Stepan Lucyszyn
Current Organizations / Institutes
The organizations/institutes from the scholar's latest article
Previous Organizations / Institutes
The organizations / institutes from the scholar's other articles in the past ten years
Research Subjects
Stepan Lucyszyn has a total of 68 co-authors. Here are the top co-authors by number of shared publications:
- Nick M. Ridler
National Physical Laboratory, Teddington, U.K.
11 shared publications - Sang-Hee Shin
National Physical Laboratory, Teddington, U.K.
11 shared publications - Liyan Zhu
Department of Electrical and Electronic Engineering, Imperial College London, London, U.K.
7 shared publications Roshan Payapulli
Department of Electrical and Electronic Engineering, Imperial College London, London, U.K.
7 shared publications- Fangjing Hu
School of Physics, Huazhong University of Science and Technology, Wuhan, China
6 shared publications William J. Otter
Department of Electrical and Electronic Engineering, Imperial College London, London, U.K.
6 shared publications
Latest Publications
- Open Access
- 6 February 2026
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Instrumentation and Measurement
- Vol. 75 (00189456) , 1-5
Simulation-Based Calibration Verification for (Sub-)Terahertz S -Parameter Measurements
This article presents a cost-effective method for verifying (sub-)terahertz scattering ( $S$ -)parameter measurements using a vector network analyzer (VNA) with frequency extension modules. The approach reduces the need for physical standards with rigorous dimensional characterization by using full-wave electromagnetic (EM) simulation to create a “simulation-driven reference model” with a predictable uncertainty envelope. This method utilizes the known manufacturing tolerances of generic waveguide sections to generate a pass/fail verification bound. Two simple, calculable waveguide devices (a cross-connected line and reduced-aperture sections) are characterized in the WM-570 (330–500 GHz) band. Excellent agreement is achieved between the EM-simulated predictions and VNA-measured $S$ -parameters, with the measurements falling within the calculated uncertainty bounds. This work demonstrates that combining simple hardware with EM simulation is a reliable and low-cost approach for validating $S$ -parameter measurements and calibrations at terahertz frequencies.
- 6 February 2026
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Instrumentation and Measurement
- Vol. 75 (00189456) , 1-5
Open AccessSimulation-Based Calibration Verification for (Sub-)Terahertz S -Parameter Measurements
This article presents a cost-effective method for verifying (sub-)terahertz scattering ( $S$ -)parameter measurements using a vector network analyzer (VNA) with frequency extension modules. The approach reduces the need for physical standards with rigorous dimensional characterization by using full-wave electromagnetic (EM) simulation to create a “simulation-driven reference model” with a predictable uncertainty envelope. This method utilizes the known manufacturing tolerances of generic waveguide sections to generate a pass/fail verification bound. Two simple, calculable waveguide devices (a cross-connected line and reduced-aperture sections) are characterized in the WM-570 (330–500 GHz) band. Excellent agreement is achieved between the EM-simulated predictions and VNA-measured $S$ -parameters, with the measurements falling within the calculated uncertainty bounds. This work demonstrates that combining simple hardware with EM simulation is a reliable and low-cost approach for validating $S$ -parameter measurements and calibrations at terahertz frequencies.
- Open Access
- 1 January 2026
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Access
- Vol. 14, 145341-145361
Enhanced Enabling Technologies for Improved ‘THz-Torch’ Applications
- 1 January 2026
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Access
- Vol. 14, 145341-145361
Open AccessEnhanced Enabling Technologies for Improved ‘THz-Torch’ Applications
- 26 May 2025
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Terahertz Science and Technology
- Vol. 15 (4) , 734-737
Derivation of Rectangular Metallic Waveguide Attenuation Constant for IEC 60153-2 and IEEE 1785.1 International Standards
The IEC 60153-2 and IEEE 1785.1 international standards for rectangular metallic waveguides are currently undergoing revision. Textbook derivations of the associated equations for the metal-pipe rectangular waveguide attenuation constant to be given in the revised standards are presented. These derivations provide important mathematical traceability for these equations, which has previously not been proven in the open literature for these standards. Furthermore, the historical approximations used in the original equations are identified and now corrected here. Results using the newly derived equations are demonstrated, with comparison to experimental results in the WM-380 (500 GHz to 750 GHz) band.
