Holger Rücker
Current Organizations / Institutes
The organizations/institutes from the scholar's latest article
Research Subjects
Holger Rücker has a total of 68 co-authors. Here are the top co-authors by number of shared publications:
- Nils Pohl
Ruhr University Bochum
7 shared publications - Bernd Heinemann
Leibniz-Institut fr innovative Mikroelektronik (IHP), Frankfurt (Oder), Germany
4 shared publications - Florian Vogelsang
Institute of Integrated Systems, Ruhr University Bochum, Bochum, Germany
4 shared publications - Benedikt Sievert
Fraunhofer Institute for High Frequency Physics and Radar Techniques FHR, Wachtberg, Germany
3 shared publications - David Starke
Institute of Integrated Systems, Ruhr University Bochum, Bochum, Germany
3 shared publications - Janusz Grzyb
Institute of High-Frequency and Communication Technology, University of Wuppertal, Wuppertal, Germany
3 shared publications
Latest Publications
- Open Access
- 9 April 2025
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Journal of Microwaves
- Vol. 5 (3) , 572-582
A Fully Integrated 0.48 THz FMCW Radar Sensor in a SiGe Technology
The THz gap has been a significant research objective for photonics and electronics for decades. This work introduces a fully integrated frequency modulated continuous wave (FMCW) radar sensor with a center frequency of 0.48 THz, realized in a silicon-germanium (SiGe) technology. The sensor consists of a THz MMIC integrated onto a front-end printed circuit board (PCB) with FR4 substrate used for frequency synthesis and IF signal amplification. A dielectric polytetrafluoroethylene (PTFE) lens is mounted above the MMIC to act as transmitter (Tx) and receiver (Rx) lens as well as a physical protection for the bond wires of the MMIC. A back-end PCB generates the supply voltages and control signals, and its analog-digital-converter (ADC) samples the IF signal. The whole sensor is just 4.9 cm by 4.3 cm in size and is cost-efficient due to its design with FR4 PCBs. The MMIC reaches an output power of up to$-9$ dBm. In FMCW operation with the full sensor, a tuning range of 49 GHz is reached along an equivalent isotropic radiated power (EIRP) of up to 22 dBm. Distance measurements were successfully tested for distances of up to 5 m, and a radiation pattern is presented. In summary, this article demonstrates the potential of SiGe technology in the THz range for applications like localization, material characterization, and communication.- 9 April 2025
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Journal of Microwaves
- Vol. 5 (3) , 572-582
Open AccessA Fully Integrated 0.48 THz FMCW Radar Sensor in a SiGe Technology
The THz gap has been a significant research objective for photonics and electronics for decades. This work introduces a fully integrated frequency modulated continuous wave (FMCW) radar sensor with a center frequency of 0.48 THz, realized in a silicon-germanium (SiGe) technology. The sensor consists of a THz MMIC integrated onto a front-end printed circuit board (PCB) with FR4 substrate used for frequency synthesis and IF signal amplification. A dielectric polytetrafluoroethylene (PTFE) lens is mounted above the MMIC to act as transmitter (Tx) and receiver (Rx) lens as well as a physical protection for the bond wires of the MMIC. A back-end PCB generates the supply voltages and control signals, and its analog-digital-converter (ADC) samples the IF signal. The whole sensor is just 4.9 cm by 4.3 cm in size and is cost-efficient due to its design with FR4 PCBs. The MMIC reaches an output power of up to$-9$ dBm. In FMCW operation with the full sensor, a tuning range of 49 GHz is reached along an equivalent isotropic radiated power (EIRP) of up to 22 dBm. Distance measurements were successfully tested for distances of up to 5 m, and a radiation pattern is presented. In summary, this article demonstrates the potential of SiGe technology in the THz range for applications like localization, material characterization, and communication. - Open Access
- 10 March 2025
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Microwave and Wireless Technology Letters
- Vol. 35 (5) , 573-576
A 206–220-GHz Compact Fundamental Oscillator With up to 7-dBm Output Power and 7.4% Peak DC-to-RF Efficiency in a 130-nm SiGe Technology
