Jiali Wang
Current Organizations / Institutes
The organizations/institutes from the scholar's latest article
Research Subjects
Research Interests
Jiali Wang has a total of 7 co-authors. Here are the top co-authors by number of shared publications:
- Guangyu Liang
Jilin Provincial Key Laboratory of Micro-Nano and Ultra-Precision Manufacturing, School of Mechatronic Engineering, Changchun University of Technology, Yan’an Ave 2055, Changchun 130012, China
1 shared publication - Huibo Zhao
Jilin Provincial Key Laboratory of Micro-Nano and Ultra-Precision Manufacturing, School of Mechatronic Engineering, Changchun University of Technology, Yan’an Ave 2055, Changchun 130012, China
1 shared publication - Lue Xie
Jilin Provincial Key Laboratory of Micro-Nano and Ultra-Precision Manufacturing, School of Mechatronic Engineering, Changchun University of Technology, Yan’an Ave 2055, Changchun 130012, China
1 shared publication - Yan Gu
Jilin Provincial Key Laboratory of Micro-Nano and Ultra-Precision Manufacturing, School of Mechatronic Engineering, Changchun University of Technology, Yan’an Ave 2055, Changchun 130012, China
1 shared publication - Yinghuan Gao
Jilin Provincial Key Laboratory of Micro-Nano and Ultra-Precision Manufacturing, School of Mechatronic Engineering, Changchun University of Technology, Yan’an Ave 2055, Changchun 130012, China
1 shared publication - Yuan Xi
Jilin Provincial Key Laboratory of Micro-Nano and Ultra-Precision Manufacturing, School of Mechatronic Engineering, Changchun University of Technology, Yan’an Ave 2055, Changchun 130012, China
1 shared publication
Latest Publications
- Open Access
- 9 January 2024
- Published by MDPI AG in Micromachines
- Vol. 15 (1) , 113
Simulation and Experimental Study of Non-Resonant Vibration-Assisted Lapping of SiCp/Al
SiCp/Al is a difficult-to-machine material that makes it easy to produce surface defects during machining, and researchers focus on reducing the surface defects. Vibration-assisted machining technology is considered an effective method to reduce surface defects by changing the trajectory and contact mode of the abrasive. Aiming at the problem of SiCp/Al processing technology, a vibration-assisted lapping device (VLD) is designed, and elliptical motion is synthesized by a set of parallel symmetrical displacement output mechanisms. The working parameters of the device were tested by simulation and experiment, and the lapping performance was verified. Then, the effects of removal characteristics and process parameters on surface roughness and lapping force were analyzed by simulation and experiment. Simulation and experimental results show that frequency and amplitude that are too low or too high are not conducive to the advantages of NVL. The best surface quality was 54 nm, obtained at A = 8 μm and f = 850 Hz.
- 9 January 2024
- Published by MDPI AG in Micromachines
- Vol. 15 (1) , 113
Open AccessSimulation and Experimental Study of Non-Resonant Vibration-Assisted Lapping of SiCp/Al
SiCp/Al is a difficult-to-machine material that makes it easy to produce surface defects during machining, and researchers focus on reducing the surface defects. Vibration-assisted machining technology is considered an effective method to reduce surface defects by changing the trajectory and contact mode of the abrasive. Aiming at the problem of SiCp/Al processing technology, a vibration-assisted lapping device (VLD) is designed, and elliptical motion is synthesized by a set of parallel symmetrical displacement output mechanisms. The working parameters of the device were tested by simulation and experiment, and the lapping performance was verified. Then, the effects of removal characteristics and process parameters on surface roughness and lapping force were analyzed by simulation and experiment. Simulation and experimental results show that frequency and amplitude that are too low or too high are not conducive to the advantages of NVL. The best surface quality was 54 nm, obtained at A = 8 μm and f = 850 Hz.