Mariana Amorim Fraga

Microelectromechanical systems sensors operating in harsh environments characterized by high temperatures, corrosive atmospheres, radiation, high pressure, and extreme mechanical loads are increasingly critical for aerospace, energy, automotive, nuclear, and industrial systems. Conventional silicon-based materials and standard device architectures, although highly successful under moderate conditions, face coupled limits in carrier leakage, interface stability, drift, and package reliability. This review article, supported by structured evidence mapping and quantitative comparative synthesis, differs from recent material-specific or sensor-specific surveys by organizing the field through an environment-to-system co-design framework that connects five decision levels: material properties, transduction metrics, structural architecture, fabrication and packaging interfaces, and reliability qualification. Quantitative comparison tables report bandgap, coefficient of thermal expansion, demonstrated operating temperature, sensitivity, drift, and quality factor where comparable data are available. The analysis shows that no material is intrinsically a complete harsh-environment solution: the usable envelope is set by the weakest element among the active material, electrodes, interfaces, package, and electronics. The resulting framework provides selection rules, identifies where silicon-on-insulator remains a bounded bridge technology, and highlights research needs in combined-environment qualification, scalable heterogeneous integration, and design.

Diamond-like carbon (DLC) films have emerged as key materials for enhancing the performance, reliability, and durability of microsystems and microdevices. This perspective article presents an analysis of the scientific and technological evolution of DLC from a conventional protective coating to a multifunctional platform material for microsystems and microdevices. Recent advances in tailoring the mechanical, electrical, chemical, and surface properties of DLC have been discussed, highlighting its potential to mitigate friction, adhesion, and wear in microelectromechanical systems (MEMS), while enabling new functionalities in microsensors, biomedical devices, and microelectronic platforms. Despite significant progress, several challenges continue to hinder broader technological adoption, including residual stress management, low-temperature deposition compatible with complementary metal–oxide–semiconductor (CMOS) processes, large-area scalability, and long-term reliability under demanding operating conditions. Future developments are expected to rely on engineered DLC architectures, such as doped, multilayer, and nanostructured films, combined with advanced surface functionalization and intelligent process optimization to meet application-specific requirements. Furthermore, the need for standardized integration strategies that bridge the gap between laboratory-scale research and industrial manufacturing is emphasized.

Hydrogen is emerging as an outstanding sustainable energy alternative in the global shift toward renewable energy innovations. Photoelectrochemical (PEC) water splitting has gained attention as an environmentally friendly and efficient method for hydrogen production by harnessing solar energy. Among the various semiconductors investigated for PEC applications, silicon carbide (SiC) stands out due to its favorable energy band structure aligned with water redox potentials and exceptional chemical stability. Specifically, cubic SiC (3C-SiC) has drawn significant attention owing to its optimal bandgap of 2.36 eV, which allows for absorption of a portion of the visible spectrum. This chapter explores the recent advancements in SiC nanostructures, such as thin films, nanoparticles, and nanowires, for PEC water splitting applications. We highlight advanced fabrication techniques, examine the challenges encountered in integrating SiC into PEC systems, and discuss the practical outcomes. Focusing on future opportunities, this chapter aims to provide an overview of the current status of SiC technology’s role in PEC water splitting, inspiring further exploration and innovation in this emerging field.

Semiconductor thin films are more than just materials—they are catalysts driving MEMS sensor technology toward enhanced performance, miniaturization, and cost-effectiveness. Recent innovations have highlighted their use, such as flexible transparent conductors and wide-bandgap materials, opening new possibilities—from wearable devices for medical applications to robust solutions for harsh environments. This perspective article explores the critical contributions of semiconductor thin films, including amorphous silicon (a-Si), polysilicon, silicon carbide (SiC), gallium nitride (GaN), and indium tin oxide (ITO), across a wide range of applications, from automotive systems to IoT-enabled smart technologies. SiC and GaN, known for their resilience in extreme conditions, and ITO, crucial for transparent, conductive devices, exemplify the expanding capabilities of these materials in industry 4.0 applications. Moreover, the transition from MEMS to NEMS is gaining attention, driven by advances in semiconductor thin film synthesis and design, which enable unprecedented device scaling and sensitivity. We also address emerging challenges, such as scalability and material consistency, and future directions for these materials in the development of future smart, interconnected and high-performance electronics systems.

A epicondilite lateral é caracterizada por microlesões e inflamação nos tendões dos músculos extensores. Vários métodos terapêuticos estão disponíveis para o manejo da epicondilite lateral, mas não há consenso sobre qual é o melhor. A Terapia de Fotobiomodulação (TFBM) vem sendo uma ótima opção de tratamento para essa afecção, pois sua ação age diretamente na modulação da inflamação e reparação tecidual. Trata-se de um estudo de revisão integrativa da literatura com estratégia direta de busca na plataforma PubMed. Foram incluídos artigos publicados no período de 2006 a 2023. Uma pesquisa avaliou a eficácia de um dispositivo desenvolvido com luz LED na região do epicôndilo lateral e direcionado para região do cotovelo. Os resultados deste estudo demonstraram melhorias significativas nos sintomas álgicos, da função, pressão e pinça após 6 semanas de uso da órtese e necessita de mais pesquisas para avançar no tratamento da epicondilite lateral, sugerindo uma ótima ferramenta para continuar com a pesquisas para essa afecção.