Ervina Efzan Mhd Noor

Many buildings erected before modern seismic provisions remain prone to brittle failure, excessive drift and residual deformation, with loss of use often continuing long after the shaking stops. We reviewed recent structural design and retrofit technologies for earthquake-resistant buildings using a PRISMA 2020-adapted protocol. Ten ranked searches covered publications from 2018 to 2026. The final sample comprised 64 open-access journal studies with verified digital object identifiers; 63 of them (98.4%) were published from 2021 onward. Each study was coded by intervention, method, reported outcome and reporting quality. Seven themes were identified: performance-based design, base isolation, damping and energy dissipation, bracing and self-centring systems, fibre-reinforced polymer and jacketing methods, masonry and heritage retrofit, and integrated life-cycle retrofit. No single intervention performed best in every setting. Isolation worked well when displacement capacity and near-fault demand were checked explicitly. Dampers and braces reduced drift and energy demand, although uncertainty in device properties affected fragility and risk estimates. FRP and jacket strengthening addressed local member deficiencies, but their use still required assessment of the building-level load path. Retrofit decisions also increasingly involved energy, cost and environmental consequences alongside seismic performance. Based on this synthesis, we developed a framework linking hazard, vulnerability and performance objectives to intervention families and resilience outcomes. The framework is a preliminary map for similar problems. It cannot replace a full, case-specific investigation of any one building. Further work is needed on full-scale validation, uncertainty propagation, nonstructural performance, functional recovery and comparable life-cycle metrics.

The rapid advancement of photovoltaic (PV) technologies has transformed solar energy systems into intelligent, high-efficiency platforms. This review systematically examines next-generation PV materials, hybrid system architectures, and intelligent control strategies. Key technologies include perovskite-based tandem cells, N-type TOPCon, bifacial, heterojunction (HJT), and photovoltaic-thermal (PVT) systems. These innovations overcome the intrinsic limitations of conventional P-type silicon panels by reducing recombination losses, mitigating light- and temperature-induced degradation, and enhancing energy yield under real-world operating conditions. At the system level, AI-enabled inverters, adaptive maximum power point tracking (MPPT), predictive maintenance, and real-time grid interaction enable dynamic optimization under variable irradiance, thermal stress, and load fluctuations. A critical comparison across diverse deployment environments highlights current challenges, including manufacturing complexity, material stability, and AI data-quality limitations. Despite higher upfront costs and system complexity, these advanced PV systems offer superior long-term performance, improved reliability, and reduced levelized cost of electricity through lower degradation rates and enhanced operational resilience. Collectively, intelligent, material-optimized PV technologies represent a scalable, sustainable, and grid-compatible solution for solar energy deployment across diverse climates, supporting the global transition toward low-carbon energy infrastructures.

The rapid expansion of wireless communication in urban environments requires antenna systems that balance high electromagnetic performance with stringent aesthetic and security constraints. This review examines recent advances in concealed antenna technologies integrated into building structures, with a focus on performance variation, material-induced attenuation, and emerging concealment strategies. Techniques such as transparent conductors on glass, structural embedding within walls, and camouflage-based designs are shown to significantly influence resonance behavior, radiation efficiency, and pattern characteristics compared to free-space operation. Despite these challenges, optimized solutions including transparent conductive oxide arrays, wideband embedded antenna geometries, and metasurface-enhanced window structures can partially recover performance while maintaining optical transparency above 70%. Material loading effects are found to induce resonant frequency shifts of approximately 10–44%, depending on dielectric properties and environmental conditions. Transparent antenna arrays achieve gains ranging from 0.34 to 13.2 dBi, while signal-transmissive wall systems demonstrate transmission improvements of up to 22 dB relative to untreated building materials. These technologies enable a wide range of applications, including 5G and beyond-5G cellular networks across sub-6 GHz and millimeter-wave bands, as well as Internet of Things systems and smart city infrastructure. However, key challenges remain, including the need for comprehensive characterization of building material electromagnetic properties, optimization of multilayer structural environments, and the development of standardized design and evaluation methodologies. This review provides a unified framework for understanding the tradeoffs associated with antenna concealment and identifies critical research directions for the development of building-integrated wireless systems in next-generation communication networks.

