Shengchun Liu
Current Organizations / Institutes
The organizations/institutes from the scholar's latest article
Research Subjects
Shengchun Liu has a total of 76 co-authors. Here are the top co-authors by number of shared publications:
Xueqiang Li
7 shared publicationsBaomin Dai
3 shared publicationsHao Guo
3 shared publicationsTieying Wang
3 shared publicationsYifan Zhang
Key Laboratory of Refrigeration Technology of Tianjin, Tianjin University of Commerce, Tianjin, 300134 China
3 shared publicationsZhiming Wang
3 shared publications
Latest Publications
- Open Access
- 2 July 2026
- Published by Elsevier in Green Energy and Resources
- Vol. 4 (3)
Improving the efficiency of CO2 utilization in vertical farming via CFD modelling with consideration of leaf microstructure
- 2 July 2026
- Published by Elsevier in Green Energy and Resources
- Vol. 4 (3)
Open AccessImproving the efficiency of CO2 utilization in vertical farming via CFD modelling with consideration of leaf microstructure
- Open Access
- 1 April 2026
- Published by IOP Publishing in Journal of Physics: Conference Series
- Vol. 3214 (1)
Performance Comparison of Two-phase Immersion Cooling for High Heat Flux Chips
Two-phase immersion cooling (TPIC) technology has attracted much attention due to the outstanding heat dissipation performance; however, the impact of the application of heat sink to enhance the heat transfer is still unclear. Therefore, this study establishes the 3D model to compare the performance difference. Results show that, the application of heat sink would decrease the average temperature and increase the temperature uniformity coefficient, but the difference is quite limited when the heat flux is smaller than 250 W/cm 2 ; in other word, the heat sink is suggested if the heat flux excesses this value. The PUE by using the heat sink is smaller than that without the heat sink, especially at high heat flux.
- 1 April 2026
- Published by IOP Publishing in Journal of Physics: Conference Series
- Vol. 3214 (1)
Open AccessPerformance Comparison of Two-phase Immersion Cooling for High Heat Flux Chips
Two-phase immersion cooling (TPIC) technology has attracted much attention due to the outstanding heat dissipation performance; however, the impact of the application of heat sink to enhance the heat transfer is still unclear. Therefore, this study establishes the 3D model to compare the performance difference. Results show that, the application of heat sink would decrease the average temperature and increase the temperature uniformity coefficient, but the difference is quite limited when the heat flux is smaller than 250 W/cm 2 ; in other word, the heat sink is suggested if the heat flux excesses this value. The PUE by using the heat sink is smaller than that without the heat sink, especially at high heat flux.
- 17 October 2025
- Published by Elsevier in Applied Thermal Engineering
- Vol. 281
Performance optimization of open refrigerated display cabinets considering different package layouts
- 17 October 2025
- Published by Elsevier in Applied Thermal Engineering
- Vol. 281
Performance optimization of open refrigerated display cabinets considering different package layouts
- 1 October 2025
- Published by Elsevier in Applied Thermal Engineering
- Vol. 281
Performance differences of open refrigerated display cabinet under different package layouts
- 1 October 2025
- Published by Elsevier in Applied Thermal Engineering
- Vol. 281
Performance differences of open refrigerated display cabinet under different package layouts
- 6 April 2025
- Published by Elsevier in Renewable Energy
- Vol. 247
A two-dimensional numerical study of oxygen transport in porous transport layer of PEMEC using the phase field method
- 6 April 2025
- Published by Elsevier in Renewable Energy
- Vol. 247
A two-dimensional numerical study of oxygen transport in porous transport layer of PEMEC using the phase field method