Akhilesh Jaiswal
Current Organizations / Institutes
The organizations/institutes from the scholar's latest article
Research Subjects
Akhilesh Jaiswal has a total of 97 co-authors. Here are the top co-authors by number of shared publications:
- Amogh Agrawal
School of Electrical and Computer Engineering, Purdue University, West Lafayette, IN, USA
12 shared publications Kaushik Roy
School of Electrical and Computer Engineering, Purdue University, West Lafayette, IN 47906 USA
12 shared publications- Kaushik Roy
Elmore Family School of Electrical and Computer Engineering, Purdue University, West Lafayette, IN, USA
9 shared publications - Abdullah-Al Kaiser
Electrical and Computer Engineering, University of Wisconsin–Madison, Madison, USA
5 shared publications - Gourav Datta
Case Western Reserve University, Cleveland, OH, USA
5 shared publications - Zihan Yin
Department of Electrical and Computer Engineering, University of WisconsinMadison, Madison, WI, USA
5 shared publications
Latest Publications
- 13 April 2026
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Circuits and Systems I: Regular Papers
- Vol. PP (15498328) , 1-12
GEM3D-CIM: General Purpose Matrix Computation Using 3-D-Integrated SRAM–eDRAM Hybrid Compute-In-Memory-on-Memory Architecture
With the rapid growth of deep neural networks (DNNs), compute-in-memory (CIM) has emerged as a promising energy-efficient paradigm for accelerating multiply-and-accumulate (MAC) operations. Yet, current CIM architectures are largely limited to dot-product computations and struggle to efficiently support general-purpose matrix operations, such as transpose, element-wise addition, and multiplication. This work presents a 3D-integrated, memory-on-memory SRAM-eDRAM hybrid CIM architecture, implemented in GlobalFoundries 22 nm FDSOI technology, capable of performing general matrix operations directly within the memory crossbar with 4-bit precision. By leveraging a specialized transpose-based architecture, in-memory arithmetic operations, peripheral-aware design, and 3D SRAM–eDRAM integration, the proposed architecture balances latency, energy efficiency, and compute density for general purpose matrix operations while remaining compatible with the conventional CIM dot product architectures. Overall, this memory-on-memory CIM framework generalizes CIM beyond dot products, enabling versatile matrix processing and paving the way for broader applications in AI acceleration and general-purpose high performance computing.
- 13 April 2026
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Circuits and Systems I: Regular Papers
- Vol. PP (15498328) , 1-12
GEM3D-CIM: General Purpose Matrix Computation Using 3-D-Integrated SRAM–eDRAM Hybrid Compute-In-Memory-on-Memory Architecture
With the rapid growth of deep neural networks (DNNs), compute-in-memory (CIM) has emerged as a promising energy-efficient paradigm for accelerating multiply-and-accumulate (MAC) operations. Yet, current CIM architectures are largely limited to dot-product computations and struggle to efficiently support general-purpose matrix operations, such as transpose, element-wise addition, and multiplication. This work presents a 3D-integrated, memory-on-memory SRAM-eDRAM hybrid CIM architecture, implemented in GlobalFoundries 22 nm FDSOI technology, capable of performing general matrix operations directly within the memory crossbar with 4-bit precision. By leveraging a specialized transpose-based architecture, in-memory arithmetic operations, peripheral-aware design, and 3D SRAM–eDRAM integration, the proposed architecture balances latency, energy efficiency, and compute density for general purpose matrix operations while remaining compatible with the conventional CIM dot product architectures. Overall, this memory-on-memory CIM framework generalizes CIM beyond dot products, enabling versatile matrix processing and paving the way for broader applications in AI acceleration and general-purpose high performance computing.
