Hansang Kwon

Hypoeutectic Al-Si-Cu-Mg alloys are promising candidates for use in automobile parts. Therefore, various attempts have been made to develop alternative casting technologies to improve the mechanical properties of cast alloys. In this study, the effects of modification with different levels of strontium (Sr) on primary and eutectic silicon (Si) in hypoeutectic Al-Si-Cu-Mg alloys were investigated. Using a gravity cast process, the Sr-modified samples were prepared from melts with four levels (100, 200, 300, and 400 ppm) of Sr. In addition, the wear properties of the cast samples were studied using a block-on-ring wear-testing machine. The sizes of the primary Si phases increased with increasing Sr content in the alloys. Moreover, more finely dispersed eutectic Si was observed with higher Sr content. In frictional wear tests, the specific wear rates of the test specimens decreased as the Sr content increased from 200 to 400 ppm. Coarse Si phases are considered to act as solid lubricants in the contact region during sliding.

The development of bare metal powder is desirable for obtaining conductive interfaces by low-temperature sintering to be applied in various industries of 3D printing, conductive ink or paste. In our previous study, bulk Al made from Al nanopowder that was prepared with low-oxygen thermal plasma (LO-ITP), which is the original metal powder production technique, showed high electrical conductivity comparable to Al casting material. This study discusses the surface cleaning effect of Al particles expected to be obtained by peeling the surface of Al particles using the LO-ITP method. Bare metal micro-sized powders were prepared using LO-ITP by controlling the power supply rate and preferentially vaporizing the oxidized surface of the Al powder. Electrical conductivity was evaluated to confirm if there was an oxide layer at the Al/Al interface. The Al compact at room temperature produced from LO-ITP-processed Al powder showed an electrical conductivity of 2.9 · 10⁷ S/m, which is comparable to that of cast Al bulk. According to the microstructure observation, especially for the interfaces between bare Al powder, direct contact was achieved at 450 °C sintering. This process temperature is lower than the conventional sintering temperature (550 °C) of commercial Al powder without any surface cleaning. Therefore, surface cleaning using LO-ITP is the key to opening a new gate to the powder metallurgy process.

Al–Cu composites have attracted significant interest recently owing to their lightweight nature and remarkable thermal properties. Understanding the interdiffusion mechanism at the numerous Al/Cu interfaces is crucial to obtain Al–Cu composites with high thermal conductivities. The present study systematically investigates the interdiffusion mechanism at Al/Cu interfaces in relation to the process temperature. Al-50vol.%Cu composite powder, where Cu particles were encapsulated in a matrix of irregular Al particles, was prepared and then sintered at various temperatures from 340 to 500 °C. Intermetallic compounds (ICs) such as CuAl₂ and Cu₉Al₄ were formed at the Al/Cu interfaces during sintering. Microstructural analysis showed that the thickness of the interdiffusion layer, which comprised the CuAl₂ and Cu₉Al₄ ICs, drastically increased above 400 °C. The Vickers hardness of the Al-50vol.%Cu composite sintered at 380 °C was 79 HV, which was 1.5 times that of the value estimated by the rule of mixtures. A high thermal conductivity of 150 W∙m⁻¹∙K⁻¹ was simultaneously obtained. This result suggests that the Al-50vol.%Cu composite material with large number of Al/Cu interfaces, as well as good mechanical strength and heat conductance, can be prepared by solid-state sintering at a low temperature.

The low oxygen powder metallurgy technique makes it possible to prepare full-dense ultrafine-grained (UFG) Al compacts with an average grain size of 160 nm by local surface bonding at a substantially lower temperature of 423 K from an Al nanopowder prepared by a low oxygen induction thermal plasma process. By atomic level analysis using transmission electron microscopy, it was found that there was almost no oxide layer at the Al/Al interfaces (grain boundaries) in UFG Al compact. The electrical conductivity of the UFG Al compact reached 3.5 × 10⁷ S/m, which is the same level as that of the cast Al bulk. The Vickers hardness of the UFG Al compact of 1078 MPa, which is 8 times that of the cast Al bulk, could be explained by the Hall–Petch law. In addition, fracture behavior was analyzed by conducting a small punch test. The as-sintered UFG Al compact initially fractured before reaching its ultimate strength due to its large number of grain boundaries with a high misorientation angle. Ultimate strength and elongation were enhanced to 175 MPa and 24%, respectively, by reduction of grain boundaries after annealing, indicating that high compatibility of strength and elongation can be realized by appropriate microstructure control.

Al–Cu matrix composites with excellent mechanical and thermal properties are among the most promising materials for realising high performance in thermal management systems. However, intermetallic compounds (ICs) formed at the Al/Cu interfaces prevent direct contact between the metals and severely deteriorate the thermal conductivity of the composite. In this study, we systemically investigated the formation behaviour of Al–Cu ICs as a function of compaction pressure at a low temperature of 380 °C. The phases of the Al–Cu ICs formed during sintering were detected via X-ray diffraction, and the layer thickness and average area fraction of each IC at different compaction pressures were analysed via micro-scale observations of the cross-sections of the Al–Cu composites. The ICs were partially formed along the Al/Cu interfaces at high pressures, and the formation region was related to the direction of applied pressure. The Vickers hardness of the Al–Cu composites with ICs was nearly double those calculated using the rule of mixtures. On the other hand, the thermal conductivity of the composites increased with compaction pressure and reached 201 W·m⁻¹·K⁻¹. This study suggests the possibility of employing Al–Cu matrix composites with controlled IC formation in thermal management applications.

Aluminum (Al)/stainless steel (SUS) clad materials were fabricated via the process of spark plasma sintering (SPS) using Al powder/bulk and an SUS sheet. Three Al/SUS clad types were fabricated: powder/bulk (P/B), bulk/bulk (B/B), and bulk/powder/bulk (B/P/B). During the SPS, Al and SUS reacted with each other, and intermetallic compounds were created in the clads. The thermal conductivity and thermal-expansion coefficient were measured using a laser flash analyzer and dynamic mechanical analyzer, respectively. The Al/SUS (P/B) clad had a thermal conductivity of 159.5 W/mK and coefficient of thermal expansion of 15.3 × 10⁻⁶/°C. To analyze the mechanical properties, Vickers hardness and three-point bending tests were conducted. The Al/SUS (P/B) clad had a flexural strength of about 204 MPa. The Al/SUS clads fabricated via SPS in this study are suitable for use in applications in various engineering fields requiring materials with high heat dissipation and high heat resistance.

The effect of sintering process on the microstructure and the mechanical properties of aluminum syntactic foam were investigated in this study. Two different sintering processes of spark plasma sintering and hot pressing were used. Glass hollow spheres with a size of 50–80 μm was used to fabricate the foams having various volume fractions of the spheres in the range of 10–30%. Microstructural analysis revealed that the glass hollow spheres were uniformly distributed in the aluminum matrix, both in the spark plasma sintered and hot pressed ones. As the volume fraction of the spheres increased from 10 to 30%, the density, micro-hardness and compressive strength of the foams were decreased. In comparison to the foams fabricated by hot pressing method, the spark plasma sintered foams had slightly lower density and mechanical strength. In nanoindentation study, it was found that the aluminum matrix in the foam prepared by the spark plasma sintering process had lower strength than foam prepared by the hot pressing process. This is likely because of shorter sintering time used in the spark plasma sintering process than the hot pressing.