Bo Wang

Hierarchical three dimensional (3D) microstructures integrated with low‐dimensional nanomaterials can realize novel properties or improved performance. We report a unique conductive and highly ordered 3D silicon micro‐mesh structure, which is fabricated by standard lithography using a modified plasma etch process. Zinc oxide (ZnO) nanowires are then integrated with the micro‐mesh, and the density of ZnO nanowires (NWs) can be increased by around one order of magnitude compared with ZnO NWs on a 2D substrate. Owing to the high spatial density of ZnO NWs on the robust 3D silicon micro‐mesh structures, improved photocatalytic activity and stability can be achieved. A remarkable enhancement of photocurrent response is also observed. The ZnO can be converted into ZnS NWs and ZnO@ZIF‐8 as on the micromesh. This method is low‐cost and compatible with traditional complementary metal–oxide–semiconductor industries, and provides new possibilities for a wide range of devices based on micro‐nano‐electro‐mechanical and chemical systems.