- Open Access
System-Level Performance Modeling of Photonic In-Memory Computing
Photonic in-memory computing is a high-speed, low-energy alternative to traditional transistor-based digital computing that utilizes high photonic operating frequencies and bandwidths. In this work, we develop a comprehensive system-level performance model for photonic in-memory computing, capturing the effects of key latency sources such as external memory access and opto-electronic conversion. We perform algorithm-to-hardware mapping across a range of workloads, including the Sod shock tube problem, Matricized Tensor Times Khatri-Rao Product (MTTKRP), and the Vlasov-Maxwell equation, to evaluate how the latencies impact real-world high-performance computing workloads. Our performance model shows that, while accounting for system overheads, a compact 1x256 bit single-wavelength photonic SRAM array, fabricated using the standard silicon photonics process by GlobalFoundries, sustains up to 1.5 TOPS, 0.9 TOPS, and 1.3 TOPS on the Sod shock tube problem, MTTKRP, and the Vlasov-Maxwell equation with an average energy efficiency of 2.5 TOPS/W.
Open AccessSystem-Level Performance Modeling of Photonic In-Memory Computing
Photonic in-memory computing is a high-speed, low-energy alternative to traditional transistor-based digital computing that utilizes high photonic operating frequencies and bandwidths. In this work, we develop a comprehensive system-level performance model for photonic in-memory computing, capturing the effects of key latency sources such as external memory access and opto-electronic conversion. We perform algorithm-to-hardware mapping across a range of workloads, including the Sod shock tube problem, Matricized Tensor Times Khatri-Rao Product (MTTKRP), and the Vlasov-Maxwell equation, to evaluate how the latencies impact real-world high-performance computing workloads. Our performance model shows that, while accounting for system overheads, a compact 1x256 bit single-wavelength photonic SRAM array, fabricated using the standard silicon photonics process by GlobalFoundries, sustains up to 1.5 TOPS, 0.9 TOPS, and 1.3 TOPS on the Sod shock tube problem, MTTKRP, and the Vlasov-Maxwell equation with an average energy efficiency of 2.5 TOPS/W.
- 23 January 2026
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Circuits and Systems II: Express Briefs
- Vol. 73 (3) , 308-312
A Pathway to Near Tissue Computing Through Processing-in-CTIA Pixels for Biomedical Applications
Near-tissue computing requires sensor-level processing of high-resolution images, essential for real-time biomedical diagnostics and surgical guidance. We introduce a novel Capacitive Transimpedance Amplifier-based In-Pixel Computing (CTIA-IPC) architecture to address this need. Our design leverages CTIA pixels that are widely used for biomedical imaging owing to the inherent advantages of excellent linearity, low noise, and robust operation under low-light conditions. We augment CTIA pixels with IPC to enable multi-channel, multi-bit convolution operations along with integrated batch normalization (BN) and Rectified Linear Unit (ReLU) functionalities in the peripheral Analog to Digital Converter (ADC). Leveraging 3D integration to embed pixel circuitry and weight storage, CTIA-IPC maintains pixel density comparable to standard CTIA designs. Moreover, our algorithm-circuit co-design optimization results in minimal accuracy drop while providing significant data bandwidth reduction. Evaluated on the EndoVis tissue dataset (1280×1024), CTIA-IPC achieves approximately 12× reduction in data bandwidth, yielding segmentation IoUs of 75.93% (parts), and 28.60% (instrument), a minimal accuracy reduction (∼1.3%–2.5%) compared to baseline methods. Achieving 1.98 GOPS throughput and 3.39 GOPS/W efficiency, our CTIA-IPC architecture offers a promising computational framework tailored specifically for biomedical near-tissue computing.
- 23 January 2026
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Circuits and Systems II: Express Briefs
- Vol. 73 (3) , 308-312
A Pathway to Near Tissue Computing Through Processing-in-CTIA Pixels for Biomedical Applications
Near-tissue computing requires sensor-level processing of high-resolution images, essential for real-time biomedical diagnostics and surgical guidance. We introduce a novel Capacitive Transimpedance Amplifier-based In-Pixel Computing (CTIA-IPC) architecture to address this need. Our design leverages CTIA pixels that are widely used for biomedical imaging owing to the inherent advantages of excellent linearity, low noise, and robust operation under low-light conditions. We augment CTIA pixels with IPC to enable multi-channel, multi-bit convolution operations along with integrated batch normalization (BN) and Rectified Linear Unit (ReLU) functionalities in the peripheral Analog to Digital Converter (ADC). Leveraging 3D integration to embed pixel circuitry and weight storage, CTIA-IPC maintains pixel density comparable to standard CTIA designs. Moreover, our algorithm-circuit co-design optimization results in minimal accuracy drop while providing significant data bandwidth reduction. Evaluated on the EndoVis tissue dataset (1280×1024), CTIA-IPC achieves approximately 12× reduction in data bandwidth, yielding segmentation IoUs of 75.93% (parts), and 28.60% (instrument), a minimal accuracy reduction (∼1.3%–2.5%) compared to baseline methods. Achieving 1.98 GOPS throughput and 3.39 GOPS/W efficiency, our CTIA-IPC architecture offers a promising computational framework tailored specifically for biomedical near-tissue computing.