- 26 May 2025
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Terahertz Science and Technology
- Vol. 15 (4) , 734-737
Derivation of Rectangular Metallic Waveguide Attenuation Constant for IEC 60153-2 and IEEE 1785.1 International Standards
The IEC 60153-2 and IEEE 1785.1 international standards for rectangular metallic waveguides are currently undergoing revision. Textbook derivations of the associated equations for the metal-pipe rectangular waveguide attenuation constant to be given in the revised standards are presented. These derivations provide important mathematical traceability for these equations, which has previously not been proven in the open literature for these standards. Furthermore, the historical approximations used in the original equations are identified and now corrected here. Results using the newly derived equations are demonstrated, with comparison to experimental results in the WM-380 (500 GHz to 750 GHz) band.
- Open Access
- 7 February 2024
- Published by Springer Nature in Scientific Reports
- Vol. 14 (1) , 1-9
Few-shot concealed object detection in sub-THz security images using improved pseudo-annotations
In this research, we explore the few-shot object detection application for identifying concealed objects in sub-terahertz security images, using fine-tuning based frameworks. To adapt these machine learning frameworks for the (sub-)terahertz domain, we propose an innovative pseudo-annotation method to augment the object detector by sourcing high-quality training samples from unlabeled images. This approach employs multiple one-class detectors coupled with a fine-grained classifier, trained on supporting thermal-infrared images, to prevent overfitting. Consequently, our approach enhances the model’s ability to detect challenging objects (e.g., 3D-printed guns and ceramic knives) when few-shot training examples are available, especially in the real-world scenario where images of concealed dangerous items are scarce.
- 7 February 2024
- Published by Springer Nature in Scientific Reports
- Vol. 14 (1) , 1-9
Open AccessFew-shot concealed object detection in sub-THz security images using improved pseudo-annotations
In this research, we explore the few-shot object detection application for identifying concealed objects in sub-terahertz security images, using fine-tuning based frameworks. To adapt these machine learning frameworks for the (sub-)terahertz domain, we propose an innovative pseudo-annotation method to augment the object detector by sourcing high-quality training samples from unlabeled images. This approach employs multiple one-class detectors coupled with a fine-grained classifier, trained on supporting thermal-infrared images, to prevent overfitting. Consequently, our approach enhances the model’s ability to detect challenging objects (e.g., 3D-printed guns and ceramic knives) when few-shot training examples are available, especially in the real-world scenario where images of concealed dangerous items are scarce.
- Open Access
- 26 January 2024
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Access
- Vol. 12, 21868-21885
Low-Cost Thermal-Infrared ‘THz-Torch’ Spectroscopy
The low-cost thermal infrared ‘THz-Torch’ concept (referred to here as ‘THz-T’) was first introduced over a decade ago, and since then the associated ‘over the THz horizon’ thermal infrared (10-100 THz) implementation technologies have continued to advance. While short range secure wireless communications links have received a great deal of attention, material spectroscopy has only briefly been introduced in a short conference abstract. Here, for the first time, we explore in depth the basic concepts behind THz-T spectroscopy. Moreover, when compared to the unvalidated results within our previous work, we demonstrate an enhanced experimental THz-T spectrometer. A detailed thermal noise power link budget model for both the transmission and reflection modes of operation have been undertaken and independently validated. As a proof of principle, a diverse array of different material types has been characterized. This includes glass sheets, semiconductor wafers, ceramic plate, plastic tape, plastic sheets, as well as polymer and cotton paper banknotes. THz-T technology has the advantages of hardware simplicity and low cost non-destructive testing for ubiquitous applications.
