Qijun Duan

Flashover and dampness deterioration are critical factors threatening external epoxy composite insulation devices, which badly affect the security of high-voltage transmission equipment. The surface of the epoxy composite is vulnerable in insulation. Therefore, it is important to prevent surface insulation failure by constructing a stable and high-performance surface. This article proposes the utilization of coupling agent and plasma to synergistically fluorinate boron nitride nanosheets (BNNS), and simulates the principle of water strider floating to construct a biomimetic self-assembly structure on the surface of epoxy resin (EP). The experimental results indicate that the two-dimensional BNNS grafted with fluorinated segments are subjected to a driving force on the surface of EP, which tends to form a flat self-assembled layer on the surface. This biomimetic structure reduces the interfacial energy between water and EP, improving the hydrophobicity of the material. The contact angle reaches 142.7° when the filler content is 0.8%. Meanwhile, the introduction of fluorinated segments increases the energy required for electronic transition and suppresses the electron emission avalanche along the surface flashover. The negative polarity flashover voltage has increased by 43.99% compared with the unmodified EP. In this study, the surface insulation and hydrophobicity of EP are effectively improved with a lower amount of nanofillers, which has the prospect of further reducing costs and improving the modification effect.

With the extensive application of glass fiber reinforced polymer (GFRP) in the field of high voltage insulation, its operating environment is becoming more and more complex, and the surface insulation failure has gradually become a pivotal problem affecting the safety of equipment. In this paper, nano-SiO₂ was fluorinated by Dielectric barrier discharges (DBD) plasma and doped with GFRP to enhance the insulation performance. Through Fourier Transform Ioncyclotron Resonance (FTIR) and X-ray Photoelectron Spectroscopy (XPS) characterization of nano fillers before and after modification, it was found that plasma fluorination can graft a large number of fluorinated groups on the surface of SiO₂. The introduction of fluorinated SiO₂ (FSiO₂) can significantly enhance the interfacial bonding strength of the fiber, matrix and filler in GFRP. The DC surface flashover voltage of modified GFRP was further tested. The results show that both SiO₂ and FSiO₂ can improve the flashover voltage of GFRP. When the concentration of FSiO₂ is 3%, the flashover voltage increases most significantly to 14.71 kV, which is 38.77% higher than that of unmodified GFRP. The charge dissipation test results show that the addition of FSiO₂ can inhibit the surface charge migration. By the calculation of Density functional theory (DFT) and charge trap, it is found that grafting fluorine-containing groups on SiO₂ can increase its band gap and enhance its electron binding ability. Furthermore, a large number of deep trap levels are introduced into the nanointerface inside GFRP to enhance the inhibition of secondary electron collapse, thus increasing the flashover voltage.

In the direct current electric field, the surface of epoxy resin (EP) insulating material is prone to charge accumulation, which leads to electric field distortion and damages the overall insulation of the equipment. Nano-doping is an effective method to improve the surface insulation strength and DC flashover voltage of epoxy resin composites. In this study, pure bismuth ferrite nanoparticles (BFO), as well as BFO nanofillers, which were doped by La element, Cr element as well as co-doped by La + Cr element, were prepared by the sol-gel method. Epoxy composites with various filler concentrations were prepared by blending nano-fillers with epoxy resin. The morphology and crystal structure of the filler were characterized by scanning electron microscopy (SEM) and X-ray diffraction (XRD) tests. The effects of different filler types and filler mass fraction on the surface flashover voltage, charge dissipation rate, and trap characteristics of epoxy resin composites were studied. The results showed that element doping with bismuth ferrite nanofillers could further increase the flash voltage of the composites. The flashover voltage of La + Cr elements co-doped composites with the filler mass fraction of 4 wt% was 45.2% higher than that of pure epoxy resin. Through data comparison, it is found that the surface charge dissipation rate is not the only determinant of the flashover voltage. Appropriately reducing the surface charge dissipation rate of epoxy resin composites can increase the flashover voltage. Finally, combining with the distribution characteristics of the traps on the surface of the materials to explain the mechanism, it is found that the doping of La element and Cr element can increase the energy level depth and density of the deep traps of the composite materials, which can effectively improve the flashover voltage along the surface of the epoxy resin.

Traditional epoxy resin (EP) materials have difficulty to meet the performance requirements in the increasingly complex operating environment of the electrical and electronic industry. Therefore, it is necessary to study the design and development of new epoxy composites. At present, fluorinated epoxy resin (F-EP) is widely used, but its thermal and mechanical properties cannot meet the demand. In this paper, fluorinated epoxy resin was modified by ordered filling of fluorinated graphene oxide (FGO). The effect of FGO interlayer spacing on the thermal and mechanical properties of the composite was studied by molecular dynamics (MD) simulation. It is found that FGO with ordered filling can significantly improve the thermal and mechanical properties of F-EP, and the modification effect is better than that of FGO with disordered filling. When the interlayer spacing of FGO is about 9 Å, the elastic modulus, glass transition temperature, thermal expansion coefficient, and thermal conductivity of FGO are improved with best effect. Furthermore, we calculated the micro parameters of different systems, and analyzed the influencing mechanism of ordered filling and FGO layer spacing on the properties of F-EP. It is considered that FGO can bind the F-EP molecules on both sides of the nanosheets, reducing the movement ability of the molecular segments of the materials, so as to achieve the enhancement effect. The results can provide new ideas for the development of high-performance epoxy nanocomposites.

An investigation of the relationship between the microstructure parameters and thermomechanical properties of epoxy resin can provide a scientific basis for the optimization of epoxy systems. In this paper, the thermomechanical properties of diglycidyl ether of bisphenol A (DGEBA)/methyl tetrahydrophthalic anhydride (MTHPA) and DGEBA/nadic anhydride (NA) were calculated and tested by the method of molecular dynamics (MD) simulation combined with experimental verification. The effects of anhydride curing agents on the thermomechanical properties of epoxy resin were investigated. The results of the simulation and experiment showed that the thermomechanical parameters (glass transition temperature (T_g) and Young’s modulus) of the DGEBA/NA system were higher than those of the DGEBA/MTHPA system. The simulation results had a good agreement with the experimental data, which verified the accuracy of the crosslinking model of epoxy resin cured with anhydride curing agents. The microstructure parameters of the anhydride-epoxy system were analyzed by MD simulation, including bond-length distribution, synergy rotational energy barrier, cohesive energy density (CED) and fraction free volume (FFV). The results indicated that the bond-length distribution of the MTHPA and NA was the same except for C–C bonds. Compared with the DGEBA/MTHPA system, the DGEBA/NA system had a higher synergy rotational energy barrier and CED, and lower FFV. It can be seen that the slight change of curing agent structure has a significant effect on the synergy rotational energy barrier, CED and FFV, thus affecting the T_g and modulus of the system.