Jue Cheng

Amid rapid advances in third‐generation semiconductors and holistic life‐cycle management, thermoset‐based packaging materials are evolving toward high‐temperature resistance, eco‐friendliness, and reprocessability. However, beyond the pursuit of recyclable carbon, thermosets face a fundamental trade‐off between recyclability and high‐temperature reliability, which poses a significant challenge. Herein, we report a thermally activated mechanically constrained adaptive network, in which side‐group transesterification at nanodomain boundaries enables adaptive reorganization without disrupting the connectivity of the network. This reprocessable network (DHBEP/PF/AE), constructed by tetrafunctional epoxy/phenolic/active ester resins with 100% biomass content, achieves a high T _g (181°C) and excellent high‐temperature creep resistance as high as 170°C. Critically, a reprocessable epoxy molding compound is fabricated based on DHBEP/PF/AE, which successfully packages SiC chips via TO‐247 method and passes moisture sensitivity level‐3 test. This work resolves the classic contradiction between recyclability and reliability of dynamic thermosets, providing a solution for the biomass‐based conversion and reuse of vast quantities of semiconductor packaging materials.

Amid rapid advances in third‐generation semiconductors and holistic life‐cycle management, thermoset‐based packaging materials are evolving toward high‐temperature resistance, eco‐friendliness, and reprocessability. However, beyond the pursuit of recyclable carbon, thermosets face a fundamental trade‐off between recyclability and high‐temperature reliability, which poses a significant challenge. Herein, we report a thermally activated mechanically constrained adaptive network, in which side‐group transesterification at nanodomain boundaries enables adaptive reorganization without disrupting the connectivity of the network. This reprocessable network (DHBEP/PF/AE), constructed by tetrafunctional epoxy/phenolic/active ester resins with 100% biomass content, achieves a high T _g (181°C) and excellent high‐temperature creep resistance as high as 170°C. Critically, a reprocessable epoxy molding compound is fabricated based on DHBEP/PF/AE, which successfully packages SiC chips via TO‐247 method and passes moisture sensitivity level‐3 test. This work resolves the classic contradiction between recyclability and reliability of dynamic thermosets, providing a solution for the biomass‐based conversion and reuse of vast quantities of semiconductor packaging materials.

Artificial skins combining sustainable tactile sensing and high‐precision contextual interaction could transform medical devices and robotics yet developing body‐integrated systems that are electrically stable, comfortable, and scalable remain challenging. We develop a heterogeneous Janus e‐skin enabled by gel‐fiber‐mediated interlayer adhesion and co‐design of materials, structure, and architecture. An engineered polyurethane ionogel (PUIL) coupled with an elastic SBS scaffold redistributes mechanical stress. Hydrogen bonding and ion‐dipole interactions immobilize the liquid metal (LM) conductor to form a reconfigurable interface. Consequently, interleaved conductive, strain‐insensitive nanofiber electrodes mitigate LM migration and leakage and exhibit exceptional long‐term electrical stability, withstanding 400% strain with minimal resistance change (R/R ₀ ≈ 1.07). The bonding interlayer and hierarchically porous Janus membrane create a surface‐energy gradient that promotes air permeability and unidirectional moisture transport, thereby improving comfort and cycling durability. Additionally, the Janus fibrous membrane mitigates strain/thermal/moisture‐induced signal distortion, ensuring stable bioelectrical feedback and bolstering the robustness of machine‐learning‐assisted decoding in self‐powered human–machine interactions. Remarkably, the e‐skin exhibits excellent scalable bioinspired multifunctional protection, enabling seamless module integration for electromagnetic shielding and on‐demand thermal management. This work paves the way for next‐generation human–machine interfaces by demonstrating a holistic strategy that achieves wearer comfort, multifunctional integration, and multi‐scenario AI interaction.

Owing to their unique porous structure and ultralow density, silicone aerogels have emerged as a disruptive solution to extreme environmental challenges and lightweight requirements. However, silicone aerogels suffer from severe structural collapse during fabrication and difficulty in control mechanical properties. To address these challenges, we employed a polymer-based siloxane precursor, polymethoxysiloxane (PMOS), and utilized its distinctive structure to successfully synthesize silicone aerogels with intact internal network architecture via a one-step preparation and APD strategy. Simply by adjusting the precursor concentration, we achieved precise modulation of the pore architecture, facilitating the production of silicone aerogels with adjustable mechanical properties ranging from rigid (PMSQ3) to flexibility (PMSQ12). Moreover, PMSQS, obtained through modification with PMSQ12 and trimethylchlorosilane (TMCS), which demonstrated a specific surface area of 1251 m2/g, and excellent thermal stability, with 482 °C of Td5%, 528 °C of Tmax, 17% of residual mass fraction at 800 °C. Otherwise, PMSQS also exhibited a low thermal conductivity of 0.023 W/(m·K) and complete recovery after 60% compressive strain. In addition, a paramagnetic composite silicone aerogel (PMSQFe) was developed by incorporating fumed silica and nano-Fe3O4 based on PMSQ3, which displayed oil-adsorption capacity with magnetic recyclability. This work establishes PMOS as a cost-effective precursor for efficiently prepared silicone aerogels with adjustable rigidity-flexibility, with applicated in thermal insulation, separation and responsive materials.

Conventional thermal energy storage systems employing phase change materials (PCMs) intrinsically lack capabilities for real‐time state monitoring, leading to unpredictable energy storage status and performance deficiencies in meeting the precision thermal requirements of the Internet of Everything. Here, the adaptive electrically conductive and highly energy‐dense PCMs using ultra‐dense bottlebrush networks with metal‐coordinated crosslinking are reported. This topological design achieves a breakthrough latent heat of over 200 J g ⁻¹ based on maximizing entropy variation through boosted phase‐change unit content and minimizing entanglements. By coupling between dissociation and migration of metal ions as well as phase transition‐induced segmental relaxation, adaptive electrical conductivity can be achieved, enabling a transition of PCMs from insulating to conductive along with enthalpy change. The unique PCMs enable real‐time thermal energy storage monitoring and can be processed into thermally regulated photolithographic circuits. These dual breakthroughs in energy density and intrinsic responsiveness render this transformative material suitable for thermal engineering and device regulation.

The construction of perfluoropolyether (PFPE) slippery liquid-infused porous surfaces (SLIPS) on gold coatings is one of the most effective strategies for bestowing anticoagulation and antimicrobial properties on the material. However, the poor chemical affinity between fluorinated porous precursors and gold substrates causes the agglomeration of nanostructures, resulting in uneven nanoporous morphology and accelerating lubricant leakage. Simultaneously, the weak interfacial adhesion between the nanostructures and the substrate may lead to the detachment of nanostructures under blood circulation. Herein, fluorinated gold nanoporous structures exhibiting uniform morphology were tethered on gold coatings via metallic bonding. The vertically aligned dendritic gold frameworks were prepared via in situ chloroauric acid disproportionation, which avoided agglomeration and served as the nanoporous structure. Fluorinated alkyl chains were covalently grafted onto the nanostructures with no considerable influence on morphology. The nanostructures showed no severe damage after 20 min of ultrasonication and 14 days of saline immersion. No significant lubricant leakage was detected after 24 h of in vitro blood circulation. The SLIPS significantly resisted the adhesion of thrombocytes and plasma proteins and suppressed biofilm formation. Histological evaluation showed significantly reduced inflammatory responses and cell infiltration at surgical margins.

Tethering silver nanowires (AgNWs) on optical polymeric membranes is a key strategy for constructing flexible transparent conductive electrodes (FTCEs) to meet flexible electronics demands.