The mechanical properties of lead-free solder alloys are critical for ensuring the reliability of electronic packaging, with shear strength and hardness being particularly important as electronic devices become smaller and interconnection densities increase. Thermal fluctuations and external mechanical impacts further intensify shear stresses on solder joints, raising concerns about long-term performance. In this study, the shear stress behavior of Sn-Ag-Cu and Sn-3Zn-4Bi solder joints was examined under different reflow temperatures. Sn-Ag-Cu, a widely researched lead-free solder, demonstrated strong resistance to high stress levels, reinforcing its suitability for high-reliability applications; however, its relatively high melting temperature (~221 °C) limits its use in low-temperature reflow processes. By comparison, Sn-3Zn-4Bi solder, with a melting temperature only ~12 °C higher than eutectic SnPb solder, showed potential for low-temperature soldering, while also exhibiting higher microhardness values than Sn-Ag-Cu, suggesting improved structural robustness. Despite these advantages, concerns remain regarding its compatibility with copper substrates, where interfacial reactions may affect joint integrity. Overall, the results suggest that Sn-Ag-Cu is preferable for applications requiring high strength and thermal resistance, whereas Sn-3Zn-4Bi offers notable benefits for low-temperature processing, provided substrate interactions are properly managed.

This study aims to investigate the microstructural and elemental characteristics of thermoplastic polyurethane (TPU) nanocomposites reinforced with jute cellulose nanofibers (CNFs), with the objective of understanding the dispersion behavior and interfacial interactions within the polymer matrix. CNFs were extracted from jute fibers through a chemo-mechanical process involving alkaline treatment, acid hydrolysis, bleaching, and high-energy milling, followed by melt blending with TPU to fabricate nanocomposites at varying filler loadings (1–5 wt%). Field Emission Scanning Electron Microscopy (FESEM) and Energy Dispersive X-ray (EDX) spectroscopy were employed to analyze the surface morphology and elemental distribution of the nanocomposites. The FESEM results revealed that uniform CNF dispersion was achieved up to 4 wt%, beyond which noticeable agglomeration occurred. EDX analysis confirmed the successful incorporation of CNFs and identified performance-enhancing elements such as Si, Ca, Na, and Al in the reinforcement phase. These findings suggest that CNF content strongly influences microstructure and bonding quality, which are key factors for mechanical performance. The novelty of this work lies in its exclusive focus on microstructural and elemental characterization—providing essential insight into filler distribution and matrix compatibility—offering a foundation for optimizing sustainable, high-performance TPU/CNF nanocomposites for advanced industrial applications.

Electromigration (EM) is a critical reliability concern in electronic solder joints due to increasing current densities in modern electronic packaging. EM-induced failures often manifest as void formation and microstructural degradation, particularly at the cathode interface. To address this issue, composite solder joints with elemental additions have been explored to enhance performance under high current stress. This study investigates the effect of Zn addition on the electromigration behavior and mechanical performance of eutectic Sn-Bi solder joints on copper (Cu) and nickel-coated copper (Ni/Cu) substrates. The solder alloys 58Sn-42Bi and Zn-modified Sn-Bi were prepared and reflowed onto the substrates. Electromigration testing was performed under a constant current of 1000 mA at room temperature, with applied voltages of 5 V, 12 V, and 24 V over a 10-day period per sample. Shear tests were conducted at a crosshead speed of 0.1 mm/min to evaluate joint strength. The results revealed that Zn addition influenced the distribution of Bi within the solder matrix, reducing Bi depletion at the cathode and mitigating accumulation at the anode, suggesting improved EM resistance. Zn-containing solder joints also demonstrated enhanced shear strength compared to unmodified Sn-Bi joints. These findings highlight the potential of Zn as a beneficial alloying element for improving the reliability of lead-free solder joints and form a foundation for future studies incorporating phase analysis and predictive EM lifetime modelling.

