobility in Accumulation Mode Metal–Oxide–Semiconductor Field-Effect Transistors
- 1 February 2012
- Published by IOP Publishing in Japanese Journal of Applied Physics
- Vol. 51 (2) , 02BA01
On the Interface Flattening Effect and Gate Insulator Breakdown Characteristic of Radical Reaction Based Insulator Formation Technology
- 1 February 2012
- Published by IOP Publishing in Japanese Journal of Applied Physics
- Vol. 51 (2) , 02BA01
On the Interface Flattening Effect and Gate Insulator Breakdown Characteristic of Radical Reaction Based Insulator Formation Technology
- 1 October 2011
- Published by IOP Publishing in Japanese Journal of Applied Physics
- Vol. 50 (10) , 10PB05
Highly Reliable Radical SiO2Films on Atomically Flat Silicon Surface Formed by Low Temperature Pure Ar Annealing
- 1 October 2011
- Published by IOP Publishing in Japanese Journal of Applied Physics
- Vol. 50 (10) , 10PB05
Highly Reliable Radical SiO2Films on Atomically Flat Silicon Surface Formed by Low Temperature Pure Ar Annealing