- Open Access
- 14 January 2026
- Published by Springer Nature
- p. 241-255
A Primer on Neuromorphic Hardware: Underlying Principles and Approaches—From Sensors to Processors
- 14 January 2026
- Published by Springer Nature
- p. 241-255
Open AccessA Primer on Neuromorphic Hardware: Underlying Principles and Approaches—From Sensors to Processors
- 12 January 2026
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Sensors Journal
- Vol. 26 (3) , 5254-5268
FPCA: Field-Programmable Pixel Convolutional Array for Extreme-Edge Intelligence
The rapid advancement of neural network applications necessitates hardware that not only accelerates computation but also adapts efficiently to dynamic processing requirements. While processing-in-pixel has emerged as a promising solution to overcome the bottlenecks of traditional architectures at the extreme-edge, existing implementations face limitations in reconfigurability and scalability due to their static nature and inefficient area usage. Addressing these challenges, we present a novel architecture that significantly enhances the capabilities of processing-in-pixel for convolutional neural networks. Our design innovatively integrates non-volatile memory (NVM) with novel unit pixel circuit design, enabling dynamic reconfiguration of synaptic weights, kernel size, channel size and stride size. Thus offering unprecedented flexibility and adaptability. With using a separate die for pixel circuit and storing synaptic weights, our circuit achieves a substantial reduction in the required area per pixel thereby increasing the density and scalability of the pixel array. Simulation results demonstrate dot product operations of the circuit, the non-linearity of its analog output and a novel bucket-select curvefit model is proposed to capture it. This work not only addresses the limitations of current in-pixel computing approaches but also opens new avenues for developing more efficient, flexible, and scalable neural network hardware, paving the way for advanced AI applications.
- 12 January 2026
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Sensors Journal
- Vol. 26 (3) , 5254-5268
FPCA: Field-Programmable Pixel Convolutional Array for Extreme-Edge Intelligence
The rapid advancement of neural network applications necessitates hardware that not only accelerates computation but also adapts efficiently to dynamic processing requirements. While processing-in-pixel has emerged as a promising solution to overcome the bottlenecks of traditional architectures at the extreme-edge, existing implementations face limitations in reconfigurability and scalability due to their static nature and inefficient area usage. Addressing these challenges, we present a novel architecture that significantly enhances the capabilities of processing-in-pixel for convolutional neural networks. Our design innovatively integrates non-volatile memory (NVM) with novel unit pixel circuit design, enabling dynamic reconfiguration of synaptic weights, kernel size, channel size and stride size. Thus offering unprecedented flexibility and adaptability. With using a separate die for pixel circuit and storing synaptic weights, our circuit achieves a substantial reduction in the required area per pixel thereby increasing the density and scalability of the pixel array. Simulation results demonstrate dot product operations of the circuit, the non-linearity of its analog output and a novel bucket-select curvefit model is proposed to capture it. This work not only addresses the limitations of current in-pixel computing approaches but also opens new avenues for developing more efficient, flexible, and scalable neural network hardware, paving the way for advanced AI applications.
