Paul E. Parsons
Research Subjects
Paul E. Parsons has a total of 6 co-authors. Here are the top co-authors by number of shared publications:
- Mark S. Mirotznik
Department of Electrical and Computer Engineering, University of Delaware, Newark, DE 19716, USA
2 shared publications - Zachary J. Larimore
DeLUX Advanced Manufacturing, LLC, Newark, DE, USA
2 shared publications - Aric Lu
Wyss Institute for Biologically Inspired Engineering, Harvard University, Boston, USA
1 shared publication - Austin Good
DeLUX Advanced Manufacturing, LLC, Newark, DE, USA
1 shared publication - John Suarez
Electrical Engineering Department, Widener University, Chester, PA, USA
1 shared publication - Kyle P. McParland
Electrical Engineering Department, University of Delaware, Newark, DE, USA
1 shared publication
Latest Publications
- 9 December 2021
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Packaging and Manufacturing Technology
- Vol. 12 (1) , 168-173
Additive Manufacture of Custom Radiofrequency Connectors
We present the design and characterization of fully additively manufactured (AM) SubMiniature version A (SMA) connectors for use up to 18 GHz. Three-dimensional printed connectors can be directly integrated into the radio-frequency (RF) circuit without post-process bonding and can be fabricated into unusual shapes. The flexibility this affords in the manufacturing process offers significant advantages, especially for applications that need to meet strict size and volume constraints. To that end, we describe modifications to the traditional SMA design that better enable AM fabrication. A variety of different connector geometries were printed and fully characterized both electromagnetically and mechanically. Experimental measurements up to 18 GHz demonstrated good RF performance with low insertion losses (< 0.5 dB). Mechanical testing showed that the printed connectors could withstand up to 4.5 kg of direct force for extended periods of time without damage to the printed threads or other connector parts. Additionally, the printed connectors demonstrated good RF performance after repeated use.
- 9 December 2021
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Packaging and Manufacturing Technology
- Vol. 12 (1) , 168-173
Additive Manufacture of Custom Radiofrequency Connectors
We present the design and characterization of fully additively manufactured (AM) SubMiniature version A (SMA) connectors for use up to 18 GHz. Three-dimensional printed connectors can be directly integrated into the radio-frequency (RF) circuit without post-process bonding and can be fabricated into unusual shapes. The flexibility this affords in the manufacturing process offers significant advantages, especially for applications that need to meet strict size and volume constraints. To that end, we describe modifications to the traditional SMA design that better enable AM fabrication. A variety of different connector geometries were printed and fully characterized both electromagnetically and mechanically. Experimental measurements up to 18 GHz demonstrated good RF performance with low insertion losses (< 0.5 dB). Mechanical testing showed that the printed connectors could withstand up to 4.5 kg of direct force for extended periods of time without damage to the printed threads or other connector parts. Additionally, the printed connectors demonstrated good RF performance after repeated use.
- 27 October 2016
- Published by Institute of Electrical and Electronics Engineers (IEEE)
- p. 819-820
Miniaturization of an additively manufactured microstrip patch antenna using magnetodielectrics
Additive manufacturing (AM) systems are capable of creating complex geometries that are difficult to fabricate using conventional manufacturing methods. While AM techniques are becoming increasingly advanced and accessible to broad set of users, the bottleneck for many electromagnetic applications is the lack of suitable materials. In this presentation we will describe a new magnetodielectric ink developed specifically for microdispensing based AM. Using this new material a miniaturized slotted patch antenna was designed and fabricated using a microdispensing AM platform. Computational and experimental results will be presented.
- 27 October 2016
- Published by Institute of Electrical and Electronics Engineers (IEEE)
- p. 819-820
Miniaturization of an additively manufactured microstrip patch antenna using magnetodielectrics
Additive manufacturing (AM) systems are capable of creating complex geometries that are difficult to fabricate using conventional manufacturing methods. While AM techniques are becoming increasingly advanced and accessible to broad set of users, the bottleneck for many electromagnetic applications is the lack of suitable materials. In this presentation we will describe a new magnetodielectric ink developed specifically for microdispensing based AM. Using this new material a miniaturized slotted patch antenna was designed and fabricated using a microdispensing AM platform. Computational and experimental results will be presented.