Agnieszka Słodkowska

Copper and copper-based materials have gained increasing attention for the functional modification of implantable medical devices intended for prolonged soft-tissue contact, including vascular stents, catheters, and intrauterine devices. Owing to their broad-spectrum antimicrobial activity, redox reactivity, and involvement in angiogenesis and cellular signaling, copper-based systems offer significant potential for multifunctional surface engineering. However, achieving a balance between antibacterial efficacy, corrosion behavior, controlled ion release, and cytocompatibility remains a critical challenge. This PRISMA-compliant systematic review analyzes copper-containing materials and surface modification strategies for soft-tissue biomedical applications. A structured search of Scopus, Web of Science, and PubMed (2015–2025) identified 65 eligible studies. The review encompasses bulk copper-containing alloys, electrochemical and chemical surface modification techniques, physical vapor deposition approaches, and advanced hybrid systems integrating copper with polymers, hydrogels, or metal−phenolic networks. Across the reviewed literature, antibacterial performance was strongly dependent on copper concentration, microstructural distribution, and spatiotemporal ion release profiles. Moderate, well-controlled copper incorporation frequently improved antibacterial efficacy while maintaining acceptable hemocompatibility and cytocompatibility, particularly in vascular and blood-contacting devices. In contrast, excessive copper loading often accelerated corrosion and induced adverse cellular responses. Emerging multifunctional architectures demonstrated improved regulation of biological interactions, enabling simultaneous antibacterial, antithrombotic, and proendothelial effects. Overall, copper-based surface technologies represent a versatile platform for soft-tissue implant modification. Future translational progress will require precise control of copper release kinetics and comprehensive long-term in vivo validation to ensure safety and sustained therapeutic performance. From the authors’ perspective, the most promising future direction involves multifunctional copper-based hybrid coatings capable of dynamically regulating ion release, host tissue integration, and antibacterial performance simultaneously. Strategies integrating hierarchical architectures, stimulus-responsive release systems, and clinically scalable fabrication methods are expected to play a key role in translating copper-containing surfaces from experimental concepts toward commercially viable soft-tissue biomedical devices.

The efficiency of drug delivery from coatings of metallic implants is one of the key factors. The influence of chemical and thermal treatments of nitinol wire on the corrosion properties, deposition of hydroxyapatite(HA)/poly ε-caprolactone-polyethylene glycol (PEG-b-PCL), and the amount of ibuprofen released from that bilayer were studied. The hydroxyapatite layer was electrodeposited by pulse current, while the PEG-b-PCL layer was by drop-coating. It was shown that nitinol wire, chemically treated and thermally heated at 470 °C under optimized conditions, is the most optimal substrate for the deposition of uniform and compact hybrid HA/(PEG-b-PCL) bilayer. Ibuprofen incorporated into this hybrid bilayer exhibits the maximum release into phosphate-buffered saline (PBS) solution. About 80% of ibuprofen is released within 5 h.

Benzotriazole (BTA) is an important compound that demonstrates the strongest anticorrosion properties of copper and plays a role as a leveler and an additive to the electroplating bath for control of the roughness and corrosion resistance of the electrodeposited copper layer. In this paper, we combined cyclic voltammetry (CV), time-of-flight secondary-ion mass spectrometry (TOF-SIMS), surface enhanced Raman spectroscopy (SERS), and atomic force microscopy (AFM) to study the interaction of BTA with copper surfaces at varied concentrations with and without the presence of chloride ions. We identified the most relevant molecular copper and its complex forms with BTA on the copper electrodeposited layer. BTA is adsorbed and incorporated into the copper surface in monomeric, dimeric, trimeric, tetrameric, and pentameric forms, inhibiting the copper electrodeposition. The addition of chloride ions diminishes the inhibiting properties of BTA. The Cu-BTA-Cl complexes were identified in the forms C₁₂H₈N₆Cu₂Cl⁻ and C₆H₄N₃CuCl⁻. Coadsorption of chloride ions and BTA molecules depends on their concentration and applied potential. Chloride ions are replaced by BTA molecules. BTA and chloride ions, depending on their concentration and applied potential, control the copper nucleation processes at the micro- and nanoscales. We compared the abilities and limitations of TOF-SIMS and SERS for studies of the interactions of benzotriazole with copper and chloride ions at the molecular level.

The interactions of the functional additives SPS (bis-(sodium-sulfopropyl)-disulfide) and polyethylene glycol (PEG) in the presence of chloride ions were studied by time-of-flight secondary-ion mass spectrometry (TOF-SIMS) in combination with cyclic voltammetry measurements (CV). The PEG, thiolate, and chloride surface coverages were estimated and discussed in terms of their electrochemical suppressing/accelerating abilities. The conformational influence of both the gauche/trans thiolate molecules, as well as around C-C and C-O of PEG, on the electrochemical properties were discussed. The contribution of the hydrophobic interaction of -CH₂-CH₂- of PEG with chloride ions was only slightly reduced after the addition of SPS, while the contribution of Cu-PEG adducts diminished strongly. SPS and PEG demonstrated significant synergy by significant co-adsorption. It was shown that the suppressing abilities of PEG that rely on forming stable Cu-PEG adducts, identified in the form C₂H₄O₂Cu⁺ and C₃H₆OCu⁺, were significantly reduced after the addition of SPS. The major role of thiolate molecules adsorbed on a copper surface in reducing the suppressing abilities of PEG rely on the efficient capture of Cu²⁺ ions, diminishing the available copper ions for the ethereal oxygen of PEG.

Interactions of functional additives SPS (bis-(sodium-sulfopropyl)-disulfide), MPS (3-Mercapto-1-Propanesulfonate), and Cl accumulated and incorporated on/into a copper electrodeposited layer were studied using time-of-flight secondary-ion mass spectrometry (TOF-SIMS) in combination with cyclic voltammetry measurements (CV). It was shown that the Cl and MPS surface coverage is dependent on the applied overpotential and concentration of Cl, SPS, or MPS in the solution. Detailed discussion on the mechanism of yielding CH₂SO₃⁻, C₃H₅SO₃⁻, CuSC₃H₆SO₃⁻, and CuS⁻ fragments and their assignment to the gauche or trans conformation was proposed. The mechanism of the process of incorporation and re-adsorption of MPS on/into a copper surface under electrochemical conditions without and with chloride ions and its impact on electrochemical properties was proposed. Moreover, it was shown that the presence of chloride ions, the ratio gauche/trans of MPS molecules, as well as the ratio chloride/thiols demonstrate a high impact on the accelerating abilities. Comparative studies conducted under open circuit potential conditions on the nitinol and copper substrate allowed for the identification of specific reactions/interactions of MPS, or SPS and Cl ions on the nitinol and copper surface.