CLChengwen Liu

Chengwen Liu

*This is an algorithmically generated author record based on publicly available information.

Current Organizations / Institutes

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Chengwen Liu has a total of 12 co-authors. Here are the top co-authors by number of shared publications:


Latest Publications

  • Open Access

    Effect of Liquid-Solid Volume Ratio and Surface Treatment on Microstructure and Properties of Cu/Al Bimetallic Composite

    by Zhiyuan Wu, Lijie Zuo, Hongliang Zhang, Yiqiang He, Chengwen Liu, Hongmiao Yu, Yuze Wang, Wen Feng

    Due to exceptional conductivity, lightweight nature, corrosion resistance, and various other advantages, Cu/Al bimetallic composites are extensively utilized in the fields of communication, new energy, electronics, and other industries. To solve the problem of poor metallurgical bonding of Cu/Al bimetallic composites caused by high-temperature oxidation of Cu, different coating thicknesses of Ni layer on Cu rods were used to fabricate the Cu/Al bimetallic composite by gravity casting. The effect of liquid–solid volume ratio and coating thickness on microstructure and properties of a Cu/Al bimetallic composite were investigated in this study. The results indicated that the transition zone width increased from 242.3 μm to 286.3 μm and shear strength increased from 17.8 MPa to 30.3 MPa with a liquid–solid volume ratio varying from 8.86 to 50. The thickness of the transition zone and shear strength increased with the coating thickness of the Ni layer varying from 1.5 μm to 3.8 μm, due to the Ni layer effectively preventing oxidation on the surface of the Cu rod and promoting the metallurgical bonding of the Cu/Al interface. The presence of a residual Ni layer in the casted material hinders the diffusion process of the Cu and Al atom. Therefore, the thickness of the transition zone and shear strength exhibited a decreasing trend as the coating thickness of the Ni layer increased from 3.8 μm to 5.9 μm. Shear fracture observation revealed that the initiation and propagation of shear cracks occurred within the transition zone of the Cu/Al bimetallic composite.


  • Open Access

    Effect of Thermal Exposure on Mechanical Properties of Al-Si-Cu-Ni-Mg Aluminum Alloy

    by Fanming Chen, Chengwen Liu, Lijie Zuo, Zhiyuan Wu, Yiqiang He, Kai Dong, Guoqing Li, Weiye He

    The microstructure morphology and evolution of mechanical properties are investigated in this study. The results show that the phases displayed no clear change after thermal exposure at 250 °C for 200 h. The tensile strength of the as-cast alloy showed a downward trend in different degrees with the increase in the tensile temperature, while the influence of elongation was opposite to the tensile strength. In addition, the tensile strength tended to be stable after thermal exposure at 250 °C for 100 h. The main creep mechanism of the as-cast alloy at a low temperature and low stress (T ≤ 250 °C; σ ≤ 40 MPa) is grain-boundary creep. The Monkman–Grant empirical formula was used to fit the relationship between the creep life and the minimum creep rate, and the fitting results are: tr·ε˙min0.95=0.207.