Dielectrophoresis (DEP) has been widely employed in microfluidic platforms for particle or cell manipulation in biomedical science applications due to its accurate, fast, label-free, and low-cost diagnostic technique. However, the application of the DEP technique towards protein manipulation has yet to be extensively explored due to the challenges of the complexity of protein itself, such as its complex morphologies, extremely minuscule particle size, inherent electrical properties, and temperature sensitivity, which make it relatively more challenging. Furthermore, given that protein DEP investigation requires entering the micro- to nano-scale level of DEP configuration, various challenging factors such as electrohydrodynamic effects, electrolysis, joule heating, and electrothermal force that emerge will make it more difficult in realizing protein DEP investigation. This review study has discussed the fundamental theory of DEP and considerations toward protein DEP manipulation. In particular, it focused on the DEP theoretical principle towards protein, protein DEP application challenges, microfluidic platform considerations, medium considerations, and a critically reviewed list of protein bioparticles that have been investigated were all highlighted.

In response to the growing demand for high-performance materials in industries such as automotive, aerospace, and construction, this study investigates the impact of jute cellulose nanofibers (CNFs) on the chemical, thermal, and morphological properties of thermoplastic polyurethane (TPU) nanocomposites. Jute CNFs were extracted using a chemo-mechanical method and incorporated into TPU through melt blending. Fourier transform infrared (FTIR) spectroscopy revealed notable changes in the chemical structure of the nanocomposites, including intensified O-H stretching vibrations and reduced C-H stretching vibrations upon the addition of 2 wt% and 4 wt% jute CNFs. Strong interfacial interactions between the jute CNFs and the TPU matrix were observed, particularly influencing the absorbance bands related to the -NH, C=O, and N-H groups. X-ray diffraction (XRD) analysis demonstrated enhanced crystallinity in the TPU nanocomposites, with new diffraction peaks and increased crystallite size correlating with higher jute CNF content. Field emission scanning electron microscopy (FESEM) revealed a uniform dispersion of the jute CNFs within the TPU matrix, contributing to improved interfacial adhesion and enhanced structural integrity. Thermal analysis using differential scanning calorimetry (DSC) and thermogravimetric analysis (TGA) showed an increase in the thermal stability, with the onset of degradation occurring at higher temperatures in the TPU/jute CNF nanocomposites. The glass transition temperature (T_g) and melting temperature (T_m) exhibited minor shifts, reflecting improved thermal performance. These findings suggest that the incorporation of jute CNFs significantly enhances the crystallinity, thermal stability, and structural organization of TPU, offering a sustainable approach for developing robust materials with potential applications in structural, corrosion-resistant, and high-performance fields.

Welding is a crucial process in joining metals, especially in the fabrication industry. Thisresearch aimed to investigate the effects of using two different filler materials, ER70S-6 and ER308LSi, with nine combinations of wire feeder speed (WFS) and shielding gas flow rate (GFR), on weld joints. The study focused on the weld quality and material properties of Gas Metal Arc Welded (GMAW) butt joints of ASTM A516 G70 plates, characterized through visual inspection, liquid penetrant testing, tensile testing, hardness testing, and optical microscopy. Results indicated that the highest ultimate tensile strength and hardness were achieved at 4 m/min WFS and 15 L/min GFR with ER70S-6, and 5 m/min WFS and 20 L/min GFR with ER308LSi. The specimens welded with ER308LSi demonstrated superior mechanical properties compared to those welded with ER70S-6. Additionally, the study revealed the influence of microstructural changes from the base metal (BM) to the heat-affected zone (HAZ) and fusion zone (FZ), with finer and more compact grain structures contributing to higher hardness values. These findings underscore the importance of selecting appropriate filler materials, WFS, and GFR to achieve the desired weld quality and material properties for A516 G70 low-carbon steel welded joints.