Margarida Monteiro
Current Organizations / Institutes
The organizations/institutes from the scholar's latest article
Research Subjects
Research Interests
Margarida Monteiro has a total of 13 co-authors. Here are the top co-authors by number of shared publications:
- André Violas
INL – International Iberian Nanotechnology Laboratory Avenida Mestre José Veiga 4715‐330 Braga Portugal
1 shared publication - Antonio J. N. Oliveira
International Iberian Nanotechnology Laboratory, Braga, Portugal
1 shared publication Daniela Tomé
INL – International Iberian Nanotechnology Laboratory Avenida Mestre José Veiga 4715‐330 Braga Portugal
1 shared publication- Francis Leonard Deepak
International Iberian Nanotechnology Laboratory (INL), Avenida Mestre Jose Veiga, Braga 4715-330, Portugal
1 shared publication - Ihsan Çaha
International Iberian Nanotechnology Laboratory (INL), Avenida Mestre Jose Veiga, Braga 4715-330, Portugal
1 shared publication - Jennifer P. Teixeira
INL—International Iberian Nanotechnology Laboratory, Avenida Mestre José Veiga, 4715-330 Braga, Portugal
1 shared publication
Latest Publications
- 20 July 2023
- Published by Wiley in Advanced Functional Materials
- Vol. 33 (44)
Over 100 mV VOC Improvement for Rear Passivated ACIGS Ultra‐Thin Solar Cells
A decentralized energy system requires photovoltaic solutions to meet new aesthetic paradigms, such as lightness, flexibility, and new form factors. Notwithstanding, the materials shortage in the Green Transition is a concern gaining momentum due to their foreseen continuous demand. A fruitful strategy to shrink the absorber thickness, meeting aesthetic and shortage materials consumption targets, arises from interface passivation. However, a deep understanding of passivated systems is required to close the efficiency gap between ultra‐thin and thin film devices, and to mono‐Si. Herein, a (Ag,Cu)(In,Ga)Se2 ultra‐thin solar cell, with 92% passivated rear interface area, is compared with a conventional nonpassivated counterpart. A thin MoSe2 layer, for a quasi‐ohmic contact, is present in the two architectures at the contacts, despite the passivated device narrow line scheme. The devices present striking differences in charge carrier dynamics. Electrical and optoelectronic analysis combined with SCAPS modelling suggest a lower recombination rate for the passivated device, through a reduction on the rear surface recombination velocity and overall defects, comparing with the reference solar cell. The new architecture allows for a 2% efficiency improvement on a 640 nm ultra‐thin device, from 11% to 13%, stemming from an open circuit voltage increase of 108 mV.
- 20 July 2023
- Published by Wiley in Advanced Functional Materials
- Vol. 33 (44)
Over 100 mV VOC Improvement for Rear Passivated ACIGS Ultra‐Thin Solar Cells
A decentralized energy system requires photovoltaic solutions to meet new aesthetic paradigms, such as lightness, flexibility, and new form factors. Notwithstanding, the materials shortage in the Green Transition is a concern gaining momentum due to their foreseen continuous demand. A fruitful strategy to shrink the absorber thickness, meeting aesthetic and shortage materials consumption targets, arises from interface passivation. However, a deep understanding of passivated systems is required to close the efficiency gap between ultra‐thin and thin film devices, and to mono‐Si. Herein, a (Ag,Cu)(In,Ga)Se2 ultra‐thin solar cell, with 92% passivated rear interface area, is compared with a conventional nonpassivated counterpart. A thin MoSe2 layer, for a quasi‐ohmic contact, is present in the two architectures at the contacts, despite the passivated device narrow line scheme. The devices present striking differences in charge carrier dynamics. Electrical and optoelectronic analysis combined with SCAPS modelling suggest a lower recombination rate for the passivated device, through a reduction on the rear surface recombination velocity and overall defects, comparing with the reference solar cell. The new architecture allows for a 2% efficiency improvement on a 640 nm ultra‐thin device, from 11% to 13%, stemming from an open circuit voltage increase of 108 mV.