- 23 October 2025
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Photonics Technology Letters
- Vol. 38 (3) , 164-167
Design of an Energy-Efficient Automatic Calibration Circuit for High Speed Photonic Cross-Coupled Memory
Microring Resonators (MRRs) have emerged as key photonic devices used in optical memory, computing, and high-speed communications. However, their practical deployment faces challenges due to fabrication sensitivities—particularly internal thermal crosstalk, process variations, and environmental fluctuations—that can cause shifts in their resonance wavelength. As a result, extensive monitoring and calibration are required to ensure the proper functioning of systems that rely on microrings. To overcome this, we present a novel voltage-controlled auto-calibration technique for photonic cross-coupled memory, such as photonic SRAM (pSRAM). This work enables stable and accurate microring control in pSRAM, advancing its application in optical memory systems and photonic computing. Additionally, we also present a multi-wavelength framework to reduce the thermal power consumption by $3.4\times $ in optical systems.
- 23 October 2025
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Photonics Technology Letters
- Vol. 38 (3) , 164-167
Design of an Energy-Efficient Automatic Calibration Circuit for High Speed Photonic Cross-Coupled Memory
Microring Resonators (MRRs) have emerged as key photonic devices used in optical memory, computing, and high-speed communications. However, their practical deployment faces challenges due to fabrication sensitivities—particularly internal thermal crosstalk, process variations, and environmental fluctuations—that can cause shifts in their resonance wavelength. As a result, extensive monitoring and calibration are required to ensure the proper functioning of systems that rely on microrings. To overcome this, we present a novel voltage-controlled auto-calibration technique for photonic cross-coupled memory, such as photonic SRAM (pSRAM). This work enables stable and accurate microring control in pSRAM, advancing its application in optical memory systems and photonic computing. Additionally, we also present a multi-wavelength framework to reduce the thermal power consumption by $3.4\times $ in optical systems.
- Open Access
X-pSRAM: A Photonic SRAM with Embedded XOR Logic for Ultra-Fast In-Memory Computing
Traditional von Neumann architectures suffer from fundamental bottlenecks due to continuous data movement between memory and processing units, a challenge that worsens with technology scaling as electrical interconnect delays become more significant. These limitations impede the performance and energy efficiency required for modern data-intensive applications. In contrast, photonic in-memory computing presents a promising alternative by harnessing the advantages of light, enabling ultra-fast data propagation without length-dependent impedance, thereby significantly reducing computational latency and energy consumption. This work proposes a novel differential photonic static random access memory (pSRAM) bitcell that facilitates electro-optic data storage while enabling ultra-fast in-memory Boolean XOR computation. By employing cross-coupled microring resonators and differential photodiodes, the XOR-augmented pSRAM (X-pSRAM) bitcell achieves at least 10 GHz read, write, and compute operations entirely in the optical domain. Additionally, wavelength-division multiplexing (WDM) enables n-bit XOR computation in a single-shot operation, supporting massively parallel processing and enhanced computational efficiency. Validated on GlobalFoundries' 45SPCLO node, the X-pSRAM consumed 13.2 fJ energy per bit for XOR computation, representing a significant advancement toward next-generation optical computing with applications in cryptography, hyperdimensional computing, and neural networks.
Open AccessX-pSRAM: A Photonic SRAM with Embedded XOR Logic for Ultra-Fast In-Memory Computing
Traditional von Neumann architectures suffer from fundamental bottlenecks due to continuous data movement between memory and processing units, a challenge that worsens with technology scaling as electrical interconnect delays become more significant. These limitations impede the performance and energy efficiency required for modern data-intensive applications. In contrast, photonic in-memory computing presents a promising alternative by harnessing the advantages of light, enabling ultra-fast data propagation without length-dependent impedance, thereby significantly reducing computational latency and energy consumption. This work proposes a novel differential photonic static random access memory (pSRAM) bitcell that facilitates electro-optic data storage while enabling ultra-fast in-memory Boolean XOR computation. By employing cross-coupled microring resonators and differential photodiodes, the XOR-augmented pSRAM (X-pSRAM) bitcell achieves at least 10 GHz read, write, and compute operations entirely in the optical domain. Additionally, wavelength-division multiplexing (WDM) enables n-bit XOR computation in a single-shot operation, supporting massively parallel processing and enhanced computational efficiency. Validated on GlobalFoundries' 45SPCLO node, the X-pSRAM consumed 13.2 fJ energy per bit for XOR computation, representing a significant advancement toward next-generation optical computing with applications in cryptography, hyperdimensional computing, and neural networks.
