OSO. Schumacher

O. Schumacher

*This is an algorithmically generated author record based on publicly available information.

Current Organizations / Institutes

The organizations/institutes from the scholar's latest article

Research Interests


O. Schumacher has a total of 5 co-authors. Here are the top co-authors by number of shared publications:

  • A. Schramm

    Universität Hamburg Institut für Angewandte Physik und Zentrum für Mikrostrukturforschung Jungiusstrasse 11, D-20355 Hamburg, Germany

    1 shared publication
  • Ch. Heyn

    Universität Hamburg Institut für Angewandte Physik und Zentrum für Mikrostrukturforschung Jungiusstrasse 11, D-20355 Hamburg, Germany

    1 shared publication
  • H. Welsch

    Universität Hamburg Institut für Angewandte Physik und Zentrum für Mikrostrukturforschung Jungiusstrasse 11, D-20355 Hamburg, Germany

    1 shared publication
  • S. Mendach

    Universität Hamburg Institut für Angewandte Physik und Zentrum für Mikrostrukturforschung Jungiusstrasse 11, D-20355 Hamburg, Germany

    1 shared publication
  • W. Hansen

    Universität Hamburg Institut für Angewandte Physik und Zentrum für Mikrostrukturforschung Jungiusstrasse 11, D-20355 Hamburg, Germany

    1 shared publication

Latest Publications

  • Lithographically defined metal-semiconductor-hybrid nanoscrolls

    by O. Schumacher, S. Mendach, H. Welsch, A. Schramm, Ch. Heyn, W. Hansen

    We report on two-layer metal-semiconductor-hybrid scrolls fabricated from rolled-up strained metal∕InGaAs-layers. As the central approach, the metallic layer itself acts as a stressor in contact with the semiconductor. Position and length of the scrolls can be precisely tuned by patterning the e-beam-evaporated metallic stressor with conventional lithographic techniques. The thickness of the metallization determines the radius of the resulting scrolls. This fabrication technique significantly improves the reliability and simplifies the fabrication of metal∕semiconductor three-dimensional objects which employ bending up layers. Even more important, using this technique the bending radius of such three-dimensional objects can easily be downsized to very small radii in the nanometer scale, e.g. in order to build nano-electro-mechanical systems.