Pooja Thakkar
Current Organizations / Institutes
The organizations/institutes from the scholar's latest article
Pooja Thakkar has a total of 18 co-authors. Here are the top co-authors by number of shared publications:
- Clement Fleury
Silicon Austria Labs GmbH Sandgasse 34 8010 Graz Austria
2 shared publications - Adrien Piot
Silicon Austria Labs GmbH 1 , Villach 9524
1 shared publication - Andreas Tortschanoff
Silicon Austria Labs GmbH, 9524 Villach, Austria
1 shared publication - Bernhard Jakoby
Institute for Microelectronics and Microsensors, Johannes Kepler University Linz, Linz, Austria
1 shared publication - Cristina Consani
Silicon Austria Labs GmbH, 9524 Villach, Austria
1 shared publication - Dominik Holzmann
Silicon Austria Labs GmbH, Europastrasse 12, 9524 Villach, Austria
1 shared publication
Latest Publications
- Open Access
- 3 April 2024
- Published by MDPI AG in Proceedings
- Vol. 97 (1) , 144
A Comprehensive Characterization Procedure for Resonant MEMS Scanning Mirrors
We demonstrate an experimental assessment of a high-Q, high-angle piezoelectric (2 µm PZT) MEMS scanning micromirror featuring distributed backside reinforcement, suitable for applications demanding energy-efficient and high-quality image projection. Frequency response measurements at 10 different vacuum levels ranging from atmospheric pressure to 10−6 mbar allow for the quantitative separation of damping mechanisms (air and structural). Stroboscopic digital holographic microscopy was used to assess the static and dynamic deformation of the mirror surface. The experimental results are in good agreement with simulations and models.
- 3 April 2024
- Published by MDPI AG in Proceedings
- Vol. 97 (1) , 144
Open AccessA Comprehensive Characterization Procedure for Resonant MEMS Scanning Mirrors
We demonstrate an experimental assessment of a high-Q, high-angle piezoelectric (2 µm PZT) MEMS scanning micromirror featuring distributed backside reinforcement, suitable for applications demanding energy-efficient and high-quality image projection. Frequency response measurements at 10 different vacuum levels ranging from atmospheric pressure to 10−6 mbar allow for the quantitative separation of damping mechanisms (air and structural). Stroboscopic digital holographic microscopy was used to assess the static and dynamic deformation of the mirror surface. The experimental results are in good agreement with simulations and models.
- Open Access
Coupled Strip-Array Waveguides for Integrated Mid-IR Gas Sensing
Non-dispersive infrared (NDIR) absorption spectroscopy is a widespread approach to gas sensing due to its selectivity and conceptual simplicity. One of the main challenges towards the development of fully integrated NDIR sensors is the design and fabrication of microstructures, typically waveguides, that can combine high sensitivity with the ease of integrability of other sensor elements (sources, filters, detectors). Here, we investigate theoretically and experimentally a class of coupled strip-array (CSA) waveguides realized on a SiO2/Si3N4 platform with mass semiconductor fabrication processes. We demonstrate that this class of waveguides shows comparable sensitivity for a wide range of presented geometries, making it a very promising platform for satisfying multiple sensor and fabrication requirements without loss of performance.
Open AccessCoupled Strip-Array Waveguides for Integrated Mid-IR Gas Sensing
Non-dispersive infrared (NDIR) absorption spectroscopy is a widespread approach to gas sensing due to its selectivity and conceptual simplicity. One of the main challenges towards the development of fully integrated NDIR sensors is the design and fabrication of microstructures, typically waveguides, that can combine high sensitivity with the ease of integrability of other sensor elements (sources, filters, detectors). Here, we investigate theoretically and experimentally a class of coupled strip-array (CSA) waveguides realized on a SiO2/Si3N4 platform with mass semiconductor fabrication processes. We demonstrate that this class of waveguides shows comparable sensitivity for a wide range of presented geometries, making it a very promising platform for satisfying multiple sensor and fabrication requirements without loss of performance.