- Open Access
A Mixed-Signal Photonic SRAM-based High-Speed Energy-Efficient Photonic Tensor Core with Novel Electro-Optic ADC
The rapid surge in data generated by Internet of Things (IoT), artificial intelligence (AI), and machine learning (ML) applications demands ultra-fast, scalable, and energy-efficient hardware, as traditional von Neumann architectures face significant latency and power challenges due to data transfer bottlenecks between memory and processing units. Furthermore, conventional electrical memory technologies are increasingly constrained by rising bitline and wordline capacitance, as well as the resistance of compact and long interconnects, as technology scales. In contrast, photonics-based in-memory computing systems offer substantial speed and energy improvements over traditional transistor-based systems, owing to their ultra-fast operating frequencies, low crosstalk, and high data bandwidth. Hence, we present a novel differential photonic SRAM (pSRAM) bitcell-augmented scalable mixed-signal multi-bit photonic tensor core, enabling high-speed, energy-efficient matrix multiplication operations using fabrication-friendly integrated photonic components. Additionally, we propose a novel 1-hot encoding electro-optic analog-to-digital converter (eoADC) architecture to convert the multiplication outputs into digital bitstreams, supporting processing in the electrical domain. Our designed photonic tensor core, utilizing GlobalFoundries' monolithic 45SPCLO technology node, achieves computation speeds of 4.10 tera-operations per second (TOPS) and a power efficiency of 3.02 TOPS/W.
Open AccessA Mixed-Signal Photonic SRAM-based High-Speed Energy-Efficient Photonic Tensor Core with Novel Electro-Optic ADC
The rapid surge in data generated by Internet of Things (IoT), artificial intelligence (AI), and machine learning (ML) applications demands ultra-fast, scalable, and energy-efficient hardware, as traditional von Neumann architectures face significant latency and power challenges due to data transfer bottlenecks between memory and processing units. Furthermore, conventional electrical memory technologies are increasingly constrained by rising bitline and wordline capacitance, as well as the resistance of compact and long interconnects, as technology scales. In contrast, photonics-based in-memory computing systems offer substantial speed and energy improvements over traditional transistor-based systems, owing to their ultra-fast operating frequencies, low crosstalk, and high data bandwidth. Hence, we present a novel differential photonic SRAM (pSRAM) bitcell-augmented scalable mixed-signal multi-bit photonic tensor core, enabling high-speed, energy-efficient matrix multiplication operations using fabrication-friendly integrated photonic components. Additionally, we propose a novel 1-hot encoding electro-optic analog-to-digital converter (eoADC) architecture to convert the multiplication outputs into digital bitstreams, supporting processing in the electrical domain. Our designed photonic tensor core, utilizing GlobalFoundries' monolithic 45SPCLO technology node, achieves computation speeds of 4.10 tera-operations per second (TOPS) and a power efficiency of 3.02 TOPS/W.
- Open Access
Predictive Performance of Photonic SRAM-based In-Memory Computing for Tensor Decomposition
Photonics-based in-memory computing systems have demonstrated a significant speedup over traditional transistor-based systems because of their ultra-fast operating frequencies and high data bandwidths. Photonic static random access memory (pSRAM) is a crucial component for achieving the objective of ultra-fast photonic in-memory computing systems. In this work, we model and evaluate the performance of a novel photonic SRAM array architecture in development. Additionally, we examine hyperspectral operation through wavelength division multiplexing (WDM) to enhance the throughput of the pSRAM array. We map Matricized Tensor Times Khatri-Rao Product (MTTKRP), a computational kernel commonly used in tensor decomposition, to the proposed pSRAM array architecture. We also develop a predictive performance model to estimate the sustained performance of different configurations of the pSRAM array. Using the predictive performance model, we demonstrate that the pSRAM array achieves 17 PetaOps while performing MTTKRP in a practical hardware configuration.
