Yasuo Shimizu

Electrical properties of heterojunctions of group-III nitrides are largely sensitive to interface charges due to the discontinuity of polarizations. By means of surface-activated bonding of double-side polished freestanding GaN (0001) wafers, we fabricate Ga-face/Ga-face and N-face/N-face interfaces with antiparallel spontaneous polarizations, i.e. interfaces with the greatest discontinuity of polarizations, to investigate their electrical and nanostructural properties. Built-in potential of N-face/N-face interface is smaller than that of Ga-face/Ga-face interface after a post-bonding annealing at 600 °C. The difference in built-in potentials between the two antiparallel polarized interfaces is analyzed in the framework of charge-neutrality-level model with effects of antiparallel polarizations incorporated, and the density of interface states is roughly estimated. The leak is enhanced in both Ga-face/Ga-face and N-face/N-face interfaces by annealing at higher temperatures. Contribution of defects observed in the vicinity of bonding interfaces is suggested.

A GaN-on-diamond structure is the most promising candidate for improving the heat dissipation efficiency of GaN-based power devices. Room-temperature bonding of GaN and diamond is an efficient technique for fabricating this structure. However, it is extremely difficult to polish diamond to an average roughness (Ra) below 0.4 nm, especially for polycrystalline diamond. In this work, Room-temperature bonding of GaN and rough-surfaced diamond with a SiC layer was successfully achieved by a surface-activated bonding (SAB) method. The diamond surface’s initial Ra value was 0.768 nm, but after deposition of the SiC layer, the Ra decreased to 0.365 nm. The SiC layer formed at the as-bonded GaN/diamond interface was amorphous, with a thickness of about 7 nm. After annealing at 1000-°C, the amorphous SiC layer became polycrystalline, and its thickness increased to approximately 12 nm. These results indicate that the deposition of a SiC layer on diamond can efficiently lower the diamond surface’s roughness and thus facilitate room-temperature bonding.

Mucosal-associated invariant T (MAIT) cells, a blossoming member of the innate-like T cells, play a pivotal role in host defense through engaging the mucosal immunity. Although it has been suggested that MAIT cells are somehow implicated in the allergic airway inflammation mediated by group 2 innate lymphoid cells (ILC2s) such as asthma, the precise role(s) of MAIT cells in such inflammation has remained elusive. To explore the possible roles of MAIT cells in the inflammation, we examined whether MAIT cells suppressed the production of T helper (Th) 2 and inflammatory cytokines from ILC2s, and constrained the proliferation of ILC2s, both of which are prerequisite for airway inflammation. Given that laboratory mice are poor at MAIT cells, a novel mouse line rich in MAIT cells was used. We found that mice rich in MAIT cells showed alleviated airway inflammation as evidenced by reduced infiltration of the immune cells and hyperplasia in goblet cells in the lung concomitant with compromised production of Th2 and inflammatory cytokines, while wild type mice exhibited severe inflammation upon challenge with the fungal extracts. In vitro coculture experiments using purified ILC2s and MAIT cells unrevealed that cytokine-stimulated MAIT cells suppressed ILC2s to produce the cytokines as well as to proliferate most likely via production of IFN-γ. Furthermore, reconstitution of the allergic airway inflammation in the highly immunocompromised mice showed that ILC2-mediated inflammation was alleviated in mice that received MAIT cells along with ILC2s. We concluded that MAIT cells played a crucial role in suppressing the cytokine-producing capacity of ILC2s and ILC2 proliferation, that ultimately led to decrease in the allergic airway inflammation.The results open up a novel therapeutic horizon in ILC2-mediated inflammatory diseases by modulating MAIT cell activity.

