Chresten von der Heide

Rivetless structural bonding is a key technology for increasing the structural efficiency of composite aircraft. Structural bonding provides a more uniform load distribution than mechanical fastening, resulting in higher composite joint strength at a reduced weight. However, the certification of rivetless structural bonds is challenging due to their more complex design, their inability to retard damage within the adhesive layer, and concerns regarding their long-term durability. As a result, it is state-of-the-art to certify safety-critical composite joints using well-established mechanical fastening processes, despite their weight penalty. Therefore, there is a need for a rivetless structural bond design that is lightweight and complies with the strict certification requirements. Increasing damage tolerance through design features and monitoring the bondline integrity are two options defined by aviation authorities to obtain certification. The multifunctional bondline combines both approaches because they complement each other well. In particular, monitoring the structural health of the bondline can be simplified due to the damage tolerance feature. Since the damage tolerance feature arrests damage at defined positions and maintains limit load capacity after arrest, the idea is to reduce the requirements for the structural health monitoring (SHM) system. Cracked-lap shear specimens equipped with multifunctional disbond arrest features (MDAFs) illustrate the feasibility of the multifunctional bondline approach. The MDAFs consist of fibre Bragg grating sensors or miniaturised strain gauges for damage monitoring and thermoplastic surface-toughening elements for damage arrest. As damage alters the load transfer across the bondline, comparing strains measured near the damage front to those in an undamaged region enables detection. The minimal distance between the two measurement points is the minimum load-transfer length---the distance required to complete 95 % of the load redistribution in structural bonds. Therefore, a two-staged MDAF design consisting of two surface toughening elements with integrated sensors, positioned slightly further apart than the estimated minimum load-transfer length, was tested. The results demonstrate that the two-stage MDAFs reliably arrest damage and enable damage detection by comparing the strain values obtained at both stages. For the given setup, comparing the strain differences to a threshold suffices as a damage criterion. Even though this criterion requires adjustments for the application in more complex systems, the results confirm that it is feasible to reduce the requirements of the SHM system by combining it with a disbond arrest function. Instead of tracking damage initiation and providing precise damage localisation and residual strength estimates, the SHM system is only required to identify the event of arrested damage by the MDAF. The residual strength can then be determined from the remaining undamaged bondline regions. Therefore, the complexity of the SHM system can be reduced in terms of both the number of installed sensors and the damage-detection algorithms.

An integrable sensor inlay for monitoring crack initiation and growth inside bondlines of structural carbon fiber-reinforced plastic (CFRP) components is presented. The sensing structures are sandwiched between crack-stopping poly(vinyliden fluoride) (PVDF) and a thin reinforcing polyetherimide (PEI) layer. Good adhesion at all interfaces of the sensor system and to the CFRP material is crucial, as weak bonds can counteract the desired crack-stopping functionality. At the same time, the chosen reinforcing layer must withstand high strains, safely support the metallic measuring grids, and possess outstanding fatigue strength. We show that this robust sensor system, which measures the strain at two successive fronts inside the bondline, allows to recognize cracks in the proximity of the inlay regardless of the mechanical loads. Feasibility is demonstrated by static load tests as well as cyclic long-term fatigue testing for up to 1,000,000 cycles. In addition to pure crack detection, crack distance estimation based on sensor signals is illustrated. The inlay integration process is developed with respect to industrial applicability. Thus, implementation of the proposed system will allow the potential of lightweight CFRP constructions to be better exploited by expanding the possibilities of structural adhesive bonding.