This letter presents a 206.5–220.5-GHz fundamental differential Colpitts oscillator in a cascode topology implemented in a 130-nm SiGe HBT technology with ft/fmax of 350/450 GHz. Base inductors at the common-base (CB) stages are used to provide an inductive load at the output of the common-emitter (CE) stage, hence, boosting the output power by 27%. The resonant tank is embedded straight on top of the devices, reducing layout parasitics and resulting in a compact and efficient oscillator core layout. The oscillator provides a peak output power of 7 dBm at 208 GHz, 7.4% peak dc-to-RF efficiency at 220 GHz, and 6.55% tuning range (TR). At peak efficiency, the oscillator delivers an output power of 5.7 dBm with 50-mW dc power consumption and a phase noise (PN) of -90.2/-110 dBc/Hz at 1-/10-MHz offset, respectively. To the best of the authors’ knowledge, the presented oscillator has the best PN figure-of-merit (FoM) of -182.1 dBc/Hz at 1-MHz offset in a SiGe/CMOS technology above 200 GHz. It occupies a total area of 0.086 mm2, including the RF pad, and an ultracompact core size of 0.0049 mm2.
- 10 March 2025
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Microwave and Wireless Technology Letters
- Vol. 35 (5) , 573-576
Open AccessA 206–220-GHz Compact Fundamental Oscillator With up to 7-dBm Output Power and 7.4% Peak DC-to-RF Efficiency in a 130-nm SiGe Technology
This letter presents a 206.5–220.5-GHz fundamental differential Colpitts oscillator in a cascode topology implemented in a 130-nm SiGe HBT technology with ft/fmax of 350/450 GHz. Base inductors at the common-base (CB) stages are used to provide an inductive load at the output of the common-emitter (CE) stage, hence, boosting the output power by 27%. The resonant tank is embedded straight on top of the devices, reducing layout parasitics and resulting in a compact and efficient oscillator core layout. The oscillator provides a peak output power of 7 dBm at 208 GHz, 7.4% peak dc-to-RF efficiency at 220 GHz, and 6.55% tuning range (TR). At peak efficiency, the oscillator delivers an output power of 5.7 dBm with 50-mW dc power consumption and a phase noise (PN) of -90.2/-110 dBc/Hz at 1-/10-MHz offset, respectively. To the best of the authors’ knowledge, the presented oscillator has the best PN figure-of-merit (FoM) of -182.1 dBc/Hz at 1-MHz offset in a SiGe/CMOS technology above 200 GHz. It occupies a total area of 0.086 mm2, including the RF pad, and an ultracompact core size of 0.0049 mm2.
- Open Access
- 23 July 2024
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Terahertz Science and Technology
- Vol. 14 (5) , 632-651
Towards Passive Imaging With Uncooled, Low-NEP SiGe HBT Terahertz Direct Detectors
This work focuses on a systematic analysis of the potential as well as the limitations of modern SiGe HBT devices for broadband passive room-temperature detection in the lower THz range. Multiple necessary conditions need to be fulfilled to facilitate broadband passive imaging with a sufficiently low in-band NEP, which refer to various technology-driven device operation aspects, including the rectification process at THz frequencies and low-frequency analysis. Considering a strong frequency dependence of the devices' inherent rectification potential, an in-depth understanding and proper modeling of the device internal parasitics in combination with antenna-detector co-design aspects are crucial for successful detector implementation. For that purpose, a simplified nonlinear high-frequency detector model was applied for the device operating not only in the classical forward-active region but also in deep saturation (cold operation). The complete detector was implemented in a modern high-speed 130 nm SiGe HBT technology with $f_{t}/f_{max}$ of 470/650 GHz. It comprises two independent orthogonal polarization paths within a single dual-polarization lens-coupled on-chip antenna to operate with unpolarized passive illumination. With the aid of an efficient antenna-circuit co-design, a close-to-optimum detector performance in a near-THz fractional bandwidth can be achieved, as experimentally verified in free-space with frequency-tunable coherent CW sources. In particular, the detector optical NEP for each independent polarization path was measured across 200–1000 GHz reporting state-of-the-art values of 2.3–23 pW/ $\mathrm{\sqrt{Hz}}$ and 4.3–45 pW/ $\mathrm{\sqrt{Hz}}$ with the device operating in the forward-active range and in saturation, respectively. This, in combination with the de-embedded equivalent noise bandwidth of 512 GHz centered around 430 GHz, allowed to demonstrate the corresponding 1-Hz defined NETD of 0.86 K and 2 K in a focused measurement setup with a cavity black-body standard chopped mechanically at 1.5 kHz. With a simultaneous dual-channel operation, the NETD scaled down to 0.64 K, indicating near-zero noise correlation between both polarization paths.