Chemical composition around diamond/silicon heterointerfaces fabricated by surface activated bonding (SAB) at room temperature is examined by energy-dispersive X-ray spectroscopy under scanning transmission electron microscopy. Iron impurities segregate just on the bonding interfaces, while oxygen impurities segregate off the bonding interfaces in the silicon side by 3–4 nm. Oxygen atoms would segregate so as to avoid the amorphous compound with silicon and carbon atoms, self-organized at the bonding interfaces in the SAB process. When the bonding interfaces are annealed at 1000 °C, the amorphous compound converts into cubic silicon carbide (c-SiC), and nano-voids 5–15 nm in size are formed at the region between silicon and c-SiC, at which the oxygen density is high before annealing. The nano-voids can act as the gettering sites in which metal impurities are preferentially agglomerated, and the impurity gettering would help to improve the electronic properties of the bonding interfaces by annealing.

We fabricate AlGaN/GaN high electron mobility transistors (HEMTs) on diamond substrates by transferring 8 μm heterostructures grown on 3C-SiC/Si templates and subsequently applying the conventional device process steps. No exfoliation of 3C-SiC/diamond bonding interfaces is observed during 800 °C annealing, the essential step for forming ohmic contacts on nitrides. The thermal resistance of HEMTs on diamond is 35% of that of HEMTs on Si, which is assumed to be the origin of smaller negative drain conductance in on-diamond HEMTs. The results imply that the bonding-first process is applicable for fabricating low-thermal-resistance HEMTs with thick nitride layers.

In this work, we fabricated Ga ₂ O ₃ (001)/Si(100) and Ga ₂ O ₃ (010)/Si(100) heterointerfaces by surface activated bonding at room temperature and investigated the effect of Si thickness on the thermal stability of the heterointerfaces by heating the bonding samples at different temperatures. The heterointerface with a thin Si exhibited a good thermal stability at 1000 °C. A 4 nm thick intermediate layer with a uniform thickness was formed at the as-bonded Ga ₂ O ₃ (001)/Si(100) heterointerface, but for the as-bonded Ga ₂ O ₃ (010)/Si(100) heterointerface, an intermediate layer with a non-uniform thickness was formed. The thickness of both intermediate layers ranged from 3.6 to 5.4 nm and decreased after annealing at 500 °C, followed by an increase after annealing at 1000 °C. The component of the intermediate layer includes Ga, O, and Si atoms.

In diamond/silicon heterointerfaces fabricated by surface activated bonding at room temperature, an amorphous layer with carbon and silicon is formed in the bonding process, via atomic intermixing across the interfaces. The layer is crystallized by 1000°C annealing, forming a SiC compound.

The direct integration of gallium nitride (GaN) and diamond holds much promise for high‐power devices. However, it is a big challenge to grow GaN on diamond due to the large lattice and thermal‐expansion coefficient mismatch between GaN and diamond. In this work, the fabrication of a GaN/diamond heterointerface is successfully achieved by a surface activated bonding (SAB) method at room temperature. A small compressive stress exists in the GaN/diamond heterointerface, which is significantly smaller than that of the GaN‐on‐diamond structure with a transition layer formed by crystal growth. A 5.3 nm‐thick intermediate layer composed of amorphous carbon and diamond is formed at the as‐bonded heterointerface. Ga and N atoms are distributed in the intermediate layer by diffusion during the bonding process. Both the thickness and the sp²‐bonded carbon ratio of the intermediate layer decrease as the annealing temperature increases, which indicates that the amorphous carbon is directly converted into diamond after annealing. The diamond of the intermediate layer acts as a seed crystal. After annealing at 1000 °C, the thickness of the intermediate layer is decreased to approximately 1.5 nm, where lattice fringes of the diamond (220) plane are observed.

The three-dimensional distribution of oxygen atoms segregated at Σ9{114} grain boundaries (GBs) in Czochralski-grown silicon ingots is analyzed within a high spatial resolution of less than 0.5 nm by atom probe tomography combined with a focused ion beam (FIB) operated at −150 °C. The analysis reveals a segregation of oxygen atoms within a range of 2.5 nm across the GB plane, which is much narrower in comparison with the previous reports obtained using a conventional FIB. The oxygen concentration profile accurately reflects the distribution of the segregation sites, which exist at bond-centered sites under tensile stresses above 2 GPa, as calculated by ab initio local stress calculations.