Abdallah Ramini

Ball Grid Array (BGA) failures are often dominated by stress concentrations at the outer solder joints, particularly under thermomechanical loading. To mitigate this issue, this study investigates the mechanical and reliability implications of optimizing the BGA solder joint array by removing the outermost rows and columns, positioning all connections directly beneath the silicon die. Two commonly used solder alloys—SAC305 and Sn37Pb—were selected to evaluate the effects of this optimized array design. A combined experimental and numerical approach was employed, including accelerated thermal cycling (–40 °C to 125 °C), in situ resistance monitoring, cross-sectional failure analysis, and finite element modeling (FEM) to assess fatigue behavior under the altered layout. The optimized array significantly improved performance for SAC305, yielding a 1.67× increase in mean cycles-to-failure and a 29% reduction in peak von Mises stress, with failure locations shifting from the corners to more evenly distributed areas beneath the die. Sn37Pb assemblies showed only a 1.01× improvement despite an 11% stress reduction, attributed to persistent shear-dominated failures at second-row joints. These results highlight the critical influence of joint array architecture and solder alloy selection on reliability, offering design-level guidance for applications prioritizing thermomechanical robustness with reduced I/O counts.

The present research study deals with an electrically actuated MEMS device. An experimental investigation is performed, via frequency sweeps in a neighbourhood of the first natural frequency. Resonant behavior is explored, with special attention devoted to jump and pull-in dynamics. A theoretical single degree-of-freedom spring-mass model is derived. Classical numerical simulations are observed to properly predict the main nonlinear features. Nevertheless, some discrepancies arise, which are particularly visible in the resonant branch. They mainly concern the practical range of existence of each attractor and the final outcome after its disappearance. These differences are likely due to disturbances, which are unavoidable in practice, but have not been included in the model. To take disturbances into account, in addition to the classical local investigations, we consider the global dynamics and explore the robustness of the obtained results by performing a dynamical integrity analysis. Our aim is that of developing an applicable confident estimate of the system response. Integrity profiles and integrity charts are built to detect the parameter range where reliability is practically strong and where it becomes weak. Integrity curves exactly follow the experimental data. They inform about the practical range of actuality. We discuss the combined use of integrity charts in the engineering design. Although we refer to a particular case-study, the approach is very general.