- 23 July 2024
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Terahertz Science and Technology
- Vol. 14 (5) , 632-651
Open AccessTowards Passive Imaging With Uncooled, Low-NEP SiGe HBT Terahertz Direct Detectors
This work focuses on a systematic analysis of the potential as well as the limitations of modern SiGe HBT devices for broadband passive room-temperature detection in the lower THz range. Multiple necessary conditions need to be fulfilled to facilitate broadband passive imaging with a sufficiently low in-band NEP, which refer to various technology-driven device operation aspects, including the rectification process at THz frequencies and low-frequency analysis. Considering a strong frequency dependence of the devices' inherent rectification potential, an in-depth understanding and proper modeling of the device internal parasitics in combination with antenna-detector co-design aspects are crucial for successful detector implementation. For that purpose, a simplified nonlinear high-frequency detector model was applied for the device operating not only in the classical forward-active region but also in deep saturation (cold operation). The complete detector was implemented in a modern high-speed 130 nm SiGe HBT technology with $f_{t}/f_{max}$ of 470/650 GHz. It comprises two independent orthogonal polarization paths within a single dual-polarization lens-coupled on-chip antenna to operate with unpolarized passive illumination. With the aid of an efficient antenna-circuit co-design, a close-to-optimum detector performance in a near-THz fractional bandwidth can be achieved, as experimentally verified in free-space with frequency-tunable coherent CW sources. In particular, the detector optical NEP for each independent polarization path was measured across 200–1000 GHz reporting state-of-the-art values of 2.3–23 pW/ $\mathrm{\sqrt{Hz}}$ and 4.3–45 pW/ $\mathrm{\sqrt{Hz}}$ with the device operating in the forward-active range and in saturation, respectively. This, in combination with the de-embedded equivalent noise bandwidth of 512 GHz centered around 430 GHz, allowed to demonstrate the corresponding 1-Hz defined NETD of 0.86 K and 2 K in a focused measurement setup with a cavity black-body standard chopped mechanically at 1.5 kHz. With a simultaneous dual-channel operation, the NETD scaled down to 0.64 K, indicating near-zero noise correlation between both polarization paths.
- Open Access
- 19 July 2024
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Journal of Microwaves
- Vol. 4 (4) , 721-732
A 79 GHz SiGe Doherty Power Amplifier Suitable for Next-Generation Automotive Radar
The number of environment-detecting sensors inside cars continuously increases, to enable failsafe autonomous driving. With more sensors, the probability of performance degrading interferences increases. A promising solution to the interferences is orthogonal frequency division multiplex (OFDM) radar. Due to the complex modulation scheme, the analog front end, especially the power amplifier in the transmitter, has to deal with a high peak-to-average power ratio. Therefore, conventional amplifiers have to be operated in power back-off to maintain linear operation at the drawback of reduced power-added efficiency. To mitigate this problem, a Doherty power amplifier for an automotive radar transceiver is proposed. In this work, we present a design methodology for an integrated Doherty amplifier for automotive radar applications, focussing on the theory of operation by analyzing transistor-level simulations. Small- and large signal simulations analyze the concept of load modulation for a Doherty amplifier in the automotive frequency band from 76--81 GHz. Using a fully differential transmission-line-based approach, we showcase the superior performance of an automotive Doherty amplifier over an conventional state-of-the-art reference amplifier. In measurements, the proposed Doherty amplifier achieves a saturated output power of 17.2 dBm with a peak power-added efficiency of 11.6%. When operating in 6 dB back-off, the PAE still amounts to 6.1%. Thereby we propose to improve conventional automotive power amplifiers by incorporating them into a Doherty amplifier.