We present an integrable, sensor inlay for monitoring crack initiation and growth inside bondlines of structural carbon fiber reinforced plastic (CFRP) components. The sensing structures are sandwiched between crack stopping polyvinyliden fluoride (PVDF) and a thin reinforcing polyetherimide (PEI) layer. Good adhesion at all interfaces of the sensor system and to the CFRP material is crucial as weak bonds can counteract the desired crack stopping functionality. At the same time, the chosen reinforcing layer must withstand high strains, safely support the metallic measuring grids and possess outstanding fatigue strength. We show that this robust sensor system, which measures the strain at two successive fronts inside the bondline, allows to recognize cracks in the proximity of the inlay regardless of the mechanical loads. Feasibility is demonstrated by static load tests as well as cyclic long-term fatigue testing with up to 1,000,000 cycles. In addition to pure crack detection, crack distance estimation based on sensor signals is illustrated. The inlay integration process is developed with respect to industrial applicability. Thus, implementation of the proposed system will allow the potential of lightweight CFRP constructions to be better exploited by expanding the possibilities of structural adhesive bonding.

Systems-in-foil with multi-sensor arrays require extensive wiring with large numbers of data lines. This prevents scalability of the arrays and thus limits the applications. To enable multiplexing and thus reducing the external connections down to few digital data links and a power supply, active circuits in the form of ASICs must be integrated into the foils. However, this requires reliable multilayer wiring of the sensors and contacts for chip integration. As an elegant solution to this, a new manufacturing process for multilayer wiring in polyimide-based sensor foils has been developed that also allows ASIC chips to be soldered. The electrical four-level micro-via connections and the contact pads are generated by galvanic copper deposition after all other process steps, including stacking and curing of polyimide layers, are completed. Compared to layer by layer via technology, the processing time is considerably reduced. Because copper plating of vias and solderable copper contact pads happens as the final step, the risk of copper oxidation during polyimide curing is completely eliminated. The entire fabrication process is demonstrated for six strain sensor nodes connected to a surface-mounted ASIC as a detecting unit for sensing spatially resolved bending states. Each sensor node is a full-bridge configuration consisting of four strain gauges distributed across interconnected layers. The sensor foil allows bending of +/−120° without damage. This technology can be used in future for all kinds of complex flexible systems-in-foil, in particular for large arrays of sensors.

Monitoring process parameters in the manufacture of composite structures is key to ensuring product quality and safety. Ideally, this can be done by sensors that are embedded during production and can remain as devices to monitor structural health. Extremely thin foil-based sensors weaken the finished workpiece very little. Under ideal conditions, the foil substrate bonds with the resin in the autoclaving process, as is the case when polyetherimide is used. Here, we present a temperature sensor as part of an 8 µm thick multi-sensor node foil for monitoring processing conditions during the production and structural health during the lifetime of a construction. A metallic thin film conductor was shaped in the form of a space-filling curve to suppress the influences of resistance changes due to strain, which could otherwise interfere with the measurement of the temperature. FEM simulations as well as experiments confirm that this type of sensor is completely insensitive to the direction of strain and sufficiently insensitive to the amount of strain, so that mechanical strains that can occur in the composite curing process practically do not interfere with the temperature measurement. The temperature sensor is combined with a capacitive sensor for curing monitoring based on impedance measurement and a half-bridge strain gauge sensor element. All three types are made of the same materials and are manufactured together in one process flow. This is the key to cost-effective distributed sensor arrays that can be embedded during production and remain in the workpiece, thus ensuring not only the quality of the initial product but also the operational reliability during the service life of light-weight composite constructions.

Integrating foil sensors into fibre-reinforced plastics offers the advantage of making manufacturing measurable with spatial resolution and thus simplifies quality control. One challenge here is the possible negative influence of the integrated sensors on the mechanical behaviour of the structure. This article shows how the different parts of a film sensor influence important mechanical strength parameters of fibre composites. A comparison of two thermoplastic carrier films shows that by choosing polyetherimide (PEI) instead of polyimide (PI), a considerably more advantageous failure behaviour of the composite is achieved. While integrated PI films reduce the interlaminar shear strength by 68%, no impairment is noticeable due to PEI films. For the critical energy release rate, PEI-based film sensors even lead to a significant increase, while a significant deterioration of 85% can be observed for PI-based sensors. However, not only the film substrate plays a decisive role for the interlaminar shear strength, but also the sensor structures themselves. In this article, sensor structures made of gold were investigated. The decisive parameter for the impairment seems to be the area share of gold structures in the sensor. For a sensor pattern made of gold lines with an area filling of 50%, a reduction of the interlaminar shear strength of up to 25% was observed depending on the angle between the shear stress and the gold lines. No impairment was observed for sensor structures with less gold area. The results show that PEI substrates can be a superior alternative for sensor integration into fibre composites and suggest that there is a trade-off between sensitivity and degradation of mechanical properties when designing interdigital sensors.

