Bernd Kieback

Multivariant experimental investigations and multiphysics microstructural modeling of the spark plasma sintering process of metallic powders have been performed up to a relative density of approximately 80%. In comparison, the effect of sintering temperature, pressure, and particle size on the interparticle contact area growth and axial shrinkage of cylindrical specimens of copper and nickel particles is measured in laboratory scaled tests. Herein, for the first time all relevant for sintering phenomena are considered simultaneously: the fully coupled thermo‐electro‐mechanical modeling of the spark plasma sintering processes, additionally taking into account for lattice, grain boundary, surface diffusion, electromigration, and thermomigration, has been carried out. The computational analysis of various physical phenomena allows to identify dominant and insignificant mechanisms. The two‐level numerical simulation includes the modeling of the sintering setup at the macroscopic level and the neck formation process in particle chain systems at the microscopic level. The results of the numerical simulations show a very good agreement with the experimental data. Therefore, the impact of electrical and mechanical loads as well as of particle size on microscopic distribution of temperature, inelastic strain, and on densification has been studied by the finite element simulations.

In the present research, a numerical modeling approach of the initial stage of consolidation during spark plasma sintering on the microscopic scale is presented. The solution of a fully coupled thermo-electro-mechanical problem also accounting for grain boundary and surface diffusion is found by using a staggered way. The finite-element method is applied for solving the thermo-electro-mechanical problem while the finite-difference method is applied for the diffusion problem. A Lagrange-based non-linear formulation is used to deal with the detailed description of plastic and creep strain accumulation. The numerical model is developed for simulating the structural evolution of the involved particles during sintering of powder compacts taking into account both the free surface diffusion of the particles and the grain boundary diffusion at interparticle contact areas. The numerical results obtained by using the two-particle model—as a representative volume element of the powder—are compared with experimental results for the densification of a copper powder compact. The numerical and experimental results are in excellent agreement.

The mechanisms of densification during spark plasma sintering (SPS) of spherical copper particles are investigated both experimentally and analytically. Experimentally measured densification rates are compared to expected contributions to densification coming from Coble creep, Nabarro-Herring creep, power-law creep, and pressure-assisted sintering described by the two-particle model. The results indicate densification by Coble creep or a low-temperature version of power-law creep in the investigated range of temperature and pressure at a relative density of 70%. The findings are supported by (i) activation energies obtained for various conditions using the Dorn-method as well as (ii) the pressure dependence of the densification rate.

The mechanisms of densification in spark plasma sintering (SPS) were investigated both analytically and numerically for a model system of two spherical metallic powder particles. From the microscopic temperature distribution, the possibility of a micro-local overheating of the particle–particle contacts was analysed for different particle sizes, contact geometries, materials, and electrical loads. It is shown that, for particles below the size of one millimetre, local overheating is below one Kelvin. Subsequently, the material transport by thermomigration, electromigration, and diffusion driven by surface curvature and external pressure was derived from microscopic field distributions obtained from analytical calculations and finite-element simulations. The results show that, while the mechanical pressure accelerates material transport by orders of magnitude, the electrical current and the temperature gradients do not. It is also shown that pulsing the current has no significant influence on the densification rate.

Adding trace elements (Cd, In, Sn) to Al‐Cu‐based alloys can significantly improve their strength by the growth of small and finely distributed θ′ precipitates. However, the underlying atomic mechanisms of their nucleation are so far only superficially understood. We follow the precipitation process, that is changes in the microstructure, by different methods: differential scanning calorimetry (DSC), giving information on formation and dissolution of precipitates, 3D atom probe tomography (3DAP), giving information on size and density of precipitates and finally, positron annihilation lifetime spectroscopy (PALS), being sensitive especially to quenched‐in vacancies and their interaction with alloying elements. By the use of these complementary methods we obtain information on vacancy binding to the alloying elements and also on structure, kind and distribution of precipitates while correlating this with hardness measurements.