- 19 July 2024
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Journal of Microwaves
- Vol. 4 (4) , 721-732
Open AccessA 79 GHz SiGe Doherty Power Amplifier Suitable for Next-Generation Automotive Radar
The number of environment-detecting sensors inside cars continuously increases, to enable failsafe autonomous driving. With more sensors, the probability of performance degrading interferences increases. A promising solution to the interferences is orthogonal frequency division multiplex (OFDM) radar. Due to the complex modulation scheme, the analog front end, especially the power amplifier in the transmitter, has to deal with a high peak-to-average power ratio. Therefore, conventional amplifiers have to be operated in power back-off to maintain linear operation at the drawback of reduced power-added efficiency. To mitigate this problem, a Doherty power amplifier for an automotive radar transceiver is proposed. In this work, we present a design methodology for an integrated Doherty amplifier for automotive radar applications, focussing on the theory of operation by analyzing transistor-level simulations. Small- and large signal simulations analyze the concept of load modulation for a Doherty amplifier in the automotive frequency band from 76--81 GHz. Using a fully differential transmission-line-based approach, we showcase the superior performance of an automotive Doherty amplifier over an conventional state-of-the-art reference amplifier. In measurements, the proposed Doherty amplifier achieves a saturated output power of 17.2 dBm with a peak power-added efficiency of 11.6%. When operating in 6 dB back-off, the PAE still amounts to 6.1%. Thereby we propose to improve conventional automotive power amplifiers by incorporating them into a Doherty amplifier.
- Open Access
- 6 December 2023
- Published by Cambridge University Press (CUP) in International Journal of Microwave and Wireless Technologies
- Vol. 16 (5) , 738-749
A compact and fully integrated $\text{0.48}\,\text{THz}$ FMCW radar transceiver combined with a dielectric lensElectronic measurement systems in the THz frequency range are often bulky and expensive devices. While some compact single-chip systems operating in the high millimeter-wave frequency range have recently been published, compact measurement systems in the low THz frequency range are still rare. The emergence of new silicon-germanium (SiGe) semiconductor technologies allow the integration of system components, like oscillators, frequency multipliers, frequency dividers, and antennas, operating in the low THz frequency range, into a compact monolithic microwave integrated circuits (MMIC), which contains most components to implement a low-cost and compact frequency-modulated continuous-wave-radar transceiver. This article presents a single transceiver solution containing all necessary components. It introduces a $0.48\,\mathrm{THz}$ radar transceiver MMIC with a tuning range of $43\,\mathrm{GHz}$ and an output power of up to $-9.4\,\mathrm{dBm}$ in the SG13G3 $130\,\mathrm{nm}$ SiGe technology by IHP. The MMIC is complemented by a dielectric lens antenna design consisting of polytetrafluoroethylene, providing up to $39.3\,\mathrm d\mathrm B\mathrm i$ of directivity and half-power beam widths of 0.95∘ in transmit and receive direction. The suppression of clutter from unwanted targets deviating from antenna boresight more than 6∘ is higher than $24.6\,\mathrm d \mathrm B$ in E- and H-Plane.- 6 December 2023
- Published by Cambridge University Press (CUP) in International Journal of Microwave and Wireless Technologies
- Vol. 16 (5) , 738-749
Open AccessA compact and fully integrated $\text{0.48}\,\text{THz}$ FMCW radar transceiver combined with a dielectric lensElectronic measurement systems in the THz frequency range are often bulky and expensive devices. While some compact single-chip systems operating in the high millimeter-wave frequency range have recently been published, compact measurement systems in the low THz frequency range are still rare. The emergence of new silicon-germanium (SiGe) semiconductor technologies allow the integration of system components, like oscillators, frequency multipliers, frequency dividers, and antennas, operating in the low THz frequency range, into a compact monolithic microwave integrated circuits (MMIC), which contains most components to implement a low-cost and compact frequency-modulated continuous-wave-radar