- 26 January 2024
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Access
- Vol. 12, 21868-21885
Open AccessLow-Cost Thermal-Infrared ‘THz-Torch’ Spectroscopy
The low-cost thermal infrared ‘THz-Torch’ concept (referred to here as ‘THz-T’) was first introduced over a decade ago, and since then the associated ‘over the THz horizon’ thermal infrared (10-100 THz) implementation technologies have continued to advance. While short range secure wireless communications links have received a great deal of attention, material spectroscopy has only briefly been introduced in a short conference abstract. Here, for the first time, we explore in depth the basic concepts behind THz-T spectroscopy. Moreover, when compared to the unvalidated results within our previous work, we demonstrate an enhanced experimental THz-T spectrometer. A detailed thermal noise power link budget model for both the transmission and reflection modes of operation have been undertaken and independently validated. As a proof of principle, a diverse array of different material types has been characterized. This includes glass sheets, semiconductor wafers, ceramic plate, plastic tape, plastic sheets, as well as polymer and cotton paper banknotes. THz-T technology has the advantages of hardware simplicity and low cost non-destructive testing for ubiquitous applications.
- Open Access
- 31 October 2023
- Published by Springer Nature in Research Square
Few-shot concealed object detection in sub-THz security images using improved pseudo- annotations
In this research, we explore the Few-Shot Object Detection application for identifying concealed objects in sub-terahertz security images, using fine-tuning based frameworks. To adapt these machine learning frameworks for the (sub-)terahertz domain, we propose an innovative pseudo-annotation method to augment the object detector by sourcing high-quality training samples from unlabeled images. This approach employs multiple one-class detectors coupled with a fine-grained classifier, trained on supporting thermal-infrared images, to prevent overfitting. Consequently, our approach enhances the model’s ability to detect challenging objects when few-shot training examples are available.
- 31 October 2023
- Published by Springer Nature in Research Square
Open AccessFew-shot concealed object detection in sub-THz security images using improved pseudo- annotations
In this research, we explore the Few-Shot Object Detection application for identifying concealed objects in sub-terahertz security images, using fine-tuning based frameworks. To adapt these machine learning frameworks for the (sub-)terahertz domain, we propose an innovative pseudo-annotation method to augment the object detector by sourcing high-quality training samples from unlabeled images. This approach employs multiple one-class detectors coupled with a fine-grained classifier, trained on supporting thermal-infrared images, to prevent overfitting. Consequently, our approach enhances the model’s ability to detect challenging objects when few-shot training examples are available.
- Open Access
- 20 July 2023
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Access
- Vol. 11, 79073-79086
3-D Printed THz Waveguide Components
This paper presents the state-of-the-art in polymer-based 3-D printing of metal-pipe rectangular waveguides (MPRWGs) with the first reported terahertz filters, all operating within the WR-2.2 band (325 to 500 GHz): a 5 mm-long thru line, two 399 GHz single-cavity resonators and two 403 GHz bandpass filters (BPFs). Our thru line exhibits a measured average insertion loss of only 0.9 dB, with a worst-case return loss of 13.3 dB, across the band. The single-cavity resonators, without and with corner rounding compensation (CRC) are investigated with the use of an RLC equivalent circuit model. The uncompensated resonator exhibits a 2.3% frequency downshift and an increase of 10.8 GHz in its 3 dB bandwidth. The compensated resonator exhibits a 2.2% frequency upshift and an increase of only 2.2 GHz in its 3 dB bandwidth; clearly demonstrating that CRC helps to mitigate against increased coupling into the resonators, as a result of manufacturing limitations with low-cost 3-D printing. Finally, the 3 rd order Butterworth and Chebyshev MPRWG BPFs both have a measured passband insertion loss of only 1.0 dB. The Butterworth filter exhibits a 0.8% passband frequency upshift and worst-case return loss of 16.6 dB; while the Chebyshev filter exhibits a 1.2% passband frequency downshift and worst-case return loss of 10.4 dB. With our low-cost polymer-based 3-D printing technology, we have demonstrated measured performances that are better than those using metal-based 3-D printing in the WR-2.2 band and this may, in the not too distant future, challenge components manufactured using traditional machining technologies.