Open AccessPredictive Performance of Photonic SRAM-based In-Memory Computing for Tensor Decomposition
Photonics-based in-memory computing systems have demonstrated a significant speedup over traditional transistor-based systems because of their ultra-fast operating frequencies and high data bandwidths. Photonic static random access memory (pSRAM) is a crucial component for achieving the objective of ultra-fast photonic in-memory computing systems. In this work, we model and evaluate the performance of a novel photonic SRAM array architecture in development. Additionally, we examine hyperspectral operation through wavelength division multiplexing (WDM) to enhance the throughput of the pSRAM array. We map Matricized Tensor Times Khatri-Rao Product (MTTKRP), a computational kernel commonly used in tensor decomposition, to the proposed pSRAM array architecture. We also develop a predictive performance model to estimate the sustained performance of different configurations of the pSRAM array. Using the predictive performance model, we demonstrate that the pSRAM array achieves 17 PetaOps while performing MTTKRP in a practical hardware configuration.
- Open Access
A Pathway to Near Tissue Computing through Processing-in-CTIA Pixels for Biomedical Applications
Near-tissue computing requires sensor-level processing of high-resolution images, essential for real-time biomedical diagnostics and surgical guidance. To address this need, we introduce a novel Capacitive Transimpedance Amplifier-based In-Pixel Computing (CTIA-IPC) architecture. Our design leverages CTIA pixels that are widely used for biomedical imaging owing to the inherent advantages of excellent linearity, low noise, and robust operation under low-light conditions. We augment CTIA pixels with IPC to enable precise deep learning computations including multi-channel, multi-bit convolution operations along with integrated batch normalization (BN) and Rectified Linear Unit (ReLU) functionalities in the peripheral ADC (Analog to Digital Converters). This design improves the linearity of Multiply and Accumulate (MAC) operations while enhancing computational efficiency. Leveraging 3D integration to embed pixel circuitry and weight storage, CTIA-IPC maintains pixel density comparable to standard CTIA designs. Moreover, our algorithm-circuit co-design approach enables efficient real-time diagnostics and AI-driven medical analysis. Evaluated on the EndoVis tissu dataset (1280x1024), CTIA-IPC achieves approximately 12x reduction in data bandwidth, yielding segmentation IoUs of 75.91% (parts), and 28.58% (instrument)-a minimal accuracy reduction (1.3%-2.5%) compared to baseline methods. Achieving 1.98 GOPS throughput and 3.39 GOPS/W efficiency, our CTIA-IPC architecture offers a promising computational framework tailored specifically for biomedical near-tissue computing.
Open AccessA Pathway to Near Tissue Computing through Processing-in-CTIA Pixels for Biomedical Applications
Near-tissue computing requires sensor-level processing of high-resolution images, essential for real-time biomedical diagnostics and surgical guidance. To address this need, we introduce a novel Capacitive Transimpedance Amplifier-based In-Pixel Computing (CTIA-IPC) architecture. Our design leverages CTIA pixels that are widely used for biomedical imaging owing to the inherent advantages of excellent linearity, low noise, and robust operation under low-light conditions. We augment CTIA pixels with IPC to enable precise deep learning computations including multi-channel, multi-bit convolution operations along with integrated batch normalization (BN) and Rectified Linear Unit (ReLU) functionalities in the peripheral ADC (Analog to Digital Converters). This design improves the linearity of Multiply and Accumulate (MAC) operations while enhancing computational efficiency. Leveraging 3D integration to embed pixel circuitry and weight storage, CTIA-IPC maintains pixel density comparable to standard CTIA designs. Moreover, our algorithm-circuit co-design approach enables efficient real-time diagnostics and AI-driven medical analysis. Evaluated on the EndoVis tissu dataset (1280x1024), CTIA-IPC achieves approximately 12x reduction in data bandwidth, yielding segmentation IoUs of 75.91% (parts), and 28.58% (instrument)-a minimal accuracy reduction (1.3%-2.5%) compared to baseline methods. Achieving 1.98 GOPS throughput and 3.39 GOPS/W efficiency, our CTIA-IPC architecture offers a promising computational framework tailored specifically for biomedical near-tissue computing.