SRSajith Rajamohan

Sajith Rajamohan

*This is an algorithmically generated author record based on publicly available information.

Current Organizations / Institutes

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Sajith Rajamohan has a total of 6 co-authors. Here are the top co-authors by number of shared publications:


Latest Publications

  • Next-Generation Advanced MOCVD for Long REBCO Tapes

    by Vishnu Pullanikkat, Manoj Thevalappilly Paulose, Sajith Rajamohan, Robert Schmidt, Sarthak Diwan, Goran Majkic, Venkat Selvamanickam

    REBCO tapes exhibit considerable potential for application in high magnetic field devices such as compact fusion reactors and particle accelerators; next-generation electric machines such as high-efficiency industrial motors and high-power wind turbine generators; and electric aircraft. Our group had previously demonstrated an advanced metal organic chemical vapor deposition (A-MOCVD) method to produce 50-meter-long REBCO tapes with film thickness over 4 µm in a single pass, and a uniform critical current (Ic) over 1,750 A/12 mm at 65 K, 0.25 T. Further, for high magnetic field applications, 40-meter-long tapes have been made by A-MOCVD with an Ic over 4,000 A/12 mm at 4.2 K and 13 T, as well as over 1,400 A/12 mm at 20 K and 20 T. A laminar vapor path design in the A-MOCVD reactor enabled the growth of thick REBCO films with a high precursor-to-film conversion efficiency up to 45% (4x the conversion efficiency of conventional MOCVD of REBCO tapes). Subsequent advancements in the A-MOCVD process enabled simultaneous deposition of REBCO films on both sides of a double-sided buffered substrate, in a single pass. This yielded double-sided, 30-cm-long REBCO tapes with 3.4-µm-thick films on each side, which showed Ic over 530 A/4 mm at 20 K, 20 T. This paper reports our recent work on next-generation A-MOCVD design to scale up double-sided REBCO tapes to long lengths, with superior performance and an increased precursor-to-film conversion efficiency beyond 70%. Tape heating and precursor delivery methods incorporated in the new design aims to facilitate the scale-up of A-MOCVD for multi-track deposition for higher tape throughput.