Renxiao Xu

The geometric designs of MEMS devices can profoundly impact their physical properties and eventual performances. However, it is challenging for researchers to rationally consider a large number of possible designs, as it would be very time- and resource-consuming to study all these cases using numerical simulation. In this paper, we report the use of deep learning techniques to accelerate the MEMS design cycle by quickly and accurately predicting the physical properties of numerous design candidates with vastly different geometric features. Design candidates are represented in a nonparameterized, topologically unconstrained form using pixelated black-and-white images. After sufficient training, a deep neural network can quickly calculate the physical properties of interest with good accuracy without using conventional numerical tools such as finite element analysis. As an example, we apply our deep learning approach in the prediction of the modal frequency and quality factor of disk-shaped microscale resonators. With reasonable training, our deep learning neural network becomes a high-speed, high-accuracy calculator: it can identify the flexural mode frequency and the quality factor 4.6 × 10³ times and 2.6 × 10⁴ times faster, respectively, than conventional numerical simulation packages, with good accuracies of 98.8 ± 1.6% and 96.8 ± 3.1%, respectively. When simultaneously predicting the frequency and the quality factor, up to ~96.0% of the total computation time can be saved during the design process. The proposed technique can rapidly screen over thousands of design candidates and promotes experience-free and data-driven MEMS structural designs.

A time- and cost-effective fabrication methodology via a two-mode mechanical cutting process for multilayer stretchable electronics has been developed without using the conventional photolithography-based processes. A commercially available vinyl cutter is used for defining complex patterns on designated material layers by adjusting the applied force and the depth of the cutting blade. Two distinct modes of mechanical cutting can be achieved and employed to establish the basic fabrication procedures for common features in stretchable electronics, such as the metal interconnects, contact pads, and openings by the “tunnel cut” mode, and the flexible overall structure by the “through cut” mode. Three robust and resilient stretchable systems have been demonstrated, including a water-resistant, omnidirectionally stretchable supercapacitor array, a stretchable mesh applicable in sweat extraction and sensing, and a skin-mountable human breathing monitoring patch. Results show excellent electronic performances of these devices made of multilayer functional materials after repetitive large deformations.

Integrating deformable interconnects with inorganic functional materials establishes a path to high‐performance stretchable electronics. A number of applications demand that these systems sustain large deformations under repetitive loading. In this manuscript, the influence of the elastomeric substrate on the stretchability of serpentine interconnects is investigated theoretically and experimentally. Finite element analyses (FEA) reveal a substantial increase in the elastic stretchability with reductions in substrate thickness. Low‐cycle fatigue tests confirm this trend by examining the stretch required to form fatigue cracks associated with plastic deformation. To elucidate the mechanics governing this phenomenon, the buckling behaviors of deformed serpentine interconnects on substrates of various thicknesses are examined. The analytical model and FEA simulations suggest a change in the buckling mode from local wrinkling to global buckling below a critical thickness of the substrate. Scanning electron microscope and 3D optical profiler studies verify this transition in buckling behavior. The global buckling found in thin substrates accommodates large stretching prior to plastic deformation of the serpentines, thereby drastically enhancing the stretchability of these systems.

Many recently developed soft, skin‐like electronics with high performance circuits and low modulus encapsulation materials can accommodate large bending, stretching, and twisting deformations. Their compliant mechanics also allows for intimate, nonintrusive integration to the curvilinear surfaces of soft biological tissues. By introducing a stacked circuit construct, the functional density of these systems can be greatly improved, yet their desirable mechanics may be compromised due to the increased overall thickness. To address this issue, the results presented here establish design guidelines for optimizing the deformable properties of stretchable electronics with stacked circuit layers. The effects of three contributing factors (i.e., the silicone interlayer, the composite encapsulation, and the deformable interconnects) on the stretchability of a multilayer system are explored in detail via combined experimental observation, finite element modeling, and theoretical analysis. Finally, an electronic module with optimized design is demonstrated. This highly deformable system can be repetitively folded, twisted, or stretched without observable influences to its electrical functionality. The ultrasoft, thin nature of the module makes it suitable for conformal biointegration.

