MRMuhammad Asim Rehman-Shaikh

Muhammad Asim Rehman-Shaikh

*This is an algorithmically generated author record based on publicly available information.

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The organizations/institutes from the scholar's latest article


Muhammad Asim Rehman-Shaikh has a total of 2 co-authors. Here are the top co-authors by number of shared publications:


Latest Publications

  • Design Verification Process for Subsea Oil and Gas Products

    by Jawad Arif, Muhammad Asim Rehman-Shaikh, Simos A. Evangelou

    Summary: A crucial step in new product development is the design verification process (DVP), which assures that the conceptual design of new technology is successfully transformed into a prototype product. In this paper, a novel DVP for subsea electrical and electronic prototype products is introduced. The comprehensive DVP ensures that the prototype of the product is designed righteously, is well documented, and is verified according to international practices and standards such as The American Petroleum Institute (API), International Organization for Standardization, European Norm, and European Union specifications. Compliance testing [environmental stresses and electromagnetic compatibility (EMC)] on the product is proposed to achieve Technology Readiness Level 2 (TRL2) of the first article of a printed circuit board (PCB). Concerning the quality of an electronic circuit board, it is recommended in this paper to follow the guidelines and specifications of the Institute of Printed Circuits to certify the robustness of the design. Finally, the proposed DVP is thoroughly exercised on the insulation monitoring PCB under the prescribed test methods as a case study. The experimental results show that the design is robust and the product is suitable for use in the intended subsea environment after further raising the technology maturity level of the product.

  • Open Access

    Comprehensive Technology Qualification Process for Subsea Electronics Assemblies

    by Jawad Arif, Muhammad Asim Rehman-Shaikh, Simos Andreas Evangelou

    Subsea production systems technologies are being developed steadily to address the technological issues associated with the deep-sea environment, primarily pressure and temperature. To ensure the reliable operation of electrical/electronic systems for at least 25-years on the seabed, a comprehensive technology qualification program is proposed in this paper. In relation to this, Technology Readiness Level of the Subsea electrical/electronics assembly is achieved after conducting devised environmental stress tests compliant to the internationally recognized standards, e.g. API, ISO, IEC and IEEE. The comprehensive tests methods of the qualification program are explained to achieve the technology readiness level 3 of the Subsea printed circuit board and sub-assemblies. Finally, experimental test results of a standalone Subsea Ethernet Switch and also functional verification with 100 meters of electrical flying lead undergoing the prescribed test methods show that the Subsea electronics comply with the international standards and is fit for use in the Subsea environment.