Aastha Uppal
Current Organizations / Institutes
The organizations/institutes from the scholar's latest article
Research Subjects
Aastha Uppal has a total of 5 co-authors. Here are the top co-authors by number of shared publications:
- Frank Z. Liang
Intel Corporation, 5200 NE Elam Young Pkwy, HF2, Hillsboro, OR 97124
1 shared publication - Je-Young Chang
Intel Corporation, 5000 W. Chandler Boulevard, CH5-157, Chandler, AZ 85226
1 shared publication - Jerrod Peterson
Intel Corporation, 5200 NE Elam Young Pkwy, HF3, Hillsboro, OR 97124
1 shared publication - Weihua Tang
Intel Corporation, 5000 W. Chandler Boulevard, CH5-157, Chandler, AZ 85226
1 shared publication - Xi Guo
Intel Corporation, 5200 NE Elam Young Pkwy, HF3, Hillsboro, OR 97124
1 shared publication
Latest Publications
- 1 March 2019
- Published by ASME International in Journal of Electronic Packaging
- Vol. 141 (1)
Thermomechanical Interaction Between Thin Bare-Die Package and Thermal Solution in Next-Generation Mobile Computing Platforms
The demands for both thinner bare-die ball grid array (BGA) packages and thinner thermal solutions have added complexity for the thermal enabling design and material options associated with system on chip packages in mobile personal computer (PC) platforms. The thermomechanical interactions between the bare-die package and the thermal solution are very critical, creating the needs for: (1) an in-depth thermomechanical characterization to understand their impacts on product quality and performance and (2) a simple and yet robust modeling methodology to analyze design parameters using a commercially available software. In this paper, experimental metrologies and modeling methodology are developed with the details of contents documented. Validation of the newly developed tools and recommendation/guidance are also discussed for detailed assessments of thermomechanical tradeoffs for optimal design spaces for next-generation mobile platforms.
- 1 March 2019
- Published by ASME International in Journal of Electronic Packaging
- Vol. 141 (1)
Thermomechanical Interaction Between Thin Bare-Die Package and Thermal Solution in Next-Generation Mobile Computing Platforms
The demands for both thinner bare-die ball grid array (BGA) packages and thinner thermal solutions have added complexity for the thermal enabling design and material options associated with system on chip packages in mobile personal computer (PC) platforms. The thermomechanical interactions between the bare-die package and the thermal solution are very critical, creating the needs for: (1) an in-depth thermomechanical characterization to understand their impacts on product quality and performance and (2) a simple and yet robust modeling methodology to analyze design parameters using a commercially available software. In this paper, experimental metrologies and modeling methodology are developed with the details of contents documented. Validation of the newly developed tools and recommendation/guidance are also discussed for detailed assessments of thermomechanical tradeoffs for optimal design spaces for next-generation mobile platforms.