Gökhan Utlu
Current Organizations / Institutes
The organizations/institutes from the scholar's latest article
Previous Organizations / Institutes
The organizations / institutes from the scholar's other articles in the past ten years
Research Subjects
Gökhan Utlu has a total of 20 co-authors. Here are the top co-authors by number of shared publications:
N. Artunç
5 shared publications- Alper Çetinel
Department of Physics, Ege University, Bornova, Izmir, Turkey
2 shared publications - Mehmet Ozdogan
University of North Dakota
2 shared publications A. Cetinel
Department of Physics, Faculty of Science, Ege University, 35100 Bornova, Izmir, Turkey
1 shared publicationAlper Çetinel
Department of Physics, Ege University, Bornova, 35030 Izmir, Turkey
1 shared publication- Aytaç Gürhan Gökçe
Department of Physics, Dokuz Eylül University, İzmir, Turkey
1 shared publication
Latest Publications
- Open Access
- 31 May 2023
- Published by American Chemical Society (ACS) in ACS Omega
- Vol. 8 (23) , 20801-20809
Preparation and Characterization of Electrochemically Deposited Cu2O/ZnO Heterojunctions on Porous Silicon
Cu2O/ZnO heterojunction was fabricated on porous silicon (PSi) by a two-step electrochemical deposition technique with changing current densities and deposition times, and then the PSi/Cu2O/ZnO nanostructure was systematically investigated. SEM investigation revealed that the morphologies of the ZnO nanostructures were significantly affected by the applied current density but not those of Cu2O nanostructures. It was observed that with the increase of current density from 0.1 to 0.9 mA/cm2, ZnO nanoparticles showed more intense deposition on the surface. In addition, when the deposition time increased from 10 to 80 min, at a constant current density, an intense ZnO accumulation occured on Cu2O structures. XRD analysis showed that both the polycrystallinity and the preferential orientation of ZnO nanostructures change with the deposition time. XRD analysis also revealed that Cu2O nanostructures are mostly in the polycrystalline structure. Several strong Cu2O peaks were observed for less deposition times, but those peaks diminish with increasing deposition time due to ZnO contents. According to XPS analysis, extending the deposition time from 10 to 80 min, the intensity of the Zn peaks increases, whereas the intensity of the Cu peaks decreases, which is verified by the XRD and SEM investigations. It was found from the I-V analysis that the PSi/Cu2O/ZnO samples exhibited rectifying junction and acted as a characteristical p-n heterojunction. Among the chosen experimental parameters, PSi/Cu2O/ZnO samples obtained at 0.5 mA current density and 80 min deposition times have the best junction quality and defect density.
- 31 May 2023
- Published by American Chemical Society (ACS) in ACS Omega
- Vol. 8 (23) , 20801-20809
Open AccessPreparation and Characterization of Electrochemically Deposited Cu2O/ZnO Heterojunctions on Porous Silicon
Cu2O/ZnO heterojunction was fabricated on porous silicon (PSi) by a two-step electrochemical deposition technique with changing current densities and deposition times, and then the PSi/Cu2O/ZnO nanostructure was systematically investigated. SEM investigation revealed that the morphologies of the ZnO nanostructures were significantly affected by the applied current density but not those of Cu2O nanostructures. It was observed that with the increase of current density from 0.1 to 0.9 mA/cm2, ZnO nanoparticles showed more intense deposition on the surface. In addition, when the deposition time increased from 10 to 80 min, at a constant current density, an intense ZnO accumulation occured on Cu2O structures. XRD analysis showed that both the polycrystallinity and the preferential orientation of ZnO nanostructures change with the deposition time. XRD analysis also revealed that Cu2O nanostructures are mostly in the polycrystalline structure. Several strong Cu2O peaks were observed for less deposition times, but those peaks diminish with increasing deposition time due to ZnO contents. According to XPS analysis, extending the deposition time from 10 to 80 min, the intensity of the Zn peaks increases, whereas the intensity of the Cu peaks decreases, which is verified by the XRD and SEM investigations. It was found from the I-V analysis that the PSi/Cu2O/ZnO samples exhibited rectifying junction and acted as a characteristical p-n heterojunction. Among the chosen experimental parameters, PSi/Cu2O/ZnO samples obtained at 0.5 mA current density and 80 min deposition times have the best junction quality and defect density.