- 20 July 2023
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Access
- Vol. 11, 79073-79086
Open Access3-D Printed THz Waveguide Components
This paper presents the state-of-the-art in polymer-based 3-D printing of metal-pipe rectangular waveguides (MPRWGs) with the first reported terahertz filters, all operating within the WR-2.2 band (325 to 500 GHz): a 5 mm-long thru line, two 399 GHz single-cavity resonators and two 403 GHz bandpass filters (BPFs). Our thru line exhibits a measured average insertion loss of only 0.9 dB, with a worst-case return loss of 13.3 dB, across the band. The single-cavity resonators, without and with corner rounding compensation (CRC) are investigated with the use of an RLC equivalent circuit model. The uncompensated resonator exhibits a 2.3% frequency downshift and an increase of 10.8 GHz in its 3 dB bandwidth. The compensated resonator exhibits a 2.2% frequency upshift and an increase of only 2.2 GHz in its 3 dB bandwidth; clearly demonstrating that CRC helps to mitigate against increased coupling into the resonators, as a result of manufacturing limitations with low-cost 3-D printing. Finally, the 3 rd order Butterworth and Chebyshev MPRWG BPFs both have a measured passband insertion loss of only 1.0 dB. The Butterworth filter exhibits a 0.8% passband frequency upshift and worst-case return loss of 16.6 dB; while the Chebyshev filter exhibits a 1.2% passband frequency downshift and worst-case return loss of 10.4 dB. With our low-cost polymer-based 3-D printing technology, we have demonstrated measured performances that are better than those using metal-based 3-D printing in the WR-2.2 band and this may, in the not too distant future, challenge components manufactured using traditional machining technologies.
- Open Access
- 23 March 2023
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Access
- Vol. 11, 32272-32295
Polymer-Based 3-D Printed 140 to 220 GHz Metal Waveguide Thru Lines, Twist and Filters
This paper demonstrates the current state-of-the-art in low-cost, low loss ruggedized polymer-based 3-D printed G-band (140 to 220 GHz) metal-pipe rectangular waveguide (MPRWG) components. From a unique and exhaustive up-to-date literature review, the main limitations for G-band split-block MPRWGs are identified as electromagnetic (EM) radiation leakage, assembly part alignment and manufacturing accuracy. To mitigate against leakage and misalignment, we investigate a ‘trough-and-lid’ split-block solution. This approach is successfully employed in proof-of-concept thru lines, and in the first polymer-based 3-D printed 90° twist and symmetrical diaphragm inductive iris-coupled bandpass filters (BPFs) operating above 110 GHz. An inexpensive desktop masked stereolithography apparatus 3-D printer and a commercial copper electroplating service are used. Surface roughness losses are calculated and applied to EM (re-)simulations, using two modifications of the Hemispherical model. The 7.4 mm thru line exhibits a measured average dissipative attenuation of only 12.7 dB/m, with rectangular-to-trapezoidal cross-sectional distortion being the main contributor to loss. The 90° twist exhibits commensurate measured performance to its commercial counterpart, despite the much lower manufacturing costs. A detailed time-domain reflectometry analysis of flange quality for the thru lines and 90° twists has also been included. Finally, a new systematic iris corner rounding compensation technique, to correct passband frequency down-shifting is applied to two BPFs. Here, the 175 GHz exemplar exhibits only 0.5% center frequency up-shifting. The trough-and-lid assembly is now a viable solution for new upper-mm-wave MPRWG components. With this technology becoming less expensive and more accurate, higher frequencies and/or more demanding specifications can be implemented.