Disbond arrest features combined with a structural health monitoring system for permanent bondline surveillance have the potential to significantly increase the safety of adhesive bonds in composite structures. A core requirement is that the integration of such features is achieved without causing weakening of the bondline. We present the design of a smart inlay equipped with a micro strain sensor-system fabricated on a polyvinyliden fluorid (PVDF) foil material. This material has proven disbond arrest functionality, but has not before been used as a substrate in lithographic micro sensor fabrication. Only with special pretreatment can it meet the requirements of thin film sensor elements regarding surface roughness and adhesion. Moreover, the sensor integration into composite material using a standard manufacturing procedure reveals that the smart inlays endure this process even though subjected to high temperatures, curing reactions and plasma treatment. Most critical is the substrate melting during curing when sensory function is preserved with a covering caul plate that stabilizes the fragile measuring grids. The smart inlays are tested by static mechanical loading, showing that they can be stretched far beyond critical elongations of composites before failure. The health monitoring function is verified by testing the specimens with integrated sensors in a cantilever bending setup. The results prove the feasibility of micro sensors detecting strain gradients on a disbond arresting substrate to form a so-called multifunctional bondline.

In comparison to bolted joints, structural bonds are the desirable joining method for light-weight composite structures. To achieve a broad implementation of this technology in safety critical structures, the issues of structural bonds due to their complex and often unpredictable failure mechanisms have to be overcome. The proposed multifunctional bondline approach aims at solving this by adding two safety mechanisms to structural bondlines. These are a design feature for limiting damages to a certain size and a structural health monitoring system for damage detection. The key question is whether or not the implementation of both safety features without deteriorating the strength in comparison to a healthy conventional bondline is possible. In previous studies on the hybrid bondline, a design feature for damage limitations in bondlines by means of disbond stopping features was already developed. Thus, the approach to evolve the hybrid bondline to a multifunctional one is followed. A thorough analysis of the shear stress and tensile strain distribution within the hybrid bondline demonstrates the feasibility to access the status of the bondline by monitoring either of these quantities. Moreover, the results indicate that it is sufficient to place sensors within the disbond stopping feature only and not throughout the entire bondline. Based on these findings, the three main working principles of the multifunctional are stated. Finally, two initial concepts for a novel multifunctional disbond arrest feature are derived for testing the fundamental hypothesis that the integration of micro sensors into the disbond stopping feature only enables the crack arrest and the health monitoring functions, while reaching the mechanical strength of a conventional healthy epoxy bondline. This work therefore provides the fundamentals for future investigations in the scope of the multifunctional bondline.

Electronic devices on flexible polymeric substrates allow new fields of applications. A maskless and flexible structuring process for such systems is offered by ablation using ultra-short pulse laser irradiation. Hereby, certain areas of a functional thin film coating (e.g. nickel-chromium) are locally removed from a substrate (e.g. polyimide) to yield the needed device structures. Micro laser patterning quality is influenced by the beam properties (beam profile, fluence) as well as by the pulse overlap, the substrate material and many other factors. A clear distinction must be made between the material ablation at the surface of a bulk material and the substrate selective removal of a thin metallic film. For the latter, general rules for the prediction of ablation results especially in the case of areal ablation, which were not known from the literature so far, are derived here in the form of mathematical criteria. A methodology for the parameter finding in different cases of ablation (dot, line, areal) is presented and exemplified using a practical example, but is also applicable to other flexible thin film based systems.