- 23 March 2023
- Published by Elsevier in Chemical Physics Letters
- Vol. 820
Effect of deposition time on the structural and electrical properties of electrodeposited PSi/Cu2O/ZnO heterojunction
- 23 March 2023
- Published by Elsevier in Chemical Physics Letters
- Vol. 820
Effect of deposition time on the structural and electrical properties of electrodeposited PSi/Cu2O/ZnO heterojunction
- 8 October 2019
- Published by Elsevier in Chemical Physics Letters
- Vol. 737, 136827
Growth and characterization of ZnO nanostructures on porous silicon substrates: Effect of solution temperature
- 8 October 2019
- Published by Elsevier in Chemical Physics Letters
- Vol. 737, 136827
Growth and characterization of ZnO nanostructures on porous silicon substrates: Effect of solution temperature
- 1 September 2019
- Published by Institute of Physics, Polish Academy of Sciences in Acta Physica Polonica A
- Vol. 136 (3) , 432-438
Thickness and Temperature Dependence of ZnO/Glass Thin Film Systems Obtained by Thermal Evaporation
- 1 September 2019
- Published by Institute of Physics, Polish Academy of Sciences in Acta Physica Polonica A
- Vol. 136 (3) , 432-438
Thickness and Temperature Dependence of ZnO/Glass Thin Film Systems Obtained by Thermal Evaporation
- 1 August 2019
- Published by Sakarya University Journal of Science in Sakarya University Journal of Science
- Vol. 23 (4) , 650-656
Structural Investigation of ZnO Thin Films Obtained by Annealing after Thermal Evaporation
In this study, ZnO thin films, with thicknesses of 80-240 nm are prepared by thermal evaporation of ZnO pellets on glass substrates. Then, these films are annealed in air atmosphere at 300°C for 2 hours. ZnO formation has been investigated as a function of the film thickness. As deposited films appear to be brown since they are rich in Zn, whereas Zn phases are replaced by ZnO phases after annealing and the films show a transparent appearance. In thinner films (80-100 nm) the ZnO phases are not observed but Zn phase intensities decrease. Especially when the thickness is increased in 132-240 nm thick films, ZnO phases are observed after annealing, and their intensity is increased and polycrystalline structures are formed. XRD measurements show that Zn (002), Zn (100) and Zn (101) phases are present in our films before annealing. After annealing, the intensity of these zinc peaks decreases firstly due to the film thickness, and then at ZnO (100), ZnO (002) and ZnO (101) phases are formed. SEM, AFM analyzes show that ZnOs are formed in the form of nanorods on the surface and after these anneal the columnar growths occur and the particle diameters increase.
- 1 August 2019
- Published by Sakarya University Journal of Science in Sakarya University Journal of Science
- Vol. 23 (4) , 650-656
Structural Investigation of ZnO Thin Films Obtained by Annealing after Thermal Evaporation
In this study, ZnO thin films, with thicknesses of 80-240 nm are prepared by thermal evaporation of ZnO pellets on glass substrates. Then, these films are annealed in air atmosphere at 300°C for 2 hours. ZnO formation has been investigated as a function of the film thickness. As deposited films appear to be brown since they are rich in Zn, whereas Zn phases are replaced by ZnO phases after annealing and the films show a transparent appearance. In thinner films (80-100 nm) the ZnO phases are not observed but Zn phase intensities decrease. Especially when the thickness is increased in 132-240 nm thick films, ZnO phases are observed after annealing, and their intensity is increased and polycrystalline structures are formed. XRD measurements show that Zn (002), Zn (100) and Zn (101) phases are present in our films before annealing. After annealing, the intensity of these zinc peaks decreases firstly due to the film thickness, and then at ZnO (100), ZnO (002) and ZnO (101) phases are formed. SEM, AFM analyzes show that ZnOs are formed in the form of nanorods on the surface and after these anneal the columnar growths occur and the particle diameters increase.
