Yameng Shan

The MEMS scanning micromirror requires angle sensors to provide real-time angle feedback during operation, ensuring a stable and accurate deflection of the micromirror. This paper proposes a method for integrating piezoresistive sensors on the torsion axis of electrostatic MEMS micromirrors to detect the deflection angle. The design uses a multi-layer bonding process to realize a vertical comb-driven structure. The device structure is designed as a double-layer structure, in which the top layer is the ground layer and integrates with piezoresistive sensor. This approach avoids crosstalk between the applied drive voltage and the piezoresistive sensor. This design also optimizes the sensor’s size, improving sensitivity. A MEMS two-dimensional (2D) scanning micromirror with a 1 mm mirror diameter was designed and fabricated. The test results indicated that, in a vacuum environment, the torsional resonance frequencies of the micromirror’s fast axis and slow axis were 17.68 kHz and 2.225 kHz, respectively. When driving voltages of 33 V and 40 V were applied to the fast axis and slow axis of the micromirror, the corresponding optical scanning angles were 55° and 45°, respectively. The piezoresistive sensor effectively detects the micromirror’s deflection state, and optimizing the sensor’s size achieved a sensitivity of 13.87 mV/V/°. The output voltage of the piezoresistive sensor shows a good linear relationship with the micromirror’s deflection angle, enabling closed-loop feedback control of the electrostatic MEMS micromirror.

We have developed a manufacturing process for micromirrors based on microelectromechanical systems (MEMS) technology. The process involves designing an electrostatic vertically comb-driven actuator and utilizing a self-alignment process to produce a height difference between the movable comb structure and the fixed comb structure of the micromirror. To improve the stability of the micromirror, we propose four instability models in micromirror operation with the quasi-static driving principle and structure of the micromirror considered, which can provide a basic guarantee for the performance of vertical comb actuators. This analysis pinpoints factors leading to instability, including the left and right gap of the movable comb, the torsion beams of the micromirror, and the comb-to-beams distance. Ultimately, the voltages at which device failure occurs can be determined. We successfully fabricated a one-dimensional micromirror featuring a 0.8 mm mirror diameter and a 30 μm device layer thickness. The height difference between the movable and fixed comb structures was 10 μm. The micromirror was able to achieve a static mechanical angle of 2.25° with 60 V@DC. Stable operation was observed at voltages below 60 V, in close agreement with the theoretical calculations and simulations. At the driving voltage of 80 V, we observed the longitudinal displacement movement of the comb fingers. Furthermore, at a voltage of 129 V, comb adhesion occurred, resulting in device failure. This failure voltage corresponds to the lateral torsional failure voltage.

Anode bonding is a widely used method for fabricating devices with suspended structures, and this approach is often combined with deep reactive-ion etching (DRIE) for releasing the device; however, the DRIE process with a glass substrate can potentially cause two critical issues: heat accumulation on the suspended surface and charging effects resulting from the reflection of charged particles from the glass substrate. In particular, for torsional bars with narrow widths, the heat accumulated on the suspended surface may not dissipate efficiently, leading to photoresist burning and, subsequently, resulting in the fracture of the torsional bars; moreover, once etching is finished through the silicon diaphragm, the glass surface becomes charged, and incoming ions are reflected towards the back of the silicon, resulting in the etching of the back surface. To address these issues, we proposed a method of growing silicon oxide on the back of the device layer. By designing, simulating, and fabricating electrostatic torsional micromirrors with common cavity silicon-on-glass (SOG) structures, we successfully validated the feasibility of this approach. This approach ensures effective heat dissipation on the suspended surface, even when the structure is over-etched for an extended period, and enables the complete etching of torsional bars without adverse effects due to the overheating problem; additionally, the oxide layer can block ions from reaching the glass surface, thus avoiding the charging effect commonly observed in SOG structures during DRIE.

Anode bonding is a widely used method for fabricating devices with suspended structures, and this approach is often combined with deep reactive ion etching (DRIE) for releasing the device. However, the DRIE process with a glass substrate can potentially cause two critical issues: heat accumulation on the suspended surface and charging effects resulting from the reflection of charged particles from the glass substrate. In particular, for torsional bars with narrow width, the heat accumulated on the suspended surface may not dissipate efficiently, leading to photoresist burning and subsequently resulting in the fracture of the torsional bars. Moreover, once etching is finished through the silicon diaphragm, the glass surface becomes charged, and incoming ions are reflected towards the back of the silicon, resulting in the etching of the back surface. To address these issues, we proposed a method of growing silicon oxide on the back of the device layer. By designing, simulating, and fabricating electrostatic torsional micromirrors with common cavity silicon-on-glass (SOG) structures, we successfully validated the feasibility of this approach. This approach ensures effective heat dissipation on the suspended surface, even when the structure is over-etched for an extended period, and enables the complete etching of torsional bars without adverse effects due to the overheating problem. Additionally, the oxide layer can block ions from reaching the glass surface, thus avoiding the charging effect commonly observed in SOG structures during DRIE.

The Micro-Electro-Mechanical-System (MEMS) micromirror has shown great advantages in Light Detection and Ranging (LiDAR) for autonomous vehicles. The equipment on vehicles is usually exposed to environmental vibration that may degrade or even destroy the flexure of the micromirror for its delicate structure. In this work, a mechanical low-pass filter (LPF) acting as a vibration isolator for a micromirror is proposed. The research starts with the evaluation of vibration influences on the micromirror by theoretical calculation and simulation. The results illustrate that mechanical load concentrates at the slow flexure of the micromirror as it is excited to resonate in second-order mode (named piston mode) in Z-direction vibration. A specific LPF for the micromirror is designed to attenuate the response to high-frequency vibration, especially around piston mode. The material of the LPF is a beryllium-copper alloy, chosen for its outstanding properties of elasticity, ductility, and fatigue resistance. To measure the mechanical load on the micromirror in practical, the on-chip piezoresistive sensor is utilized and a relevant test setup is built to validate the effect of the LPF. Micromirrors with or without the LPF are both tested under 10 g vibration in the Z-direction. The sensor output of the device with the LPF is 35.9 mV in piston mode, while the device without the LPF is 70.42 mV. The attenuation ratio is 0.51. This result demonstrates that the LPF structure can effectively reduce the stress caused by piston mode vibration.