Guowei Bo
Current Organizations / Institutes
The organizations/institutes from the scholar's latest article
Research Subjects
Guowei Bo has a total of 23 co-authors. Here are the top co-authors by number of shared publications:
Dapeng Jiang
School of Energy and Power Engineering, Changsha University of Science and Technology, Changsha, China
2 shared publicationsJian Chen
School of Energy and Power Engineering, Changsha University of Science and Technology, Changsha, China
2 shared publicationsShunpeng Zhu
School of Energy and Power Engineering, Changsha University of Science and Technology, Changsha, China
2 shared publicationsWei Li
School of Energy and Power Engineering, Changsha University of Science and Technology, Changsha, China
2 shared publicationsAnqi Chen
Changsha Environm Protect Coll, Changsha 410004, Peoples R China
1 shared publicationBin Deng
Hunan Inst Technol, Res Inst Automobile Parts Technol, Hengyang 421002, Peoples R China
1 shared publication
Latest Publications
- 26 August 2026
- Published by Springer Nature in JOM
- Vol. 78 (10) , 9869-9884
Enhanced Creep Resistance and Altered Damage Mechanism in FB2 Steel via Low-Temperature Double Tempering
- 26 August 2026
- Published by Springer Nature in JOM
- Vol. 78 (10) , 9869-9884
Enhanced Creep Resistance and Altered Damage Mechanism in FB2 Steel via Low-Temperature Double Tempering
- 18 October 2024
- Published by Elsevier in Materials Today Communications
- Vol. 41
Improved stress-corrosion-cracking resistance of Mg-3Al-3Ca alloy enabled by coupled addition of Y and Nd
- 18 October 2024
- Published by Elsevier in Materials Today Communications
- Vol. 41
Improved stress-corrosion-cracking resistance of Mg-3Al-3Ca alloy enabled by coupled addition of Y and Nd
- Open Access
Revealing the Influence of SiC Particle Size on the Hot Workability of SiCp/6013 Aluminum Matrix Composites
SiC particle (SiCp) size has been found to significantly influence the hot workability of particle-reinforced aluminum matrix composites (AMC). In this work, therefore, three types of SiCp/6013 composites with different SiCp sizes (0.7, 5 and 15 μm) were prepared and then subjected to isothermal hot compression tests. In addition, constitutive analysis, processing maps and microstructural characterizations were used to reveal the influence of SiCp size on the hot workability of SiCp/6013 composite. The results showed that the values of hot deformation activation energy Q increased with decreasing SiCp size. Specifically, at lower temperatures (e.g., 350 and 400 °C), the highest peak stress was shown in the AMC with SiCp size of 0.7 μm (AMC-0.7), while in the AMC with SiCp size of 5 μm (AMC-5) at higher temperatures (e.g., 450 and 500 °C). This is because a finer SiCp size would lead to stronger dislocation pinning and grain refinement strengthening effects, and such effects would be weakened at higher temperatures. Further, dynamic softening mechanisms were found to transform from dynamic recovery to dynamic recrystallization with increasing SiCp size, and the dynamic recrystallization occurred more easily at higher temperatures and lower strain rates. Consequently, the instability zones of the composites are all mainly located in the deformation region with lower temperature and higher strain rate, and smaller SiCp results in larger instability zones.
Open AccessRevealing the Influence of SiC Particle Size on the Hot Workability of SiCp/6013 Aluminum Matrix Composites
SiC particle (SiCp) size has been found to significantly influence the hot workability of particle-reinforced aluminum matrix composites (AMC). In this work, therefore, three types of SiCp/6013 composites with different SiCp sizes (0.7, 5 and 15 μm) were prepared and then subjected to isothermal hot compression tests. In addition, constitutive analysis, processing maps and microstructural characterizations were used to reveal the influence of SiCp size on the hot workability of SiCp/6013 composite. The results showed that the values of hot deformation activation energy Q increased with decreasing SiCp size. Specifically, at lower temperatures (e.g., 350 and 400 °C), the highest peak stress was shown in the AMC with SiCp size of 0.7 μm (AMC-0.7), while in the AMC with SiCp size of 5 μm (AMC-5) at higher temperatures (e.g., 450 and 500 °C). This is because a finer SiCp size would lead to stronger dislocation pinning and grain refinement strengthening effects, and such effects would be weakened at higher temperatures. Further, dynamic softening mechanisms were found to transform from dynamic recovery to dynamic recrystallization with increasing SiCp size, and the dynamic recrystallization occurred more easily at higher temperatures and lower strain rates. Consequently, the instability zones of the composites are all mainly located in the deformation region with lower temperature and higher strain rate, and smaller SiCp results in larger instability zones.