Kiran Giri

This paper presents a low-cost adaptive suspension system designed to stabilize a mobile robotic platform operating on uneven terrain. Unlike many existing low-cost servo-based suspension approaches that depend on software-intensive filtering, threshold logic, or extensive tuning, the proposed system adopts a simplified control strategy using hardware-level sensor fusion from the digital motion processor (DMP) of an MPU6050 IMU combined with direct angle-to-actuation mapping. The mechanical design is based on a four-bar linkage suspension architecture actuated by servo motors and controlled using an ESP32 microcontroller, enabling real-time compensation of pitch and roll disturbances. Developed as a proof-of-concept platform with modular 3D-printed components, the system emphasizes accessibility, ease of fabrication, and reduced control complexity. Experimental evaluation under controlled, quasi-static conditions demonstrates effective chassis stabilization with limited angular deviation and consistently lower noise compared to a Kalman filter-based implementation, particularly during post-calibration operation. By balancing mechanical simplicity and additive manufacturing with reliable orientation feedback, the proposed design provides an accessible framework for teaching laboratories, low-budget research, and early-stage adaptive suspension development in resource-constrained environments.

Microfluidics is a multidisciplinary technology with applications in various fields, such as biomedical, energy, chemicals and environment. Thermoplastic is one of the most prominent materials for polymer microfluidics. Properties such as good mechanical rigidity, organic solvent resistivity, acid/base resistivity, and low water absorbance make thermoplastics suitable for various microfluidic applications. However, bonding of thermoplastics has always been challenging because of a wide range of bonding methods and requirements. This review paper summarizes the current bonding processes being practiced for the fabrication of thermoplastic microfluidic devices, and provides a comparison between the different bonding strategies to assist researchers in finding appropriate bonding methods for microfluidic device assembly.