transceiver. This article presents a single transceiver solution containing all necessary components. It introduces a $0.48\,\mathrm{THz}$ radar transceiver MMIC with a tuning range of $43\,\mathrm{GHz}$ and an output power of up to $-9.4\,\mathrm{dBm}$ in the SG13G3 $130\,\mathrm{nm}$ SiGe technology by IHP. The MMIC is complemented by a dielectric lens antenna design consisting of polytetrafluoroethylene, providing up to $39.3\,\mathrm d\mathrm B\mathrm i$ of directivity and half-power beam widths of 0.95∘ in transmit and receive direction. The suppression of clutter from unwanted targets deviating from antenna boresight more than 6∘ is higher than $24.6\,\mathrm d \mathrm B$ in E- and H-Plane. - Open Access
- 14 November 2023
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Microwave Theory and Techniques
- Vol. 72 (1) , 525-537
Design and Phase Noise Measurements of an Ultrafast Dual-Modulus Prescaler in 130 nm SiGe:C BiCMOS
The design complexity of high-speed and power-efficient circuits increases to higher operation frequencies. Therefore, this manuscript gives an overview of how to design and optimize fully differential emitter-coupled logic (ECL) gates using two dual-modulus prescalers with switchable division ratios of 4 and 5. The first prescaler is optimized to the highest operation frequencies, up to 142 GHz and even 166 GHz for the division ratios of 5 and 4, respectively. Furthermore, another prescaler has been optimized for the widely used 80 GHz band, which has been heavily promoted by the automotive industry and has a high number of components in that domain. Both prescalers can be utilized in a fully programmable frequency divider with a wide division ratio range. As the measurement of the additive phase noise for frequency-converting devices with excellent noise performance is quite challenging, this is discussed theoretically and carried out practically. The measured jitter is between 500 as and 1.9 fs within integration limits of 100 Hz up to 1 MHz offset frequency.
- 14 November 2023
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Microwave Theory and Techniques
- Vol. 72 (1) , 525-537
Open AccessDesign and Phase Noise Measurements of an Ultrafast Dual-Modulus Prescaler in 130 nm SiGe:C BiCMOS
The design complexity of high-speed and power-efficient circuits increases to higher operation frequencies. Therefore, this manuscript gives an overview of how to design and optimize fully differential emitter-coupled logic (ECL) gates using two dual-modulus prescalers with switchable division ratios of 4 and 5. The first prescaler is optimized to the highest operation frequencies, up to 142 GHz and even 166 GHz for the division ratios of 5 and 4, respectively. Furthermore, another prescaler has been optimized for the widely used 80 GHz band, which has been heavily promoted by the automotive industry and has a high number of components in that domain. Both prescalers can be utilized in a fully programmable frequency divider with a wide division ratio range. As the measurement of the additive phase noise for frequency-converting devices with excellent noise performance is quite challenging, this is discussed theoretically and carried out practically. The measured jitter is between 500 as and 1.9 fs within integration limits of 100 Hz up to 1 MHz offset frequency.
- Open Access
- 19 April 2023
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Microwave and Wireless Technology Letters
- Vol. 33 (6) , 867-870
A 142-GHz 4/5 Dual-Modulus Prescaler for Wideband and Low Noise Frequency Synthesizers in 130-nm SiGe:C BiCMOS
In this contribution, the simulation and measurement results of a 4/5 dual-modulus prescaler, operating from dc to 142 GHz with a power consumption of 144 mW, are presented. For a division ratio of 4, the maximum operation frequency of 166 GHz is even higher. The prescaler is the core of a fully programmable dual-modulus frequency divider, which is a crucial component of modern measurement systems. The effect of the physical lengths and the resulting internal delays on the prescaler’s performance is analyzed. Furthermore, the voltage level of the fully differential emitter-coupled logic (ECL) is optimized in terms of phase noise and maximum operating frequency. The monolithic microwave integrated circuit (MMIC) is realized in a 130-nm SiGe:C BiCMOS technology with $f\textsubscript{ \emph T}$ / $f\textsubscript{max}$ $=$ 470/650 GHz.