- 23 March 2023
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Access
- Vol. 11, 32272-32295
Open AccessPolymer-Based 3-D Printed 140 to 220 GHz Metal Waveguide Thru Lines, Twist and Filters
This paper demonstrates the current state-of-the-art in low-cost, low loss ruggedized polymer-based 3-D printed G-band (140 to 220 GHz) metal-pipe rectangular waveguide (MPRWG) components. From a unique and exhaustive up-to-date literature review, the main limitations for G-band split-block MPRWGs are identified as electromagnetic (EM) radiation leakage, assembly part alignment and manufacturing accuracy. To mitigate against leakage and misalignment, we investigate a ‘trough-and-lid’ split-block solution. This approach is successfully employed in proof-of-concept thru lines, and in the first polymer-based 3-D printed 90° twist and symmetrical diaphragm inductive iris-coupled bandpass filters (BPFs) operating above 110 GHz. An inexpensive desktop masked stereolithography apparatus 3-D printer and a commercial copper electroplating service are used. Surface roughness losses are calculated and applied to EM (re-)simulations, using two modifications of the Hemispherical model. The 7.4 mm thru line exhibits a measured average dissipative attenuation of only 12.7 dB/m, with rectangular-to-trapezoidal cross-sectional distortion being the main contributor to loss. The 90° twist exhibits commensurate measured performance to its commercial counterpart, despite the much lower manufacturing costs. A detailed time-domain reflectometry analysis of flange quality for the thru lines and 90° twists has also been included. Finally, a new systematic iris corner rounding compensation technique, to correct passband frequency down-shifting is applied to two BPFs. Here, the 175 GHz exemplar exhibits only 0.5% center frequency up-shifting. The trough-and-lid assembly is now a viable solution for new upper-mm-wave MPRWG components. With this technology becoming less expensive and more accurate, higher frequencies and/or more demanding specifications can be implemented.
- Open Access
- 2 March 2023
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Microwave and Wireless Technology Letters
- Vol. 33 (6) , 659-662
3-D Printed W-Band Waveguide Twist With Integrated Filtering
This work demonstrates the integration of a low-pass filter into a 90 $^{\circ}$ waveguide twist at $W$ -band (75–110 GHz), manufactured using polymer-based 3-D printing. For the first time, a 1-D periodic electromagnetic bandgap (EBG) structure is incorporated within a waveguide twist. Unlike conventional filters, implemented using irises and septa, EBG structures employing hollow cavities are structurally robust and mechanically insensitive to 3-D printing. The measured average passband insertion loss is only 0.48 dB at the $W$ -band while using our unconventional split-block solution ( $H$ -plane $a$ -edge split with raised lips). A nontwist thru filter has also been demonstrated, as a reference. Our approach demonstrates the potential for the low-cost manufacture of compact and high-performance multifunctional integrated waveguide components at millimeter-wave frequencies.
- 2 March 2023
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Microwave and Wireless Technology Letters
- Vol. 33 (6) , 659-662
Open Access3-D Printed W-Band Waveguide Twist With Integrated Filtering
This work demonstrates the integration of a low-pass filter into a 90 $^{\circ}$ waveguide twist at $W$ -band (75–110 GHz), manufactured using polymer-based 3-D printing. For the first time, a 1-D periodic electromagnetic bandgap (EBG) structure is incorporated within a waveguide twist. Unlike conventional filters, implemented using irises and septa, EBG structures employing hollow cavities are structurally robust and mechanically insensitive to 3-D printing. The measured average passband insertion loss is only 0.48 dB at the $W$ -band while using our unconventional split-block solution ( $H$ -plane $a$ -edge split with raised lips). A nontwist thru filter has also been demonstrated, as a reference. Our approach demonstrates the potential for the low-cost manufacture of compact and high-performance multifunctional integrated waveguide components at millimeter-wave frequencies.
- 10 February 2023
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Microwave and Wireless Technology Letters
- Vol. 33 (2) , 236
Erratum to “3-D Printed Rectangular Waveguide 123–129 GHz Packaging for Commercial CMOS RFICs”
Due to a production error, in the above letter [1] , on page 1, the sentence “The optical microphotograph of the plane view for the $322\times 876\times 1630\,\,\mu \text{m}$ test chip is shown in Fig. 1(b)” should have been presented as:
- 10 February 2023
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Microwave and Wireless Technology Letters
- Vol. 33 (2) , 236
Erratum to “3-D Printed Rectangular Waveguide 123–129 GHz Packaging for Commercial CMOS RFICs”
Due to a production error, in the above letter [1] , on page 1, the sentence “The optical microphotograph of the plane view for the $322\times 876\times 1630\,\,\mu \text{m}$ test chip is shown in Fig. 1(b)” should have been presented as: