Ali Ghaffarlouy Raef
Current Organizations / Institutes
The organizations/institutes from the scholar's latest article
Previous Organizations / Institutes
The organizations / institutes from the scholar's other articles in the past ten years
Ali Ghaffarlouy Raef has a total of 8 co-authors. Here are the top co-authors by number of shared publications:
- Andrew C. Marvin
University of York
1 shared publication - Anna Pietrenko-Dabrowska
Faculty of Electronics, Telecommunications and Informatics, Gdansk University of Technology, Gdansk, Poland
1 shared publication - Hassan Naseri
National Institute for Scientific Research (INRS), University du Quebec, Montral, QC, Canada
1 shared publication - John Frederick Dawson
University of York
1 shared publication - Martin Paul Robinson
University of York
1 shared publication - Mohammad Bemani
Faculty of Electrical and Computer Engineering, University of Tabriz, Tabriz, Iran
1 shared publication
Latest Publications
- Open Access
- 8 December 2022
- Published by MDPI AG in Electronics
- Vol. 11 (24) , 4094
Reduced-Cost Optimization-Based Miniaturization of Microwave Passives by Multi-Resolution EM Simulations for Internet of Things and Space-Limited Applications
Stringent performance specifications along with constraints imposed on physical dimensions make the design of contemporary microwave components a truly onerous task. In recent years, the latter demand has been growing in importance with the innovative application of areas such as the Internet of Things coming into play. The need to employ full-wave electromagnetic (EM) simulations for response evaluation, reliable, yet CPU-heavy, only aggravates the issue. This paper proposes a reduced-cost miniaturization algorithm that employs a trust-region search procedure and multi-resolution EM simulations. In our approach, the resolution of the EM model is adjusted throughout the optimization process based on its convergence status starting from the lowest admissible fidelity. As the algorithm converges, the resolution is increased up to the high-fidelity one, used at the final phase to ensure reliability. Four microwave components have been utilized as verification structures: an impedance matching transformer and three branch-line couplers. Significant savings in terms of the number of EM analyses required to conclude the size reduction process of 41, 42, 38 and 50 percent have been obtained (in comparison to a single-fidelity procedure). The footprint area of the designs optimized using the proposed approach are equal to 32, 205, 410 and 132 mm2, in comparison to 52, 275, 525 and 213 mm2 of the initial (and already compact) design.
- 8 December 2022
- Published by MDPI AG in Electronics
- Vol. 11 (24) , 4094
Open AccessReduced-Cost Optimization-Based Miniaturization of Microwave Passives by Multi-Resolution EM Simulations for Internet of Things and Space-Limited Applications
Stringent performance specifications along with constraints imposed on physical dimensions make the design of contemporary microwave components a truly onerous task. In recent years, the latter demand has been growing in importance with the innovative application of areas such as the Internet of Things coming into play. The need to employ full-wave electromagnetic (EM) simulations for response evaluation, reliable, yet CPU-heavy, only aggravates the issue. This paper proposes a reduced-cost miniaturization algorithm that employs a trust-region search procedure and multi-resolution EM simulations. In our approach, the resolution of the EM model is adjusted throughout the optimization process based on its convergence status starting from the lowest admissible fidelity. As the algorithm converges, the resolution is increased up to the high-fidelity one, used at the final phase to ensure reliability. Four microwave components have been utilized as verification structures: an impedance matching transformer and three branch-line couplers. Significant savings in terms of the number of EM analyses required to conclude the size reduction process of 41, 42, 38 and 50 percent have been obtained (in comparison to a single-fidelity procedure). The footprint area of the designs optimized using the proposed approach are equal to 32, 205, 410 and 132 mm2, in comparison to 52, 275, 525 and 213 mm2 of the initial (and already compact) design.
- 1 March 2020
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Microwave and Wireless Components Letters
- Vol. 30 (3) , 249-252
A New Method for Arbitrary Amplitude Distribution Generation in ${4}\times{8}$ Butler Matrix- 1 March 2020
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Microwave and Wireless Components Letters
- Vol. 30 (3) , 249-252
A New Method for Arbitrary Amplitude Distribution Generation in ${4}\times{8}$ Butler Matrix