Honghao Jiang

Thermal camouflage technologies manipulate heat fluxes to conceal objects from thermographic detection, offering potential solutions for thermal management in high-power-density electronics. Most reported approaches are aimed at scenarios where the target is not a heat source; however, any target with a non-zero temperature emits thermal radiation described by the Stefan–Boltzmann law since the thermal radiation of an object is proportional to the fourth power of its temperature (T⁴). To address this issue, this study proposes a thermal camouflage device that considers the influence of radiative thermal transfer from the target. The underlying principle involves maintaining synchronous heat transfer separately along both the device and background surfaces. Numerical simulation confirms the feasibility of this proposed thermal camouflage strategy. Moreover, by altering some parameters related to the target such as geometry, location, temperature, and surface emissivity, excellent performance can be achieved using this device. This work advances thermal management strategies for high-power electronics and infrared-sensitive systems, with applications in infrared stealth, thermal diagnostics, and energy-efficient heat dissipation.

Thermal camouflage technologies manipulate heat fluxes to conceal objects from thermographic detection, offering potential solutions for thermal management in high-power-density electronics. Although most reported approaches are aimed at sce-narios where the target is not a heat source, however, any target with a non-zero tem-perature emits thermal radiation described by the Stefan-Boltzmann law, since the thermal radiation of an object is proportional to the fourth power of its temperature (T4). To address this issue, this study proposes a thermal camouflage device that con-siders the influence of radiative thermal transfer from the target. The underlying prin-ciple involves maintaining synchronous heat transfer separately along both the device and background surfaces. Numerical Simulation confirm the feasibility of this pro-posed thermal camouflage strategy. Moreover, by altering some parameters related to the target such as geometry, location, temperature, and surface emissivity, excellent performance can be achieved using this device. This work advances thermal manage-ment strategies for high-power electronics and infrared-sensitive systems, with appli-cations in infrared stealth, thermal diagnostics, and energy-efficient heat dissipation.