Pavol Konopka
Research Subjects
Research Interests
Pavol Konopka has a total of 4 co-authors. Here are the top co-authors by number of shared publications:
Eva Cuninková
Slovak University Of Technology In Bratislava , Faculty Of Materials Science And Technology In Trnava, Institute Of Materials Science , Ulica Jána Bottu 2781/25, 917 24 Trnava
1 shared publication- Jozef Misik
Slovak University Of Technology In Bratislava , Faculty Of Materials Science And Technology In Trnava, Institute Of Materials Science , Ulica Jána Bottu 2781/25, 917 24 Trnava
1 shared publication - Marcela Pekarčíková
Slovak University of Technology in Bratislava
1 shared publication - Michal Skarba
Faculty of Materials Science and Technology in Trnava, Slovak University of Technology in Bratislava, Jána Bottu 2781/25, 917-24 Trnava, Slovakia
1 shared publication
Latest Publications
- Open Access
- 1 September 2018
- Published by Walter de Gruyter GmbH in Research Papers Faculty of Materials Science and Technology Slovak University of Technology
- Vol. 26 (43) , 53-60
Structural Analysis of Superconductors at MTF: A Review
The activities of the young STU MTF research team focused on the material properties of superconductors were reviewed for the first time. We performed structural analyses on multiple types of superconducting tapes in order to get deeper insight into the correlation between their structure and electromagnetic properties, both experimentally and by modelling. We also addressed the joining of tapes by lead-free solders.
- 1 September 2018
- Published by Walter de Gruyter GmbH in Research Papers Faculty of Materials Science and Technology Slovak University of Technology
- Vol. 26 (43) , 53-60
Open AccessStructural Analysis of Superconductors at MTF: A Review
The activities of the young STU MTF research team focused on the material properties of superconductors were reviewed for the first time. We performed structural analyses on multiple types of superconducting tapes in order to get deeper insight into the correlation between their structure and electromagnetic properties, both experimentally and by modelling. We also addressed the joining of tapes by lead-free solders.