Hongpeng Jiang
Current Organizations / Institutes
The organizations/institutes from the scholar's latest article
Previous Organizations / Institutes
The organizations / institutes from the scholar's other articles in the past ten years
Hongpeng Jiang has a total of 12 co-authors. Here are the top co-authors by number of shared publications:
- Bin Guo
Key Laboratory of Micro-systems and Micro-structures Manufacturing of Ministry of Education, Harbin Institute of Technology, Harbin 150080, China
2 shared publications - Jie Xu
Harbin Institute of Technology
2 shared publications - Debin Shan
Harbin Institute of Technology
1 shared publication - Debin Shan
Key Laboratory of Micro-systems and Micro-structures Manufacturing of Ministry of Education, Harbin Institute of Technology, Harbin 150080, China
1 shared publication - Guangqiang Yan
State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001, China
1 shared publication - Haibao Lu
Science and Technology on Advanced Composites in Special Environments Laboratory, Harbin Institute of Technology, Harbin, China
1 shared publication
Latest Publications
- Open Access
Achieving Large-Area Hot Embossing of Anti-Icing Functional Microstructures Based on a Multi-Arc Ion-Plating Mold
Aluminum alloy surface microstructures possess functional characteristics such as hydrophilicity/hydrophobicity and anti-icing and have important applications in fields such as aerospace and power systems. In order to improve the filling quality of the microstructure and verify the anti-icing property of the microstructure, this work develops a scheme for achieving large-area hot embossing of anti-icing functional microstructures based on a multi-arc ion-plating mold. Compared with conventional steel, the hardness of the PVD-coated steel increases by 44.7%, the friction coefficient decreases by 66.2%, and the wear resistance is significantly enhanced. The PVD-coated punch-assisted embossing could significantly improve filling properties. While the embossing temperature is 300 °C, the PVD-coated punch-assisted embossing can ensure the complete filling of the micro-array channels. In contrast, under-filling defects occur in conventional hot embossing. Then, a large-area micro-channel specimen of 100 cm2 was precisely formed without warping, and the average surface roughness Ra was better than 0.8 µm. The maximum freezing fraction of the micro-array channel was reduced by about 53.2% compared with the planar, and the complete freezing time was delayed by 193.3%. The main reason is that the air layer trapped by the hydrophobic structures hinders heat loss at the solid–liquid interface.
Open AccessAchieving Large-Area Hot Embossing of Anti-Icing Functional Microstructures Based on a Multi-Arc Ion-Plating Mold
Aluminum alloy surface microstructures possess functional characteristics such as hydrophilicity/hydrophobicity and anti-icing and have important applications in fields such as aerospace and power systems. In order to improve the filling quality of the microstructure and verify the anti-icing property of the microstructure, this work develops a scheme for achieving large-area hot embossing of anti-icing functional microstructures based on a multi-arc ion-plating mold. Compared with conventional steel, the hardness of the PVD-coated steel increases by 44.7%, the friction coefficient decreases by 66.2%, and the wear resistance is significantly enhanced. The PVD-coated punch-assisted embossing could significantly improve filling properties. While the embossing temperature is 300 °C, the PVD-coated punch-assisted embossing can ensure the complete filling of the micro-array channels. In contrast, under-filling defects occur in conventional hot embossing. Then, a large-area micro-channel specimen of 100 cm2 was precisely formed without warping, and the average surface roughness Ra was better than 0.8 µm. The maximum freezing fraction of the micro-array channel was reduced by about 53.2% compared with the planar, and the complete freezing time was delayed by 193.3%. The main reason is that the air layer trapped by the hydrophobic structures hinders heat loss at the solid–liquid interface.
- Open Access
Deformation Behavior and Microstructural Evolution of T-Shape Upsetting Test in Ultrafine-Grained Pure Copper
Ultrafine-grained (UFG) materials can effectively solve the problem of size effects and improve the mechanical properties due to its ultra-high strength. This paper is dedicated to analyzing the deformation behavior and microstructural evolution of UFG pure copper based on T-shape upsetting test. Experimental results demonstrate that: the edge radius and V-groove angle have significant effects on the rib height and aspect ratio λ during T-shape upsetting; while the surface roughness has little effect on the forming load in the first stage, but in the second stage the influence becomes significant. The dynamic recrystallization temperature of UFG pure copper is between 200 °C and 250 °C.
Open AccessDeformation Behavior and Microstructural Evolution of T-Shape Upsetting Test in Ultrafine-Grained Pure Copper
Ultrafine-grained (UFG) materials can effectively solve the problem of size effects and improve the mechanical properties due to its ultra-high strength. This paper is dedicated to analyzing the deformation behavior and microstructural evolution of UFG pure copper based on T-shape upsetting test. Experimental results demonstrate that: the edge radius and V-groove angle have significant effects on the rib height and aspect ratio λ during T-shape upsetting; while the surface roughness has little effect on the forming load in the first stage, but in the second stage the influence becomes significant. The dynamic recrystallization temperature of UFG pure copper is between 200 °C and 250 °C.