- 1 June 2019
- Published by Elsevier in Thin Solid Films
- Vol. 680, 48-54
The comparison of transient photocurrent spectroscopy measurements of Pulsed Electron Deposited ZnO thin film for air and vacuum ambient conditions
- 1 June 2019
- Published by Elsevier in Thin Solid Films
- Vol. 680, 48-54
The comparison of transient photocurrent spectroscopy measurements of Pulsed Electron Deposited ZnO thin film for air and vacuum ambient conditions
- 9 November 2016
- Published by World Scientific Pub Co Pte Ltd in Surface Review and Letters
- Vol. 24 (06)
THE EFFECT OF THICKNESS OF SILVER THIN FILM ON STRUCTURAL AND OPTICAL PROPERTIES OF POROUS SILICON
In this study, porous silicon (PS) samples were prepared on [Formula: see text]-type silicon (100) wafers by electrochemical etching method, varying the current density from 20 to 100[Formula: see text]mA/cm2and keeping constant HF concentration (10%) and etching time of 15[Formula: see text]min. Then, Ag thin films, which have 10, 50 and 100[Formula: see text]nm film thicknesses, were deposited on PS layers by using thermal evaporation to investigate the influence of Ag film thickness on structural and optical properties of PS. The structural and optical properties of PS and Ag deposited PS layers have been investigated by XRD, FE-SEM, Raman and photoluminescence (PL) spectroscopy. FE-SEM XRD and Raman analyzes indicate that average pore size and porosity of PS layers increase with the increasing current density. Further, Ag nanoparticles have embedded in pore channel. PL measurement reveals that higher porosity of PS would be better to form the Ag–PS nano-composite material leading to stronger PL band. The PL spectra of PS and Ag–PS samples indicate that PL bands show blue shift with increasing current density and film thickness. Consequently, it has been found that the structural and optical properties of PS depend on current density and Ag film thickness individually.
- 9 November 2016
- Published by World Scientific Pub Co Pte Ltd in Surface Review and Letters
- Vol. 24 (06)
THE EFFECT OF THICKNESS OF SILVER THIN FILM ON STRUCTURAL AND OPTICAL PROPERTIES OF POROUS SILICON
In this study, porous silicon (PS) samples were prepared on [Formula: see text]-type silicon (100) wafers by electrochemical etching method, varying the current density from 20 to 100[Formula: see text]mA/cm2and keeping constant HF concentration (10%) and etching time of 15[Formula: see text]min. Then, Ag thin films, which have 10, 50 and 100[Formula: see text]nm film thicknesses, were deposited on PS layers by using thermal evaporation to investigate the influence of Ag film thickness on structural and optical properties of PS. The structural and optical properties of PS and Ag deposited PS layers have been investigated by XRD, FE-SEM, Raman and photoluminescence (PL) spectroscopy. FE-SEM XRD and Raman analyzes indicate that average pore size and porosity of PS layers increase with the increasing current density. Further, Ag nanoparticles have embedded in pore channel. PL measurement reveals that higher porosity of PS would be better to form the Ag–PS nano-composite material leading to stronger PL band. The PL spectra of PS and Ag–PS samples indicate that PL bands show blue shift with increasing current density and film thickness. Consequently, it has been found that the structural and optical properties of PS depend on current density and Ag film thickness individually.
- 1 August 2014
- Published by Elsevier in Applied Surface Science
- Vol. 310, 248-256
The effects of grain boundary scattering on electrical resistivity of Ag/NiSi silicide films formed on silicon substrate at 500 °C by RTA
- 1 August 2014
- Published by Elsevier in Applied Surface Science
- Vol. 310, 248-256
The effects of grain boundary scattering on electrical resistivity of Ag/NiSi silicide films formed on silicon substrate at 500 °C by RTA
- 1 January 2014
- Published by Elsevier in Microelectronic Engineering
- Vol. 113, 86-92
The calculation of the reflection coefficients by analyzing resistivity data of the Ni–Si silicide films formed at 850°C by RTA
- 1 January 2014
- Published by Elsevier in Microelectronic Engineering
- Vol. 113, 86-92
The calculation of the reflection coefficients by analyzing resistivity data of the Ni–Si silicide films formed at 850°C by RTA
- 15 December 2011
- Published by Elsevier in Materials Chemistry and Physics
- Vol. 132 (2-3) , 421-430
Temperature and thickness dependence of the grain boundary scattering in the Ni–Si silicide films formed on silicon substrate at 500°C by RTA
- 15 December 2011
- Published by Elsevier in Materials Chemistry and Physics
- Vol. 132 (2-3) , 421-430
Temperature and thickness dependence of the grain boundary scattering in the Ni–Si silicide films formed on silicon substrate at 500°C by RTA