- 19 April 2023
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Microwave and Wireless Technology Letters
- Vol. 33 (6) , 867-870
Open AccessA 142-GHz 4/5 Dual-Modulus Prescaler for Wideband and Low Noise Frequency Synthesizers in 130-nm SiGe:C BiCMOS
In this contribution, the simulation and measurement results of a 4/5 dual-modulus prescaler, operating from dc to 142 GHz with a power consumption of 144 mW, are presented. For a division ratio of 4, the maximum operation frequency of 166 GHz is even higher. The prescaler is the core of a fully programmable dual-modulus frequency divider, which is a crucial component of modern measurement systems. The effect of the physical lengths and the resulting internal delays on the prescaler’s performance is analyzed. Furthermore, the voltage level of the fully differential emitter-coupled logic (ECL) is optimized in terms of phase noise and maximum operating frequency. The monolithic microwave integrated circuit (MMIC) is realized in a 130-nm SiGe:C BiCMOS technology with $f\textsubscript{ \emph T}$ / $f\textsubscript{max}$ $=$ 470/650 GHz.
- 16 October 2022
- Published by Institute of Electrical and Electronics Engineers (IEEE)
- p. 49-52
A Static Frequency Divider up to 163 GHz in SiGe-BiCMOS Technology
This work presents a static divide-by-16 in a 130-nm SiGe-BiCMOS technology, aiming to demonstrate the technologies’ potential. A bias network followed by four divide-by-2 stages and an output buffer is designed. The DC power consumption of the first divider stage and the four divider flip flops in static current mode logic (CML) with buffer is 134.3 mW and 396 mW, respectively. The maximum input frequency of the divider is 163 GHz. The corresponding necessary input power at the divider’s bias network is 4.39 dBm. The observed self-oscillating frequency is 110.56 GHz, while the output power at the by-16 output of the divider is around -9 dBm. Moreover, a special focus is set on the accuracy of divider simulations and the influence of parasitic elements compared to measurement results.
- 16 October 2022
- Published by Institute of Electrical and Electronics Engineers (IEEE)
- p. 49-52
A Static Frequency Divider up to 163 GHz in SiGe-BiCMOS Technology
This work presents a static divide-by-16 in a 130-nm SiGe-BiCMOS technology, aiming to demonstrate the technologies’ potential. A bias network followed by four divide-by-2 stages and an output buffer is designed. The DC power consumption of the first divider stage and the four divider flip flops in static current mode logic (CML) with buffer is 134.3 mW and 396 mW, respectively. The maximum input frequency of the divider is 163 GHz. The corresponding necessary input power at the divider’s bias network is 4.39 dBm. The observed self-oscillating frequency is 110.56 GHz, while the output power at the by-16 output of the divider is around -9 dBm. Moreover, a special focus is set on the accuracy of divider simulations and the influence of parasitic elements compared to measurement results.
