Degan Xiong

Spark plasma sintering (SPS) is an effective technique for studying the diffusion bonding of diamond/Cu composites, and has the potential to advance the application of copper matrix composites. This study investigates the SPS diffusion bonding of diamond/Cu composites using a chromium (Cr) interlayer. The effects of process parameters on the microstructure and mechanical properties of the bonding interface were evaluated through shear strength testing and SEM analysis. The results show that shear strength increases with interlayer thickness up to a certain point, after which it decreases. As the bonding temperature, holding time, and bonding pressure increase, defects such as cracks and voids at the diffusion-bonded interface are reduced, resulting in improved shear strength. Under suitable conditions (10 μm interlayer, 810 °C, 60 min, and 10 MPa), the bonding interface is defect-free, achieving a maximum shear strength of 139.89 MPa and a thermal conductivity (TC) of 700.97 W/(m·K), indicating high-quality diffusion bonding.

Semisolid compression brazing of Al50Si alloy using Zn-Al-Cu filler metal assisted by SiC particles coating has been developed. The effects of the size and concentration of SiC particles on the microstructure and mechanical properties of the joints were studied. By using 1 μm SiC particles and the concentration of SiC particles increased to 3 g/m², oxide film on the surface of base metal was completely disrupted and a good bonding strength was obtained. As SiC concentration further increased to 4 g/m², colonies of SiC particle with nonwetting areas of filler metal formed at the interface, resulting in a decrease in the bonding strength. By using 5 μm SiC particles, the bonding strength was enhanced as SiC concentration increased from 1 g/m² to 3 g/m² due to the removal of the oxide film. By further increasing SiC concentration to 16 g/m², the strength was constantly improved because of the dislocation strengthening effect generated at the SiC particle layer/filler metal interface. When SiC concentration increased to 32 g/m², nonwetting area appeared inside the SiC particles layer, causing a decrease in the bonding strength.

The semisolid brazing of SiC_p/6063Al under an applied pressure using Zn‐Al‐Cu filler metal was investigated. The samples to be joined were heated from 380°C to 382°C, 386°C, 392°C, and 410°C under a constant pressure of 10 MPa, respectively. Effects of the temperature on microstructural evolution and deformation behavior of the filler metal, interfacial structure, and shear strength of the bonded joint were discussed, and the disruption behavior of the surface oxide film was studied. The results show that, after heating, the solid grains of the filler metal transform into a globular structure surrounded by liquid. The degree of sphericity and the liquid fraction tend to improve with increasing temperature. During the heating process, the deformation of the filler metal is first accomplished by plastic deformation of solid grains and then by intergrain sliding and liquid flow. The surface oxides are broken and stripped by a cocontribution of compressive and shear stress which is caused by depressing and sliding of solid grains along the composites. It is found that the heating of 380°C to 392°C under pressure is the optimum condition to disrupt the surface oxide films and obtain sound bonds. The mechanical test results show that the maximum shear strength of the bond joints is as high as 105 MPa, reaching 78% that of the parent materials.