Vladislav Yu. Lisenkov

We examined the feasibility of alumina substrate metallization by magnetron deposition of copper coatings with thickness of several tens µm for its prospective applications in production of ceramic PCBs and packaging. The films were prepared in magnetron sputtering systems with cooled and thermally insulated (hot) targets. Substrates with different geometries were used, including those with through-holes. Thickness, adhesive properties, and electrical resistivity of produced coatings were analyzed. If the film thickness exceeded ~20 µm, we observed its systematic delamination, unless the dedicated Cu_xO_y sub-layer of was introduced between the substrate and the main Cu film. Intermediate copper oxide films were investigated separately by SEM, EDS, and XRD methods, and deposition conditions for predominant growth of favorable tenorite CuO were determined. Prepared composite two-layer CuO + Cu coatings with total thickness of ~100 µm demonstrated good adhesion to alumina substrates in scratch-testing and performed much better than Cu-only films both in soldering and thermal cycling tests. We discuss an approach for constructing a reliable metallizing coating by plasma-assisted PVD methods that could be beneficial for complex-shaped ceramic PCBs and packaging.