- Open Access
- 26 September 2022
- Published by Institute of Electrical and Electronics Engineers (IEEE)
A Fully Integrated 0.48 THz FMCW Radar Transceiver MMIC in a SiGe-Technology
Radar systems are gaining in popularity and spreading into more and more applications due to their robust measurement method. While single-chip solutions have been published in the last decade in the upper millimetre-wave range, solutions are still very limited in the lower THz range. In this paper, a 0.48 THz FMCW-radar transceiver MMIC in a 130 nm silicon-germanium (SiGe) technology is presented. The MMIC consists of one Tx and Rx channel, respectively. The components for frequency synthesis and on-chip patch antennas are fully integrated into the MMIC. The achievable tuning range of the MMIC is 0.448 - 0.491 THz with a peak on-chip output power of about -9.4 dBm. The MMIC was designed and manufactured with the IHP SG13G3 technoloay,
- 26 September 2022
- Published by Institute of Electrical and Electronics Engineers (IEEE)
Open AccessA Fully Integrated 0.48 THz FMCW Radar Transceiver MMIC in a SiGe-Technology
Radar systems are gaining in popularity and spreading into more and more applications due to their robust measurement method. While single-chip solutions have been published in the last decade in the upper millimetre-wave range, solutions are still very limited in the lower THz range. In this paper, a 0.48 THz FMCW-radar transceiver MMIC in a 130 nm silicon-germanium (SiGe) technology is presented. The MMIC consists of one Tx and Rx channel, respectively. The components for frequency synthesis and on-chip patch antennas are fully integrated into the MMIC. The achievable tuning range of the MMIC is 0.448 - 0.491 THz with a peak on-chip output power of about -9.4 dBm. The MMIC was designed and manufactured with the IHP SG13G3 technoloay,
- 15 July 2022
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Electron Devices
- Vol. 69 (9) , 4803-4809
Microscopic Simulation of the RF Performance of SiGe HBTs With Additional Uniaxial Mechanical Stress
A very detailed investigation of high-speed silicon–germanium (SiGe) heterojunction bipolar transistors (HBTs) showed an underestimation of the measured peak cutoff frequency by simulations with a hydrodynamic (HD) model. It was speculated that this might be due to a breakdown of the HD approximation or unknown additional mechanical stress. We repeated those simulations with the more fundamental Boltzmann transport equation (BTE) based on the same device model (doping profiles, 2-D geometry, parasitics, and so on) and obtained almost similar results showing that this failure was not due to a breakdown of the HD approximation. Since additional uniaxial stress along the direction of the lateral base has been shown to increase the cutoff frequency, we investigated this effect. We found by 2-D device simulations that the increase in the peak cutoff frequency is rather small, and at high stress levels, it even decreases, if the uniaxial stress is applied homogenously. This is due to the reduction of the conductivity of the highly doped collector layer by the stress. If the stress is limited to the intrinsic transistor, the increase in the cutoff frequency is monotonic with growing stress. On the other hand, the collector current for a given base–emitter voltage also increases with stress leading to an overestimation of the collector current compared with the measurements. If this increase is corrected by a slight decrease in the germanium profile, the gain in the peak cutoff frequency is lost. Thus, the underestimation of the peak cutoff frequency cannot be explained by an additional homogeneous uniaxial stress in the intrinsic transistor.
- 15 July 2022
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Electron Devices
- Vol. 69 (9) , 4803-4809
Microscopic Simulation of the RF Performance of SiGe HBTs With Additional Uniaxial Mechanical Stress
A very detailed investigation of high-speed silicon–germanium (SiGe) heterojunction bipolar transistors (HBTs) showed an underestimation of the measured peak cutoff frequency by simulations with a hydrodynamic (HD) model. It was speculated that this might be due to a breakdown of the HD approximation or unknown additional mechanical stress. We repeated those simulations with the more fundamental Boltzmann transport equation (BTE) based on the same device model (doping profiles, 2-D geometry, parasitics, and so on) and obtained almost similar results showing that this failure was not due to a breakdown of the HD approximation. Since additional uniaxial stress along the direction of the lateral base has been shown to increase the cutoff frequency, we investigated this effect. We found by 2-D device simulations that the increase in the peak cutoff frequency is rather small, and at high stress levels, it even decreases, if the uniaxial stress is applied homogenously. This is due to the reduction of the conductivity of the highly doped collector layer by the stress. If the stress is limited to the intrinsic transistor, the increase in the cutoff frequency is monotonic with growing stress. On the other hand, the collector current for a given base–emitter voltage also increases with stress leading to an overestimation of the collector current compared with the measurements. If this increase is corrected by a slight decrease in the germanium profile, the gain in the peak cutoff frequency is lost. Thus, the underestimation of the peak cutoff frequency cannot be explained by an additional homogeneous uniaxial stress in the intrinsic transistor.