Yuanyuan Zhou
Current Organizations / Institutes
The organizations/institutes from the scholar's latest article
Previous Organizations / Institutes
The organizations / institutes from the scholar's other articles in the past ten years
Research Subjects
Yuanyuan Zhou has a total of 18 co-authors. Here are the top co-authors by number of shared publications:
- Li Shi
The University of Texas at Austin
3 shared publications Chunhua Li
Department of Physics, Boston College, Chestnut Hill, Massachusetts 02467, USA
2 shared publicationsAndrei Dolocan
Materials Science and Engineering Program, Texas Materials Institute, The University of Texas at Austin, Austin, Texas 78712, USA
1 shared publicationBing Lv
Department of Physics, The University of Texas at Dallas, Richardson, Texas 75080, USA
1 shared publicationDavid Broido
Department of Physics, Boston College, Chestnut Hill, Massachusetts 02467, USA
1 shared publication- David Broido
Boston College
1 shared publication
Latest Publications
- 3 June 2022
- Published by American Physical Society (APS) in Physical Review Materials
- Vol. 6 (6) , L061601
Peak thermal conductivity measurements of boron arsenide crystals
Recent experiments have validated prior theories of unusual high thermal conductivity in boron arsenide (BAs) and revealed large variation associated with extended and point defects in the samples. The peak provides valuable insights into the competition between intrinsic phonon-phonon scattering processes and extrinsic boundary and defect scattering processes in BAs. However, prior measurement methods have not been able to measure the peak because of fundamental and technical limitations. Here, we report peak measurements of BAs crystals synthesized under different conditions with source materials of different purities via a vapor transport method. For three representative samples, the measured peak appears at temperatures between 120 and 150 K and varies from to . The measured thermal conductivities agree with theoretical calculations across the full temperature range. The similar calculated and measured peak temperatures helps to narrow down the boundary scattering mean free path to be around 4 μm in two samples and 5 μm in another, while the variation of the peak magnitude reveals a one-order-of-magnitude difference in the strength of point defect scattering. The phonon-defect scattering behavior correlates well with the measured electronic Raman scattering background, the impurity concentrations revealed by secondary ion mass spectroscopy, and the Hall concentration and mobility of the -type samples except for an anomalously high hole concentration that appears in one sample, which indicates nonuniform impurity distribution. The observed correlation clarifies the origins of extrinsic phonon scattering mechanisms in BAs crystals.- 3 June 2022
- Published by American Physical Society (APS) in Physical Review Materials
- Vol. 6 (6) , L061601
Peak thermal conductivity measurements of boron arsenide crystals
Recent experiments have validated prior theories of unusual high thermal conductivity in boron arsenide (BAs) and revealed large variation associated with extended and point defects in the samples. The peak provides valuable insights into the competition between intrinsic phonon-phonon scattering processes and extrinsic boundary and defect scattering processes in BAs. However, prior measurement methods have not been able to measure the peak because of fundamental and technical limitations. Here, we report peak measurements of BAs crystals synthesized under different conditions with source materials of different purities via a vapor transport method. For three representative samples, the measured peak appears at temperatures between 120 and 150 K and varies from to . The measured thermal conductivities agree with theoretical calculations across the full temperature range. The similar calculated and measured peak temperatures helps to narrow down the boundary scattering mean free path to be around 4 μm in two samples and 5 μm in another, while the variation of the peak magnitude reveals a one-order-of-magnitude difference in the strength of point defect scattering. The phonon-defect scattering behavior correlates well with the measured electronic Raman scattering background, the impurity concentrations revealed by secondary ion mass spectroscopy, and the Hall concentration and mobility of the -type samples except for an anomalously high hole concentration that appears in one sample, which indicates nonuniform impurity distribution. The observed correlation clarifies the origins of extrinsic phonon scattering mechanisms in BAs crystals.- 1 September 2021
- Published by AIP Publishing in Review of Scientific Instruments
- Vol. 92 (9) , 094901
A differential thin film resistance thermometry method for peak thermal conductivity measurements of high thermal conductivity crystals
High thermal conductivity materials are useful for thermal management applications and fundamental studies of phonon transport. Past measurements of several ultrahigh thermal conductivity materials were not able to obtain the peak thermal conductivity, which is expected to appear at a low temperature and contains insight into the competition between extrinsic phonon-defect and phonon-boundary scattering with intrinsic phonon–phonon processes. Here, we report a peak thermal conductivity measurement method based on differential Wheatstone bridge measurement of the small temperature drop between two thin film resistance thermometers patterned directly on the sample. With the use of a mesoscale silicon bar sample as the calibration standard, this method is able to obtain results that agree with past measurements of large bulk silicon crystals at high temperatures and first-principles calculation results that account for additional phonon-boundary scattering in the sample. The agreement demonstrates the accuracy of this measurement method for peak thermal conductivity measurements of high thermal conductivity materials.
- 1 September 2021
- Published by AIP Publishing in Review of Scientific Instruments
- Vol. 92 (9) , 094901
A differential thin film resistance thermometry method for peak thermal conductivity measurements of high thermal conductivity crystals
High thermal conductivity materials are useful for thermal management applications and fundamental studies of phonon transport. Past measurements of several ultrahigh thermal conductivity materials were not able to obtain the peak thermal conductivity, which is expected to appear at a low temperature and contains insight into the competition between extrinsic phonon-defect and phonon-boundary scattering with intrinsic phonon–phonon processes. Here, we report a peak thermal conductivity measurement method based on differential Wheatstone bridge measurement of the small temperature drop between two thin film resistance thermometers patterned directly on the sample. With the use of a mesoscale silicon bar sample as the calibration standard, this method is able to obtain results that agree with past measurements of large bulk silicon crystals at high temperatures and first-principles calculation results that account for additional phonon-boundary scattering in the sample. The agreement demonstrates the accuracy of this measurement method for peak thermal conductivity measurements of high thermal conductivity materials.
- 1 April 2019
- Published by Elsevier in Cryogenics
- Vol. 99, 25-31
Optimization design of falling film type plate-fin condenser/reboilers by minimizing specific entropy generation rate
- 1 April 2019
- Published by Elsevier in Cryogenics
- Vol. 99, 25-31
Optimization design of falling film type plate-fin condenser/reboilers by minimizing specific entropy generation rate
- Open Access
- 1 January 2013
- Published by Asian Publication Corporation in Asian Journal of Chemistry
- Vol. 25 (5) , 2767-2770
Experimental Study on Injection Molding of Wheat-Straw/High-Density Polyethylene Composites
- 1 January 2013
- Published by Asian Publication Corporation in Asian Journal of Chemistry
- Vol. 25 (5) , 2767-2770
Open AccessExperimental Study on Injection Molding of Wheat-Straw/High-Density Polyethylene Composites