Zhongnan Xie

Paraffin wax (PW) has significant potential for spacecraft thermal management, but low thermal conductivity and leakage issues make it no longer sufficient for the requirements of evolving spacecraft thermal control systems. Although free-state expanded graphite (EG) as a thermal conductivity enhancer can ameliorate the above problems, it remains challenging to achieve higher thermal conductivity (K) (>8 W/(m·K)) at filler contents below 10 wt.% and to mitigate the leakage problem. Two preparations of thermally conductive shape-stabilized PW/EG composites, using the pressure-induced method and prefabricated skeleton method, were designed in this paper. The expanded graphite formed a nanoscale porous structure by different methods, which enhanced the capillary action between the graphite flake layers, improved the adsorption and encapsulation of EG, and alleviated the leakage problem. The thermal conductivity and the latent heat of the phase-change materials (PCM) prepared by the two methods mentioned above are 9.99 W/(m·K), 10.70 W/(m·K) and 240.06 J/g, 231.67 J/g, respectively, at EG loading by 10 wt.%, and the residual mass fraction was greater than 99% after 50 cycles of high and low temperature. In addition, due to the excellent thermal management capability of PW/EG, the operating temperature of electronic components can be stably maintained at 68–71 °C for about 15 min and the peak temperature can be reduced by at least 23 °C when the heating power of the electronic components is 10 w. These provide novel and cost-effective methods to further improve the management capability of spacecraft thermal control systems.

As a thermal interface material, diamond/GaInSn composites have wide-ranging application prospects in the thermal management of chips. However, studies on systematic reliability that can guide the practical application of diamond/GaInSn in the high-temperature, high-temperature impact, or high-humidity service environments that are faced by chips remain lacking. In this study, the performance evolution of diamond/GaInSn was studied under high-temperature storage (150 °C), high- and low-temperature cycling (−50 °C to 125 °C), and high temperature and high humidity (85 °C and 85% humidity). The experimental results reveal the failure mechanism of semi-solid composites during high temperature oxidation. It is revealed that core oxidation is the key to the degradation of liquid metal composites’ properties under high-temperature storage and high- and low-temperature cycling conditions. Under the conditions of high temperature and high humidity, the failure of Ga-based liquid metal and its composite materials is significant. Therefore, the material should avoid high-temperature and high-humidity environments.

To enhance the heat transfer performance of GaInSn liquid metal, a new type of composite thermal interface material with GaInSn as thermal conductive matrix and silver-coated copper particles as thermal conductive fillers was prepared in this article. The morphology of the composites were characterized by scanning electron microscopy. The thermal conductivity of silver-coated copper/GaInSn composites with different silver-coated copper particle contents were measured by laser flash method. The interfacial bonding of the composites were investigated by X-ray diffraction. The results show that when the volume ratio of silver-coated copper particles is 15%, thermal conductivity of the silver-coated copper/GaInSn composite reaches the largest value of 25.01 W·m⁻¹·K⁻¹. The silver-coated copper/GaInSn composite material and commercially available thermal grease were put into the chip and copper plate to simulate the actual application scenarios for comparison. The heat dissipation capacity of silver-coated copper/GaInSn composite material is obviously better than that of the two commercially available thermal grease, and the chip temperature can be reduced by about 5°C.

The use of a micro heat sink is an effective means of solving the problem of high-power chip heat dissipation. Diamond/Cu composites exhibit high thermal conductivity and a linear thermal expansion coefficient that is compatible with semiconductor materials, rendering them ideal micro heat sink materials. The aim of this study was to fabricate diamond/Cu and Cu separately as heat sinks and subject them to flow boiling heat transfer experiments. The results indicate that the diamond/Cu heat sink displayed a decrease in wall superheat of 10.2–14.5 °C and an improvement in heat transfer coefficient of 38–51% compared with the Cu heat sink under identical heat fluxes. The heat sink also exhibits enhanced thermal uniformity. Secondary diamond particles are incorporated into the gaps of the main diamonds, thereby constructing a three-dimensional heat conduction network within the composite material. The diamond network enhances the internal heat flux of the material while also creating more nucleation sites on the surface. These increase the boiling intensity of the diamond/Cu heat sink, leading to better heat transfer performance. By combining the transient thermal model with computational fluid dynamics, a heat transfer model based on the diamond/Cu heat sink is proposed. The efficient heat dissipation capability of diamond/Cu heat sinks can lower the working temperature of microelectronic devices, thereby improving device performance and reliability during operation.

The interface microzone characteristics determine the thermophysical properties of diamond/Cu composites, while the mechanisms of interface formation and heat transport still need to be revealed. Here, diamond/Cu-B composites with different boron content were prepared by vacuum pressure infiltration. Diamond/Cu-B composites up to 694 W/(mK) were obtained. The interfacial carbides formation process and the enhancement mechanisms of interfacial heat conduction in diamond/Cu-B composites were studied by HRTEM and first-principles calculations. It is demonstrated that boron can diffuse toward the interface region with an energy barrier of 0.87 eV, and these elements are energetically favorable to form the B₄C phase. The calculation of the phonon spectrum proves that the B₄C phonon spectrum is distributed in the range of the copper and diamond phonon spectrum. The overlapping of phonon spectra and the dentate structure together enhance the interface phononic transport efficiency, thereby improving the interface thermal conductance.

Copper is often used as a heat-dissipating material due to its high thermal conductivity. In order to improve its heat dissipation performance, one of the feasible methods is to compound copper with appropriate reinforcing phases. With excellent thermal properties, graphene has become an ideal reinforcing phase and displays great application prospects in metal matrix composites. However, systematic theoretical research is lacking on the thermal conductivity of the copper–graphene interface and associated affecting factors. Molecular dynamics simulation was used to simulate the interfacial thermal conductivity of copper/graphene composites, and the effects of graphene layer number, atomic structure, matrix length, and graphene vacancy rate on thermal boundary conductance (TBC) were investigated. The results show that TBC decreases with an increase in graphene layers and converges when the number of graphene layers is above five. The atomic structure of the copper matrix affects the TBC, which achieves the highest value with the (011) plane at the interface. The length of the copper matrix has little effect on the TBC. As the vacancy rate is between 0 and 4%, TBC increases with the vacancy rate. Our results present insights for future thermal management optimization based on copper matrix composites.

Diamond particle-reinforced copper matrix composites (Diamond/Cu) are recognized as promising electronic packaging materials due to their excellent thermophysical properties. It is necessary to investigate the reliability of Diamond/Cu composites under extreme environmental conditions. The corrosion behavior of Diamond/Cu composites was studied in a 5 wt% NaCl neutral salt spray. Surface morphology, thermal conductivity, bending strength, corrosion rate, and corrosion depth resulting from corrosion were researched in this paper. The results showed that the corrosion phenomenon mainly occurs on the copper matrix, and the diamond and interface products do not corrode. The corrosion mechanism of Diamond/Cu composites was micro-galvanic corrosion. The corrosion product formed was Cu₂Cl(OH)₃. The salt spray environment had a great influence on the composite surface, but the composite properties were not significantly degenerated. After a 168-h test, the bending strength was unaltered and the thermal conductivity of gold-plated composites showed a slight decrease of 1–2%. Surface gold plating can effectively improve the surface state and thermal conductivity of Diamond/Cu composites in a salt spray environment.