The rapid development of portable and wearable electronics has greatly increased the demand for energy storage devices with similar physical properties and integration capability. This paper introduces a honeycomb polydimethylsiloxane substrate for stretchable microsupercapacitor (MSC) arrays, which enables facile integration with other electronics. The honeycomb structure can accommodate a large deformation without producing excessive strain in the MSCs and interconnects. The results of this study show that such stretchable MSC arrays with single-walled carbon nanotube electrodes demonstrate excellent rate capability and power performance as well as electrochemical stability up to 150% (zero prestrain) or 275% (−50% prestrain) stretching and under excessive bending or twisting. The present stretchable MSC arrays with honeycomb structures show high potential for integration with other electronics, such as energy harvesters, power management circuits, wireless charging circuits, and various sensors, encompassing a wide range of wearable, bioimplantable electronic systems.

Significance: Existing options for electrical power generation and storage in wearable electronics are incompatible with thin geometries, soft, stretchable mechanics, and lightweight construction needed for long‐lived, intimate interfaces with the skin. Here we demonstrate concepts that allow the integration of collections of thin, millimeter-scale solid-state batteries and multijunction solar cells into electrically interconnected arrays that simultaneously provide high-performance operation and soft, biocompatible mechanics at the system level. Examples in photovoltaic energy harvesting, storage, and overall power management illustrate some of the functional options with such platforms. Thin, wearable wireless sensors for skin thermography with capabilities in data logging demonstrate the combined use of components for energy storage, power management, digital memory, physiological monitoring, and wireless, near-field communications in an integrated, stretchable device architecture with the ability to establish robust, nonirritating measurement interfaces directly to the skin.

Optogenetic studies of the peripheral nervous system and spinal cord are enabled by soft, wirelessly powered biocompatible devices. Optogenetics allows rapid, temporally specific control of neuronal activity by targeted expression and activation of light-sensitive proteins. Implementation typically requires remote light sources and fiber-optic delivery schemes that impose considerable physical constraints on natural behaviors. In this report we bypass these limitations using technologies that combine thin, mechanically soft neural interfaces with fully implantable, stretchable wireless radio power and control systems. The resulting devices achieve optogenetic modulation of the spinal cord and peripheral nervous system. This is demonstrated with two form factors; stretchable film appliqués that interface directly with peripheral nerves, and flexible filaments that insert into the narrow confines of the spinal epidural space. These soft, thin devices are minimally invasive, and histological tests suggest they can be used in chronic studies. We demonstrate the power of this technology by modulating peripheral and spinal pain circuitry, providing evidence for the potential widespread use of these devices in research and future clinical applications of optogenetics outside the brain.

Fractal-inspired designs for interconnects that join rigid, functional devices can ensure mechanical integrity in stretchable electronic systems under extreme deformations. The bonding configuration of such interconnects with the elastomer substrate is crucial to the resulting deformation modes, and therefore the stretchability of the entire system. In this study, both theoretical and experimental analyses are performed for postbuckling of fractal serpentine interconnects partially bonded to the substrate. The deformation behaviors and the elastic stretchability of such systems are systematically explored, and compared to counterparts that are not bonded at all to the substrate.

Advanced materials and fractal design concepts form the basis of a 3D conformal electronic platform with unique capabilities in cardiac electrotherapies. Fractal geometries, advanced electrode materials, and thin, elastomeric membranes yield a class of device capable of integration with the entire 3D surface of the heart, with unique operational capabilities in low power defibrillation. Co‐integrated collections of sensors allow simultaneous monitoring of physiological responses. Animal experiments on Langendorff‐perfused rabbit hearts demonstrate the key features of these systems.