Sung-Min Sim
Current Organizations / Institutes
The organizations/institutes from the scholar's latest article
Previous Organizations / Institutes
The organizations / institutes from the scholar's other articles in the past ten years
Sung-Min Sim has a total of 8 co-authors. Here are the top co-authors by number of shared publications:
- Jun Ho Yu
Korea Institute of Industrial Technology, Cheonan 31056, Republic of Korea
2 shared publications - Jung-Mu Kim
Division of Electronic Engineering Jeonbuk National University Jeonju Korea
2 shared publications - Sang-Ho Lee
Micro/Nano Scale Manufacturing R&D Group Korea Institute of Industrial Technology Cheonan Korea
2 shared publications - Ignacio Llamas-Garro
Centre Tecnològic de Telecomunicacions de Catalunya, Spain
1 shared publication - Jin-Woo Choi
Department of Electrical and Computer Engineering, Michigan Technological University, Houghton, MI 49931, USA
1 shared publication - Jiwon Kim
School of Electronic and Information Engineering, Jeonbuk National University, Jeonju 54896, Korea
1 shared publication
Latest Publications
- Open Access
- 30 November 2025
- Published by Korean Institute of Electromagnetic Engineering and Science in Journal of Electromagnetic Engineering and Science
- Vol. 25 (6) , 550-557
Investigation of Insertion Loss in Inkjet-Printed Coplanar Waveguide Based on Drying Temperature
In this study, we propose an optimized inkjet printing process to improve the insertion loss of inkjet-printed coplanar waveguide (CPW) transmission lines. The process involves varying the drying temperature and adjusting the number of printing steps to investigate their effects on the electrical characteristics of the printed CPW. The relationships between surface roughness, surface cavities, morphological changes, and insertion loss are studied by conducting atomic force microscopy analysis and by examining the insertion loss up to 3 GHz. The printed CPW that underwent low-temperature drying after the first printing and high-temperature drying after the second printing before sintering showed improved results in terms of insertion loss, surface microcavities, and surface morphology compared to the CPWs prepared under different drying conditions. In particular, the proposed process led to an improvement in the insertion loss from 0.167 dB to 0.082 dB at 3 GHz. These findings provide valuable insights for improving the reliability and efficiency of printed electronics used in high-frequency applications.
- 30 November 2025
- Published by Korean Institute of Electromagnetic Engineering and Science in Journal of Electromagnetic Engineering and Science
- Vol. 25 (6) , 550-557
Open AccessInvestigation of Insertion Loss in Inkjet-Printed Coplanar Waveguide Based on Drying Temperature
In this study, we propose an optimized inkjet printing process to improve the insertion loss of inkjet-printed coplanar waveguide (CPW) transmission lines. The process involves varying the drying temperature and adjusting the number of printing steps to investigate their effects on the electrical characteristics of the printed CPW. The relationships between surface roughness, surface cavities, morphological changes, and insertion loss are studied by conducting atomic force microscopy analysis and by examining the insertion loss up to 3 GHz. The printed CPW that underwent low-temperature drying after the first printing and high-temperature drying after the second printing before sintering showed improved results in terms of insertion loss, surface microcavities, and surface morphology compared to the CPWs prepared under different drying conditions. In particular, the proposed process led to an improvement in the insertion loss from 0.167 dB to 0.082 dB at 3 GHz. These findings provide valuable insights for improving the reliability and efficiency of printed electronics used in high-frequency applications.
- Open Access
- 21 August 2021
- Published by MDPI AG in Micromachines
- Vol. 12 (8) , 998
Air-Gap Interrogation of Surface Plasmon Resonance in Otto Configuration
In this study, a micromachined chip in Otto configuration with multiple air-gaps (1.86 μm, 2.42 μm, 3.01 μm, 3.43 μm) was fabricated, and the resonance characteristics for each air-gap was measured with a 980 nm laser source. To verify the variability of the reflectance characteristics of the Otto configuration and its applicability to multiple gas detection, the air-gap between the prism and metal film was adjusted by using a commercial piezoactuator. We experimentally verified that the SPR characteristics of the Otto chip configuration have a dependence on the air-gap distance and wavelength of the incident light. When a light source having a wavelength of 977 nm is used, the minimum reflectance becomes 0.22 when the displacement of the piezoactuator is about 9.3 μm.
- 21 August 2021
- Published by MDPI AG in Micromachines
- Vol. 12 (8) , 998
Open AccessAir-Gap Interrogation of Surface Plasmon Resonance in Otto Configuration
In this study, a micromachined chip in Otto configuration with multiple air-gaps (1.86 μm, 2.42 μm, 3.01 μm, 3.43 μm) was fabricated, and the resonance characteristics for each air-gap was measured with a 980 nm laser source. To verify the variability of the reflectance characteristics of the Otto configuration and its applicability to multiple gas detection, the air-gap between the prism and metal film was adjusted by using a commercial piezoactuator. We experimentally verified that the SPR characteristics of the Otto chip configuration have a dependence on the air-gap distance and wavelength of the incident light. When a light source having a wavelength of 977 nm is used, the minimum reflectance becomes 0.22 when the displacement of the piezoactuator is about 9.3 μm.
- 12 April 2021
- Published by Springer Nature in Journal of Electrical Engineering & Technology
- Vol. 16 (4) , 2157-2165
Feature Size Control by Layer-by-Layer Printing and Non-wettable Patterns for Inkjet Printing of Micro Metal Electrode
- 12 April 2021
- Published by Springer Nature in Journal of Electrical Engineering & Technology
- Vol. 16 (4) , 2157-2165
Feature Size Control by Layer-by-Layer Printing and Non-wettable Patterns for Inkjet Printing of Micro Metal Electrode